电子黏合剂市场 - 全球产业规模、份额、趋势、机会及预测（按树脂类型、形态、产品类型、终端用户产业、地区和竞争格局划分，2021-2031年）

全球电子黏合剂市场预计将从 2025 年的 52.7 亿美元成长到 2031 年的 82.3 亿美元，复合年增长率为 7.71%。

这些特殊黏合剂旨在电子组件内部形成牢固的结构连接，同时也具备导电性、热调节和环境保护等关键功能。推动这一成长的关键因素包括消费性电子产品的持续小型化、5G基础设施的全球部署以及汽车产业的电气化，所有这些都需要高性能黏合剂来黏合高密度电路。 SEMI报告称，半导体封装材料的全球销售额（高度依赖先进的黏合技术）将在2024年增长4.7%，达到246亿美元，凸显了该行业对这些关键材料的强劲需求。

儘管市场呈现上升趋势，但由于原物料价格波动，尤其是银和环氧树脂的价格波动，市场仍面临许多挑战，这可能导致製造成本难以预测的飙升。此外，严格的挥发性有机化合物（VOCs）环境法规也加剧了这种财务不确定性，迫使製造商投入大量资源进行产品配方调整以符合法规要求。这些要求可能会阻碍市场的快速成长，并增加供应链营运的复杂性。

市场驱动因素

电动车 (EV) 和高级驾驶辅助系统 (ADAS) 的快速普及是电子黏合剂产业的主要驱动力，对具备热控制和结构完整性的材料产生了显着需求。製造商越来越依赖特定的黏合剂配方，以同时黏合电池单元、密封感测器、在恶劣的工作环境下保护电力电子设备并保持电气绝缘。从内燃机到电动动力传动系统的转变从根本上改变了汽车产业的材料使用方式，并对能够承受高电压和热循环的黏合剂解决方案提出了更高的要求。正如国际能源总署 (IEA) 在 2024 年 4 月发布的《2024 年全球电动车展望》中所述，预计 2024 年全球电动车销量将接近 1700 万辆，这预示着汽车电子组件生产的需求将显着增长。

此外，电子设备和元件小型化的趋势正在推动市场发展，製造商正在寻求能够满足高密度电路和异构整合需求的黏合剂。随着设备尺寸越来越小，功能越来越强大，业界需要底部填充胶和导电黏合剂，以便在紧凑型半导体封装中实现精确涂覆和高效散热。根据半导体产业协会 (SIA) 2024 年 11 月的最新报告，全球半导体销售额将在 2024 年 9 月达到 553 亿美元，这反映出市场对需要先进黏合技术的元件的巨大需求。这种行业规模也体现在公司的业绩上，汉高公司报告称，其黏合剂技术部门在 2024 年第三季的销售额达到 28 亿欧元，凸显了黏合剂在现代製造业中持续重要的商业性地位。

市场挑战

全球电子黏合剂市场成长的主要障碍之一是原物料价格波动，尤其是银和环氧树脂等关键原料。由于这些材料是製造高性能导电和结构性黏着剂的必要条件，因此不可预测的成本波动会立即给生产成本带来压力。这种价格波动阻碍了长期定价模式的建立，降低了利润率，使得供应商难以向电子产品製造商提供稳定的价格。因此，这种不确定性正在减缓注重成本、大量生产的製造领域对先进胶合剂解决方案的采用。

导电金属工业需求持续成长与供应持续失衡，进一步加剧了这项经济挑战。根据白银协会预测，2024年全球工业白银需求将成长4%，达到创纪录的6.805亿盎司，将导致市场出现严重的结构性短缺。这种关键原料的明显短缺直接限制了导电黏合剂的生产扩张。由于原物料供应紧张且价格上涨，市场难以在不承担过高成本的情况下满足新兴产业的高需求，阻碍了整体市场扩张。

市场趋势

随着製造商日益转向永续和生物基黏合剂配方，并更加重视环境保护，市场正在经历一场变革。供应商正积极以可再生取代化石基原料，以在维持性能标准的同时减少碳足迹。这项变革的驱动力源自于原始设备製造商 (OEM) 严格的 ESG（环境、社会和治理）目标，这些目标要求更高的透明度和更低的排放。汉高在 2025 年 3 月发布的《2024 年永续发展报告》中指出，与 2017 年的基准相比，其每吨产品的二氧化碳排放减少了 64%，这充分展现了其致力于化学品製造脱碳的坚定决心。

同时，柔性可折迭电子设备中黏合剂的应用催生了对具有优异机械柔软性的材料的需求。与刚性解决方案不同，这些黏合剂必须在承受OLED显示器和可折迭智慧型手机内部反覆弯曲和热应力的同时保持其完整性。这一趋势正在推动对生产可弯曲组件所需基础设施的投资。三星电子在2025年1月发布的「2024财年第四季及全年财务报告」中披露，其在2024年全年对显示器部门的资本投资额已达4.8万亿韩元，凸显了其对开发高性能面板技术的雄厚财力。

目录

第一章概述

第二章调查方法

第三章执行摘要

第四章：客户评价

第五章 全球电子黏合剂市场展望

• 市场规模及预测
  • 按金额
• 市占率及预测
  • 依树脂类型（环氧树脂、硅酮、聚氨酯、丙烯酸树脂等）
  • 依形状（液体、糊状物、固体）
  • 依产品类型（导电黏合剂、导热黏合剂、其他）
  • 依最终用户产业（消费性电子、医疗、工业、运输、航太和国防、其他）划分
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章 北美电子黏合剂市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 我们
  • 加拿大
  • 墨西哥

7. 欧洲电子黏合剂市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

8. 亚太地区电子黏合剂市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

9. 中东和非洲电子黏合剂市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 南非

第十章：南美洲电子黏合剂市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章 市场动态

• 司机
• 任务

第十二章 市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章 全球电子黏合剂市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的可能性
• 供应商电力
• 顾客权力
• 替代品的威胁

第十五章 竞争格局

• Dymax Corporation
• Henkel AG & Co KGaA
• HB Fuller Company
• 3M Company
• Evonik Industries AG
• Dow Corning
• Alent Plc
• BASF SE
• The DOW Chemical Co.
• HB Fuller

第十六章 策略建议

第十七章：关于研究公司及免责声明

The Global Electronic Adhesives Market is projected to expand from USD 5.27 Billion in 2025 to USD 8.23 Billion by 2031, registering a CAGR of 7.71%. These specialized adhesives are engineered to establish robust structural bonds within electronic assemblies while delivering essential capabilities such as electrical conductivity, thermal regulation, and environmental protection. Major factors propelling this growth include the continuous miniaturization of consumer electronics, the worldwide rollout of 5G infrastructure, and the electrification of the automotive industry, all of which demand high-performance bonding for densely packed circuits. SEMI reported that global sales of semiconductor packaging materials, which depend heavily on advanced adhesive technologies, increased by 4.7% to reach USD 24.6 billion in 2024, highlighting the strong industrial need for these critical materials.

Despite this upward trajectory, the market faces a substantial hurdle due to fluctuating raw material prices, specifically for silver and epoxy resins, which can cause unpredictable spikes in manufacturing expenses. This financial uncertainty is frequently exacerbated by strict environmental regulations governing volatile organic compounds, compelling manufacturers to allocate significant resources toward compliant reformulations. These requirements can potentially hinder rapid market growth and add complexity to supply chain operations.

Market Driver

The rapid proliferation of electric vehicles and advanced driver-assistance systems acts as a major driver for the electronic adhesives sector, generating significant demand for materials capable of ensuring thermal control and structural integrity. Manufacturers are increasingly dependent on specific adhesive formulas to bond battery units, seal sensors, and safeguard power electronics against rigorous operating environments while preserving electrical insulation. The transition from internal combustion engines to electrified powertrains necessitates bonding solutions that can endure high voltages and thermal cycling, fundamentally altering material usage within the automotive industry. As noted in the 'Global EV Outlook 2024' by the International Energy Agency in April 2024, global electric car sales were forecast to approach 17 million units in 2024, signaling a substantial increase in production needs for automotive electronic assemblies.

Furthermore, the accelerating trend toward miniaturization in electronic devices and components boosts the market as manufacturers look for adhesives compatible with dense circuitry and heterogeneous integration. With devices becoming smaller yet more potent, the industry requires underfills and conductive adhesives that allow for precise application and efficient heat dissipation in compact semiconductor packaging. The Semiconductor Industry Association reported in its November 2024 update that global semiconductor sales reached USD 55.3 billion in September 2024, reflecting the massive volume of components needing advanced bonding technologies. This industrial scale is mirrored in corporate results, with Henkel reporting that its Adhesive Technologies unit generated sales of 2.8 billion Euros in the third quarter of 2024, emphasizing the enduring commercial importance of bonding agents in contemporary manufacturing.

Market Challenge

The main obstacle hindering the growth of the Global Electronic Adhesives Market is the price instability of raw materials, particularly critical inputs such as silver and epoxy resins. Since these materials are essential for manufacturing high-performance conductive and structural adhesives, unpredictable cost fluctuations place immediate strain on production overheads. This financial volatility interferes with long-term pricing models and reduces profit margins, making it challenging for suppliers to offer consistent pricing to electronics manufacturers. As a result, this uncertainty retards the uptake of advanced bonding solutions within cost-conscious mass production sectors.

This economic difficulty is compounded by a continuing disparity between the intense industrial demand for conductive metals and their available supply. According to the Silver Institute, global industrial demand for silver increased by 4 percent in 2024 to a record 680.5 million ounces, leading to a notable structural deficit in the market. Such a clear shortage of a primary raw material directly limits the scalability of conductive adhesive production. As raw material supplies tighten and prices rise, the market finds it difficult to satisfy the high-volume demands of emerging industries without facing prohibitive costs, which subsequently impedes overall market expansion.

Market Trends

The shift toward sustainable and bio-based adhesive formulations is transforming the market as manufacturers place a higher priority on environmental stewardship. Suppliers are actively substituting fossil-based ingredients with renewable alternatives to decrease carbon footprints while maintaining performance standards. This evolution is propelled by strict ESG goals from OEMs that require greater transparency and lower emissions. In its March 2025 'Sustainability Report 2024', Henkel announced it had reduced CO2 emissions in production per ton of product by 64 percent compared to the 2017 baseline, demonstrating a strong commitment to decarbonizing chemical manufacturing.

Concurrently, the incorporation of adhesives into flexible and foldable electronic devices is generating a need for materials that possess superior mechanical flexibility. In contrast to rigid solutions, these adhesives are required to endure repeated bending and thermal stress while preserving their integrity within OLED displays and foldable smartphones. This trend is spurring investment in the infrastructure needed to produce bendable components. Samsung Electronics revealed in its 'Fourth Quarter and FY 2024 Results' report from January 2025 that the company invested KRW 4.8 trillion in capital expenditures for its Display division throughout 2024, highlighting the financial dedication to progressing high-performance panel technologies.

Key Market Players

• Dymax Corporation
• Henkel AG & Co KGaA
• H.B. Fuller Company
• 3M Company
• Evonik Industries AG
• Dow Corning
• Alent Plc
• BASF SE
• The DOW Chemical Co.
• H.B. Fuller

Report Scope

In this report, the Global Electronic Adhesives Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Electronic Adhesives Market, By Resin Type

• Epoxy
• Silicone
• Polyurethane
• Acrylic
• Others

Electronic Adhesives Market, By Form

• Liquid
• Paste
• Solid

Electronic Adhesives Market, By Product Type

• Electrically Conductive Adhesives
• Thermally Conductive Adhesives
• Others

Electronic Adhesives Market, By End User Industry

• Consumer Electronics
• Medical
• Industrial
• Transportation
• Aerospace & Defense
• Others

Electronic Adhesives Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Electronic Adhesives Market.

Available Customizations:

Global Electronic Adhesives Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Electronic Adhesives Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others)
  • 5.2.2. By Form (Liquid, Paste, Solid)
  • 5.2.3. By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others)
  • 5.2.4. By End User Industry (Consumer Electronics, Medical, Industrial, Transportation, Aerospace & Defense, Others)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Electronic Adhesives Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Resin Type
  • 6.2.2. By Form
  • 6.2.3. By Product Type
  • 6.2.4. By End User Industry
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Electronic Adhesives Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Resin Type
      • 6.3.1.2.2. By Form
      • 6.3.1.2.3. By Product Type
      • 6.3.1.2.4. By End User Industry
  • 6.3.2. Canada Electronic Adhesives Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Resin Type
      • 6.3.2.2.2. By Form
      • 6.3.2.2.3. By Product Type
      • 6.3.2.2.4. By End User Industry
  • 6.3.3. Mexico Electronic Adhesives Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Resin Type
      • 6.3.3.2.2. By Form
      • 6.3.3.2.3. By Product Type
      • 6.3.3.2.4. By End User Industry

7. Europe Electronic Adhesives Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Resin Type
  • 7.2.2. By Form
  • 7.2.3. By Product Type
  • 7.2.4. By End User Industry
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Electronic Adhesives Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Resin Type
      • 7.3.1.2.2. By Form
      • 7.3.1.2.3. By Product Type
      • 7.3.1.2.4. By End User Industry
  • 7.3.2. France Electronic Adhesives Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Resin Type
      • 7.3.2.2.2. By Form
      • 7.3.2.2.3. By Product Type
      • 7.3.2.2.4. By End User Industry
  • 7.3.3. United Kingdom Electronic Adhesives Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Resin Type
      • 7.3.3.2.2. By Form
      • 7.3.3.2.3. By Product Type
      • 7.3.3.2.4. By End User Industry
  • 7.3.4. Italy Electronic Adhesives Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Resin Type
      • 7.3.4.2.2. By Form
      • 7.3.4.2.3. By Product Type
      • 7.3.4.2.4. By End User Industry
  • 7.3.5. Spain Electronic Adhesives Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Resin Type
      • 7.3.5.2.2. By Form
      • 7.3.5.2.3. By Product Type
      • 7.3.5.2.4. By End User Industry

8. Asia Pacific Electronic Adhesives Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Resin Type
  • 8.2.2. By Form
  • 8.2.3. By Product Type
  • 8.2.4. By End User Industry
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Electronic Adhesives Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Resin Type
      • 8.3.1.2.2. By Form
      • 8.3.1.2.3. By Product Type
      • 8.3.1.2.4. By End User Industry
  • 8.3.2. India Electronic Adhesives Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Resin Type
      • 8.3.2.2.2. By Form
      • 8.3.2.2.3. By Product Type
      • 8.3.2.2.4. By End User Industry
  • 8.3.3. Japan Electronic Adhesives Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Resin Type
      • 8.3.3.2.2. By Form
      • 8.3.3.2.3. By Product Type
      • 8.3.3.2.4. By End User Industry
  • 8.3.4. South Korea Electronic Adhesives Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Resin Type
      • 8.3.4.2.2. By Form
      • 8.3.4.2.3. By Product Type
      • 8.3.4.2.4. By End User Industry
  • 8.3.5. Australia Electronic Adhesives Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Resin Type
      • 8.3.5.2.2. By Form
      • 8.3.5.2.3. By Product Type
      • 8.3.5.2.4. By End User Industry

9. Middle East & Africa Electronic Adhesives Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Resin Type
  • 9.2.2. By Form
  • 9.2.3. By Product Type
  • 9.2.4. By End User Industry
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Electronic Adhesives Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Resin Type
      • 9.3.1.2.2. By Form
      • 9.3.1.2.3. By Product Type
      • 9.3.1.2.4. By End User Industry
  • 9.3.2. UAE Electronic Adhesives Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Resin Type
      • 9.3.2.2.2. By Form
      • 9.3.2.2.3. By Product Type
      • 9.3.2.2.4. By End User Industry
  • 9.3.3. South Africa Electronic Adhesives Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Resin Type
      • 9.3.3.2.2. By Form
      • 9.3.3.2.3. By Product Type
      • 9.3.3.2.4. By End User Industry

10. South America Electronic Adhesives Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Resin Type
  • 10.2.2. By Form
  • 10.2.3. By Product Type
  • 10.2.4. By End User Industry
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Electronic Adhesives Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Resin Type
      • 10.3.1.2.2. By Form
      • 10.3.1.2.3. By Product Type
      • 10.3.1.2.4. By End User Industry
  • 10.3.2. Colombia Electronic Adhesives Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Resin Type
      • 10.3.2.2.2. By Form
      • 10.3.2.2.3. By Product Type
      • 10.3.2.2.4. By End User Industry
  • 10.3.3. Argentina Electronic Adhesives Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Resin Type
      • 10.3.3.2.2. By Form
      • 10.3.3.2.3. By Product Type
      • 10.3.3.2.4. By End User Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Electronic Adhesives Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Dymax Corporation
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Henkel AG & Co KGaA
• 15.3. H.B. Fuller Company
• 15.4. 3M Company
• 15.5. Evonik Industries AG
• 15.6. Dow Corning
• 15.7. Alent Plc
• 15.8. BASF SE
• 15.9. The DOW Chemical Co.
• 15.10. H.B. Fuller

16. Strategic Recommendations

17. About Us & Disclaimer