通孔被动元件市场－全球产业规模、份额、趋势、机会和预测，按元件、引脚模式、应用、地区和竞争格局划分，2021-2031年预测

全球通孔被动元件市场规模将从2025年的372.9亿美元成长到2031年的621.3亿美元，复合年增长率为8.88%。通孔被动元件是指电阻器、电容器和电感器等电子元件，其引脚设计用于穿过印刷电路板上的钻孔并焊接以建立连接。

主要市场驱动因素

对高可靠性汽车电子产品和电动车动力总成日益增长的需求，是推动通孔被动元件应用的主要催化剂。随着製造商向电气化转型，对能够承受热循环和高压负载的元件的要求变得至关重要。

主要市场挑战

整个产业向表面贴装技术的快速转型是全球通孔被动元件市场扩张的主要障碍。这项转变的根本驱动力在于对小型化和最佳化印刷电路板元件密度的持续需求。

主要市场趋势

自动化机器人插件和人工智慧驱动製造技术的进步正在从根本上重塑通孔被动元件的生产模式。製造商正越来越多地部署先进的插件机，从而摆脱对人工的依赖，进而消除通孔组装和表面贴装组装之间的成本差异。

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：顾客之声

第五章：全球通孔被动元件市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 依元件分类（电阻器、电容器、电感器、二极体、变送器、感测器及其他）
  • 依导线类型（轴嚮导线和径向导线）
  • 依应用领域（消费性电子、IT及电信、汽车、工业、航太及国防、医疗保健及其他）
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章：北美通孔被动元件市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲通孔被动元件市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区通孔被动元件市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲通孔被动元件市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美通孔被动元件市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章：全球通孔被动元件市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• AVX Corporation
• KEMET Corporation
• Taiyo Yuden Co., Ltd.
• Wurth Elektronik GmbH & Co. KG
• Yageo Corporation
• Samsung Electro-Mechanics Co., Ltd.

第十六章：策略建议

第17章调查会社について・免责事项

The Global Through Hole Passive Components Market will grow from USD 37.29 Billion in 2025 to USD 62.13 Billion by 2031 at a 8.88% CAGR. Through-hole passive components are electronic elements such as resistors, capacitors, and inductors that feature leads designed to be inserted through drilled holes in a printed circuit board and soldered to establish a connection.

Key Market Drivers

The rising demand for high-reliability automotive electronics and EV powertrains acts as a primary catalyst for the adoption of through-hole passive components. As manufacturers transition toward electrification, the requirement for components enduring thermal cycling and high-voltage loads becomes critical. Through-hole resistors and capacitors are integrated into inverters because their leaded architecture provides robust mechanical anchorage against vibrations.

Key Market Challenges

The rapid industry-wide transition toward Surface Mount Technology represents the primary impediment to the expansion of the Global Through Hole Passive Components Market. This shift is fundamentally driven by the relentless demand for miniaturization and the necessity to optimize component density on printed circuit boards. Surface mount counterparts offer superior compatibility with high-speed automated assembly systems, significantly reducing manufacturing costs compared to the manual or semi-automated insertion processes required for through-hole leads.

Key Market Trends

The advancement of automated robotic insertion and AI-driven manufacturing is fundamentally reshaping the production landscape for through-hole passive components. Manufacturers are increasingly deploying advanced insertion machines that eliminate the traditional reliance on manual labor, thereby neutralizing the cost disparities between through-hole and surface mount assembly. This transition is critical for maintaining the viability of leaded resistors and capacitors in mass-production environments where precision and speed are paramount.

Key Market Players

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• AVX Corporation
• KEMET Corporation
• Taiyo Yuden Co., Ltd.
• Wurth Elektronik GmbH & Co. KG
• Yageo Corporation
• Samsung Electro-Mechanics Co., Ltd.

Report Scope:

In this report, the Global Through Hole Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Through Hole Passive Components Market, By Component:

• Resistors
• Capacitors
• Inductors
• Diodes
• Transducers
• Sensors
• and Others

Through Hole Passive Components Market, By Leads Model:

• Axial Leads and Radial Leads

Through Hole Passive Components Market, By Application:

• Consumer Electronics
• IT & Telecommunication
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• and Others

Through Hole Passive Components Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Through Hole Passive Components Market.

Available Customizations:

Global Through Hole Passive Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Through Hole Passive Components Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, and Others)
  • 5.2.2. By Leads Model (Axial Leads and Radial Leads)
  • 5.2.3. By Application (Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Aerospace & Defense, Healthcare, and Others)
  • 5.2.4. By Region
  • 5.2.5. By Company (2025)
• 5.3. Market Map

6. North America Through Hole Passive Components Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Component
  • 6.2.2. By Leads Model
  • 6.2.3. By Application
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Through Hole Passive Components Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Component
      • 6.3.1.2.2. By Leads Model
      • 6.3.1.2.3. By Application
  • 6.3.2. Canada Through Hole Passive Components Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Component
      • 6.3.2.2.2. By Leads Model
      • 6.3.2.2.3. By Application
  • 6.3.3. Mexico Through Hole Passive Components Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Component
      • 6.3.3.2.2. By Leads Model
      • 6.3.3.2.3. By Application

7. Europe Through Hole Passive Components Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Component
  • 7.2.2. By Leads Model
  • 7.2.3. By Application
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Through Hole Passive Components Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Component
      • 7.3.1.2.2. By Leads Model
      • 7.3.1.2.3. By Application
  • 7.3.2. France Through Hole Passive Components Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Component
      • 7.3.2.2.2. By Leads Model
      • 7.3.2.2.3. By Application
  • 7.3.3. United Kingdom Through Hole Passive Components Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Component
      • 7.3.3.2.2. By Leads Model
      • 7.3.3.2.3. By Application
  • 7.3.4. Italy Through Hole Passive Components Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Component
      • 7.3.4.2.2. By Leads Model
      • 7.3.4.2.3. By Application
  • 7.3.5. Spain Through Hole Passive Components Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Component
      • 7.3.5.2.2. By Leads Model
      • 7.3.5.2.3. By Application

8. Asia Pacific Through Hole Passive Components Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Component
  • 8.2.2. By Leads Model
  • 8.2.3. By Application
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Through Hole Passive Components Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Component
      • 8.3.1.2.2. By Leads Model
      • 8.3.1.2.3. By Application
  • 8.3.2. India Through Hole Passive Components Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Component
      • 8.3.2.2.2. By Leads Model
      • 8.3.2.2.3. By Application
  • 8.3.3. Japan Through Hole Passive Components Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Component
      • 8.3.3.2.2. By Leads Model
      • 8.3.3.2.3. By Application
  • 8.3.4. South Korea Through Hole Passive Components Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Component
      • 8.3.4.2.2. By Leads Model
      • 8.3.4.2.3. By Application
  • 8.3.5. Australia Through Hole Passive Components Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Component
      • 8.3.5.2.2. By Leads Model
      • 8.3.5.2.3. By Application

9. Middle East & Africa Through Hole Passive Components Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Component
  • 9.2.2. By Leads Model
  • 9.2.3. By Application
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Through Hole Passive Components Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Component
      • 9.3.1.2.2. By Leads Model
      • 9.3.1.2.3. By Application
  • 9.3.2. UAE Through Hole Passive Components Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Component
      • 9.3.2.2.2. By Leads Model
      • 9.3.2.2.3. By Application
  • 9.3.3. South Africa Through Hole Passive Components Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Component
      • 9.3.3.2.2. By Leads Model
      • 9.3.3.2.3. By Application

10. South America Through Hole Passive Components Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Component
  • 10.2.2. By Leads Model
  • 10.2.3. By Application
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Through Hole Passive Components Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Component
      • 10.3.1.2.2. By Leads Model
      • 10.3.1.2.3. By Application
  • 10.3.2. Colombia Through Hole Passive Components Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Component
      • 10.3.2.2.2. By Leads Model
      • 10.3.2.2.3. By Application
  • 10.3.3. Argentina Through Hole Passive Components Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Component
      • 10.3.3.2.2. By Leads Model
      • 10.3.3.2.3. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Through Hole Passive Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Murata Manufacturing Co., Ltd.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. TDK Corporation
• 15.3. Vishay Intertechnology, Inc.
• 15.4. Panasonic Corporation
• 15.5. AVX Corporation
• 15.6. KEMET Corporation
• 15.7. Taiyo Yuden Co., Ltd.
• 15.8. Wurth Elektronik GmbH & Co. KG
• 15.9. Yageo Corporation
• 15.10. Samsung Electro-Mechanics Co., Ltd.

16. Strategic Recommendations

17. About Us & Disclaimer