乙太网路供电晶片组市场 - 全球产业规模、份额、趋势、机会及预测（按类型、标准、最终用途、设备、地区和竞争格局划分），2021-2031年

全球乙太网路供电 (PoE) 晶片组市场预计将从 2025 年的 27.8 亿美元大幅成长至 2031 年的 55.7 亿美元，复合年增长率为 12.28%。

这些晶片组是积体电路，对于管理乙太网路线缆上资料和电力的同步传输至关重要。推动这一市场成长的主要因素是对经济高效且灵活的网路基础设施日益增长的需求，以支援无线网路基地台和IP摄影机等物联网终端。根据乙太网路联盟2024年的调查，33%的受访者计划在未来一年内部署高功率PoE设备（超过51瓦），这显示高容量供电系统的应用显着增加。这直接推动了对先进晶片组的需求。

然而，市场在专有解决方案和不同设备标准的互通性方面面临重大挑战。相容性问题可能导致电源故障和设备失灵，使网路管理员在考虑基础设施升级时犹豫不决。因此，确保在多样化的硬体生态系统中实现一致的性能仍然是製造商必须克服的关键障碍，才能获得广泛的市场认可。

市场驱动因素

智慧建筑自动化和互联照明网路的普及是推动先进乙太网路供电（PoE）晶片组应用的主要因素。随着商业建筑日益注重集中管理和能源效率，PoE技术正被广泛部署，透过单一乙太网路线为人体感应器、智慧照明系统和暖通空调控制器供电。这种融合无需单独的电气布线，有助于设施管理人员降低资本支出和安装复杂性。智慧家庭与建筑协会（Association for Smarter Homes & Buildings）2025年12月发布的一份报告显示，91%的受访者已经在使用智慧楼宇系统，这凸显了自动化基础设施的广泛集成，而这些基础设施需要先进的晶片组来管理动态功率负载并确保终端之间的无缝通讯。

同时，Wi-Fi 6/7网路基地台和 5G小型基地台的快速部署正在重塑市场格局，因为它们需要更快的资料吞吐量和更高的功率等级。现代无线网路基地台，尤其是支援 Wi-Fi 7 标准的存取点，依赖强大的 PoE++ 解决方案才能在不降低效能的情况下实现最佳运作。根据无线宽频联盟 (Wireless Broadband Alliance) 2025 年 12 月发布的行业报告，19% 的企业高管已经采用了 Wi-Fi 7 标准，这标誌着向依赖高性能晶片的下一代连接技术的快速过渡。此外，爱立信预测到 2025 年 5G 用户数量将达到 29 亿，PoE 在小型基地台回程传输中的应用正在不断扩展，迫使製造商优先考虑符合 IEEE 802.3bt 标准的晶片组，以支援这些高功耗技术。

市场挑战

专有解决方案和不同设备标准之间的互通性挑战仍然是全球乙太网路供电晶片组市场成长的一大障碍。当晶片组未能严格遵循通用通讯协定时，网路管理员将面临设备故障或完全断电的高风险。这种技术上的不一致造成了运作上的不确定性，并使买家对将新终端整合到现有基础设施中犹豫不决。随着生态系统日益复杂，对投资不相容的硬体的担忧成为瓶颈，阻碍了先进供电系统的无缝应用。

市场对此问题的敏感度已在近期的采购趋势中明显反映。乙太网路联盟的一项调查显示，2024年接受调查的PoE专业人士中，96%表示乙太网路联盟的认证会影响他们的采购决策，这表明市场上的大多数人检验未经验证的互通性是一个关键风险。因此，设备相容性方面的普遍不确定性直接限制了新晶片组的潜在市场。相关人员正在推迟采购，以避免不合规基础设施带来的财务和技术影响。

市场趋势

工业IoT领域中营运技术 (OT) 和资讯技术 (IT) 网路的融合正在从根本上改变晶片组的需求。随着工厂从传统的现场汇流排汇流排架构转向以乙太网路为基础的整合基础设施，对能够直接透过数据线为致动器和感测器供电的坚固耐用型 PoE 晶片组的需求激增。这项变更简化了恶劣环境下的布线，并促进了预测性维护所需的无缝资料流。为了支持这项转型，HMS Networks 报告称，到 2024 年 6 月，工厂自动化中 71% 的新增节点将采用工业乙太网，这证实了支援高级供电的标准乙太通讯协定的优越性。

同时，低待机功耗设计和节能架构的进步已成为晶片组设计的关键因素。製造商正积极优化硅架构，以满足严格的环境法规并最大限度地降低功率损耗，尤其是在长时间处于閒置状态的设备中。这种对绿色技术的关注正在推动负责的硅解决方案的生产，从而减少大规模网路部署的碳足迹。例如，意法半导体在其2024年4月发布的《永续发展报告》中指出，其82%的新产品因其低碳特性和高能效而被归类为“负责任的产品”，这反映了整个产业对永续发展表现的重视。

目录

第一章概述

第二章调查方法

第三章执行摘要

第四章：客户评价

第五章 全球乙太网路供电晶片组市场展望

• 市场规模及预测
  • 按金额
• 市占率及预测
  • 按类型（PoE供电设备（PSE）晶片组、PoE受电设备（PD）晶片组）
  • 依标准（802.3af 标准、802.3at 标准、802.3bt 标准）
  • 按用途（商业、工业、住宅）
  • 依装置分类（网路摄影机、VoIP电话、乙太网路切换器和注入器、无线Wi-Fi网路基地台、接近感测器、LED照明）
  • 按地区
  • 按公司（2025 年）
• 市场地图

6. 北美乙太网路供电晶片组市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 我们
  • 加拿大
  • 墨西哥

7. 欧洲乙太网路供电晶片组市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

8. 亚太地区乙太网路供电晶片组市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

9. 中东与非洲乙太网路供电晶片组市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 南非

10. 南美洲乙太网路供电晶片组市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章 市场动态

• 司机
• 任务

第十二章 市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章：全球乙太网路供电晶片组市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的可能性
• 供应商电力
• 顾客权力
• 替代品的威胁

第十五章 竞争格局

• Analog Devices, Inc.
• Cisco Systems Inc.
• Microchip Technology Inc.
• Monolithic Power Systems Inc.
• NXP Semiconductors NV
• On Semiconductor Corporation
• Semtech Corporation
• Silicon Laboratories Inc.
• STMicroelectronics NV
• Texas Instruments Incorporated

第十六章 策略建议

第十七章：关于研究公司及免责声明

The Global Power Over Ethernet Chipsets Market is projected to expand significantly, growing from USD 2.78 Billion in 2025 to USD 5.57 Billion by 2031 at a CAGR of 12.28%. These chipsets are integrated circuits essential for managing the concurrent transmission of data and electrical power through Ethernet cabling. The primary catalyst for this market growth is the increasing demand for cost-effective and flexible network infrastructure to support Internet of Things endpoints, such as wireless access points and IP cameras. According to the Ethernet Alliance, 33 percent of respondents in a 2024 survey intended to deploy high-power PoE devices exceeding 51 watts within the coming year, indicating a measurable rise in the adoption of higher-capacity power delivery systems that directly fuels the demand for advanced chipsets.

However, the market faces a substantial challenge regarding the interoperability of proprietary solutions and varying equipment standards. Incompatibility issues can lead to power delivery failures or device malfunctions, causing network administrators to hesitate when considering infrastructure upgrades. Consequently, ensuring consistent performance across diverse hardware ecosystems remains a significant hurdle that manufacturers must overcome to achieve broad market acceptance.

Market Driver

The proliferation of Smart Building Automation and Connected Lighting Networks acts as a major force driving the adoption of advanced Power over Ethernet chipsets. As commercial facilities focus on centralized control and energy efficiency, PoE technology is increasingly deployed to power occupancy sensors, intelligent lighting systems, and HVAC controllers via a single Ethernet cable. This convergence removes the need for separate electrical wiring, thereby lowering capital expenditures and reducing installation complexity for facility managers. Data from the Association for Smarter Homes & Buildings' December 2025 report reveals that 91% of respondents are already utilizing smart building systems, highlighting a widespread integration of automated infrastructure that necessitates sophisticated chipsets capable of managing dynamic power loads and ensuring seamless endpoint communication.

Simultaneously, the rapid deployment of Wi-Fi 6/7 Access Points and 5G Small Cells is reshaping the market by requiring faster data throughput and higher power levels. Modern wireless access points, especially those supporting the Wi-Fi 7 standard, depend on robust PoE++ solutions to operate optimally without performance loss. According to the Wireless Broadband Alliance's December 2025 industry report, 19% of executives have already deployed the Wi-Fi 7 standard, signaling a swift shift toward next-generation connectivity that relies on high-performance silicon. Furthermore, as Ericsson projects 5G subscriptions to reach 2.9 billion in 2025, the use of PoE for backhauling small cells is expanding, compelling manufacturers to prioritize chipsets compliant with IEEE 802.3bt standards to support these power-intensive technologies.

Market Challenge

The challenge of interoperability among proprietary solutions and different equipment standards remains a critical barrier hindering the growth of the Global Power Over Ethernet Chipsets Market. When chipsets fail to strictly adhere to universal protocols, network administrators face a high risk of device malfunctions or complete power delivery failures. This technical inconsistency creates operational volatility, causing buyers to hesitate before integrating new endpoints into their existing infrastructure. As the ecosystem grows more complex, the fear of investing in incompatible hardware acts as a bottleneck, preventing the seamless deployment of advanced power delivery systems.

The market's sensitivity to this issue is clearly reflected in recent purchasing trends. According to the Ethernet Alliance, 96 percent of PoE professionals surveyed in 2024 indicated that Ethernet Alliance certification would influence their buying decisions, demonstrating that the vast majority of the market considers unverified interoperability a disqualifying risk. Consequently, pervasive uncertainty regarding equipment compatibility directly limits the addressable market for new chipsets, as stakeholders delay procurement to avoid the financial and technical repercussions of non-compliant infrastructure.

Market Trends

The convergence of Operational Technology (OT) and IT networks within the Industrial IoT sector is fundamentally altering chipset requirements. As factories transition from legacy fieldbus architectures to unified Ethernet-based infrastructures, there is a critical need for ruggedized PoE chipsets capable of powering actuators and sensors directly from the data cable. This shift simplifies cabling in harsh environments and facilitates seamless data flow for predictive maintenance. Highlighting this transition, HMS Networks reported in June 2024 that Industrial Ethernet captured 71% of all newly installed nodes in factory automation, confirming the dominance of standard Ethernet protocols that support advanced power delivery.

Concurrently, the advancement of Low-Standby Power Designs and Energy-Efficient architectures has become a decisive factor in chipset engineering. Manufacturers are aggressively optimizing silicon architectures to adhere to strict environmental regulations and minimize power loss, particularly for devices that remain idle for long periods. This focus on green technology is driving the production of responsible silicon solutions that reduce the carbon footprint of large-scale network deployments. For instance, STMicroelectronics noted in its April 2024 Sustainability Report that 82% of its new products were categorized as responsible due to their low-carbon characteristics and power efficiency, reflecting an industry-wide prioritization of sustainable performance.

Key Market Players

• Analog Devices, Inc.
• Cisco Systems Inc.
• Microchip Technology Inc.
• Monolithic Power Systems Inc.
• NXP Semiconductors N.V.
• On Semiconductor Corporation
• Semtech Corporation
• Silicon Laboratories Inc.
• STMicroelectronics N.V.
• Texas Instruments Incorporated

Report Scope

In this report, the Global Power Over Ethernet Chipsets Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Power Over Ethernet Chipsets Market, By Type

• PoE Power Sourcing Equipment (PSE) Chipset
• PoE Powered Devices (PD) Chipset

Power Over Ethernet Chipsets Market, By Standard

• 802.3af standard
• 802.3at standard
• 802.3bt standard

Power Over Ethernet Chipsets Market, By End-use

• Commercial
• Industrial
• Residential

Power Over Ethernet Chipsets Market, By Device

• Network Cameras
• VoIP Phone
• Ethernet Switch & Injector
• Wireless Radio Access Point
• Proximity Sensor
• LED lighting

Power Over Ethernet Chipsets Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Power Over Ethernet Chipsets Market.

Available Customizations:

Global Power Over Ethernet Chipsets Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Power Over Ethernet Chipsets Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (PoE Power Sourcing Equipment (PSE) Chipset, PoE Powered Devices (PD) Chipset)
  • 5.2.2. By Standard (802.3af standard, 802.3at standard, 802.3bt standard)
  • 5.2.3. By End-use (Commercial, Industrial, Residential)
  • 5.2.4. By Device (Network Cameras, VoIP Phone, Ethernet Switch & Injector, Wireless Radio Access Point, Proximity Sensor, LED lighting)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Power Over Ethernet Chipsets Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Standard
  • 6.2.3. By End-use
  • 6.2.4. By Device
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Power Over Ethernet Chipsets Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Standard
      • 6.3.1.2.3. By End-use
      • 6.3.1.2.4. By Device
  • 6.3.2. Canada Power Over Ethernet Chipsets Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Standard
      • 6.3.2.2.3. By End-use
      • 6.3.2.2.4. By Device
  • 6.3.3. Mexico Power Over Ethernet Chipsets Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Standard
      • 6.3.3.2.3. By End-use
      • 6.3.3.2.4. By Device

7. Europe Power Over Ethernet Chipsets Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Standard
  • 7.2.3. By End-use
  • 7.2.4. By Device
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Power Over Ethernet Chipsets Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Standard
      • 7.3.1.2.3. By End-use
      • 7.3.1.2.4. By Device
  • 7.3.2. France Power Over Ethernet Chipsets Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Standard
      • 7.3.2.2.3. By End-use
      • 7.3.2.2.4. By Device
  • 7.3.3. United Kingdom Power Over Ethernet Chipsets Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Standard
      • 7.3.3.2.3. By End-use
      • 7.3.3.2.4. By Device
  • 7.3.4. Italy Power Over Ethernet Chipsets Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Standard
      • 7.3.4.2.3. By End-use
      • 7.3.4.2.4. By Device
  • 7.3.5. Spain Power Over Ethernet Chipsets Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Standard
      • 7.3.5.2.3. By End-use
      • 7.3.5.2.4. By Device

8. Asia Pacific Power Over Ethernet Chipsets Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Standard
  • 8.2.3. By End-use
  • 8.2.4. By Device
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Power Over Ethernet Chipsets Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Standard
      • 8.3.1.2.3. By End-use
      • 8.3.1.2.4. By Device
  • 8.3.2. India Power Over Ethernet Chipsets Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Standard
      • 8.3.2.2.3. By End-use
      • 8.3.2.2.4. By Device
  • 8.3.3. Japan Power Over Ethernet Chipsets Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Standard
      • 8.3.3.2.3. By End-use
      • 8.3.3.2.4. By Device
  • 8.3.4. South Korea Power Over Ethernet Chipsets Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Standard
      • 8.3.4.2.3. By End-use
      • 8.3.4.2.4. By Device
  • 8.3.5. Australia Power Over Ethernet Chipsets Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Standard
      • 8.3.5.2.3. By End-use
      • 8.3.5.2.4. By Device

9. Middle East & Africa Power Over Ethernet Chipsets Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Standard
  • 9.2.3. By End-use
  • 9.2.4. By Device
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Power Over Ethernet Chipsets Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Standard
      • 9.3.1.2.3. By End-use
      • 9.3.1.2.4. By Device
  • 9.3.2. UAE Power Over Ethernet Chipsets Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Standard
      • 9.3.2.2.3. By End-use
      • 9.3.2.2.4. By Device
  • 9.3.3. South Africa Power Over Ethernet Chipsets Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Standard
      • 9.3.3.2.3. By End-use
      • 9.3.3.2.4. By Device

10. South America Power Over Ethernet Chipsets Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Standard
  • 10.2.3. By End-use
  • 10.2.4. By Device
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Power Over Ethernet Chipsets Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Standard
      • 10.3.1.2.3. By End-use
      • 10.3.1.2.4. By Device
  • 10.3.2. Colombia Power Over Ethernet Chipsets Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Standard
      • 10.3.2.2.3. By End-use
      • 10.3.2.2.4. By Device
  • 10.3.3. Argentina Power Over Ethernet Chipsets Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Standard
      • 10.3.3.2.3. By End-use
      • 10.3.3.2.4. By Device

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Power Over Ethernet Chipsets Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Analog Devices, Inc.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Cisco Systems Inc.
• 15.3. Microchip Technology Inc.
• 15.4. Monolithic Power Systems Inc.
• 15.5. NXP Semiconductors N.V.
• 15.6. On Semiconductor Corporation
• 15.7. Semtech Corporation
• 15.8. Silicon Laboratories Inc.
• 15.9. STMicroelectronics N.V.
• 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer