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市场调查报告书
商品编码
1943648
乙太网路PHY晶片市场-全球产业规模、份额、趋势、机会及预测(依数据速率、应用、地区及竞争格局划分,2021-2031年)Ethernet PHY Chip Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Data Rate, By Application, By Region & Competition, 2021-2031F |
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全球乙太网路 PHY 晶片市场预计将从 2025 年的 113.3 亿美元成长到 2031 年的 190.2 亿美元,复合年增长率达到 9.02%。
该市场主要由实体层收发器组成,它们是数位媒体存取控制层和类比传输介质之间的关键桥樑。主要成长要素包括超大规模资料中心对高频宽连线的需求呈指数级增长,以支援人工智慧工作负载,以及先进的车载网路系统日益普及。乙太网路联盟2024年的调查显示,80%的受访者愿意为经过认证的乙太网路供电(PoE)设备支付至少5%的溢价,凸显了可靠性和互通性在商业性上的重要性,也体现了市场对品质的重视。
| 市场概览 | |
|---|---|
| 预测期 | 2027-2031 |
| 市场规模:2025年 | 113.3亿美元 |
| 市场规模:2031年 | 190.2亿美元 |
| 复合年增长率:2026-2031年 | 9.02% |
| 成长最快的细分市场 | 企业网路 |
| 最大的市场 | 北美洲 |
然而,随着传输速度加速迈向 800G 和 1.6T,与电源效率和温度控管相关的技术复杂性日益增加,这成为限制市场成长的主要障碍。晶片设计需要更高的密度才能在高频率下保持讯号完整性,导致製造成本和功耗增加,从而严重阻碍了成本效益的实现。这些因素严重限制了各种工业和企业应用的广泛采用,减缓了能源预算和成本结构至关重要的先进解决方案的普及。
超大规模资料中心和人工智慧驱动的云端运算的快速扩张是市场的主要驱动力,对先进的实体层架构提出了更高的要求,以管理生成式人工智慧任务所需的大量频宽。随着超大规模资料中心业者为其GPU丛集建立专用后端网络,高效能乙太网路晶片对于降低延迟和最佳化吞吐量至关重要。这种大规模的基础设施投资也体现在主要供应商的财务表现中,他们正日益专注于高速架构。例如,博通在2024年12月的财报中宣布,人工智慧网路业务营收年增158%,占其网路业务总收入的76%。这凸显了市场对能够支援向800G及更高速度过渡的晶片日益增长的需求。
同时,智慧製造领域向工业乙太网的快速转型正在推动市场发展,尤其是在严苛环境下,市场需求日益增长。製造商正积极从传统的串行现场汇流排系统迁移到标准以太网,以支援工业物联网 (IIoT) 和整合式 IT/OT 网络,并将确定性和可靠性作为首要考虑因素。 HMS Networks 在 2025 年 5 月的分析报告中量化了这一趋势,指出工业乙太网将占新建工厂自动化节点的 76%。此外,Arista Networks 在 2025 年 2 月发布的报告显示,其 2024 财年的年收入将达到 70 亿美元,这表明企业和工业领域对乙太网路连接的全球支出强劲。
电源效率与散热管理日益复杂的技术挑战,是全球乙太网路PHY晶片市场面临的重大障碍。随着产业标竿向800G和1.6T传输速度迈进,实体层收发器需要越来越密集的电路来确保讯号完整性。这些高密度设计会产生大量热量,需要复杂且高成本的封装或散热解决方案。因此,不断上涨的製造成本和能源需求,使得这些先进晶片的广泛应用变得不那么经济,尤其是在能源预算受到严格控制的成本约束的工业和企业领域。
这种散热挑战与现代网路所需的巨大吞吐量密切相关。 2024年,IEEE标准协会发布了最新的频宽评估报告,预测到2025年,网路流量将比2017年增加55.4倍。数据流量的指数级增长迫使开发人员不断突破晶片性能的极限,导致装置能耗不成比例地增加。因此,资料中心营运商面临着如何在满足高频宽需求和实际功耗限制之间取得平衡的巨大挑战,这直接阻碍了下一代乙太网路PHY的商业性化应用。
汽车电子领域向以乙太网路为基础的区域架构转型,透过将各个功能集中在高频宽运算区域,重塑了车载网路。这种结构性变革显着降低了线束的重量和复杂性,同时提供了软体定义汽车 (SDV) 所必需的可扩展资料骨干网,并促使各大半导体公司透过策略性收购来强化其产品线。例如,英飞凌科技股份公司于 2025 年 8 月以 25 亿美元完成了对 Marvell Technologies 汽车乙太网路部门的收购,旨在扩展系统功能,以实现安全且可扩展的区域控制架构。
同时,随着越来越多的企业对其园区网路进行现代化改造,以支援Wi-Fi 7网路基地台和城域网路连接,多Gigabit(2.5G/5G/10G)NBASE-T标准的采用正在重振企业和营运商基础设施市场。与超大规模需求不同,这种復苏的重点在于利用高速铜缆和光纤实体层(PHY)升级传统的企业和服务供应商环境,以解决频宽。为了佐证这一强劲的市场復苏,Marvell Technology在2025年8月发布的2026财年第二季财报中指出,其企业和营运商基础设施部门的总合收入同比增长43%,证实了数据中心以外的连接投资正在復苏。
The Global Ethernet PHY Chip Market is projected to expand from USD 11.33 Billion in 2025 to USD 19.02 Billion by 2031, achieving a Compound Annual Growth Rate (CAGR) of 9.02%. This market consists of physical layer transceivers that act as the essential bridge between the digital Media Access Control layer and the analog transmission medium. Key growth factors include the surging requirements for high-bandwidth connectivity within hyperscale data centers to accommodate artificial intelligence workloads, alongside the rising incorporation of sophisticated in-vehicle networking systems. Highlighting the market's focus on quality, the Ethernet Alliance reported in a 2024 survey that 80 percent of respondents expressed a willingness to pay a premium of at least five percent for certified Power over Ethernet devices, emphasizing the commercial importance of reliability and interoperability.
| Market Overview | |
|---|---|
| Forecast Period | 2027-2031 |
| Market Size 2025 | USD 11.33 Billion |
| Market Size 2031 | USD 19.02 Billion |
| CAGR 2026-2031 | 9.02% |
| Fastest Growing Segment | Enterprise Networking |
| Largest Market | North America |
Conversely, a major obstacle limiting market growth is the increasing technical complexity associated with power efficiency and thermal management as transmission speeds accelerate toward 800G and 1.6T. As chip designs demand higher density to maintain signal integrity at these elevated frequencies, the consequent rise in manufacturing expenses and power usage creates significant hurdles for cost-efficient implementation. These factors present substantial barriers to widespread adoption across various industrial and enterprise applications, slowing the deployment of advanced solutions where energy budgets and cost structures are critical considerations.
Market Driver
The rapid expansion of hyperscale data centers and AI-driven cloud computing acts as the primary market propellant, demanding sophisticated PHY architectures to manage the immense bandwidths required by generative AI tasks. As hyperscalers build specialized back-end networks for GPU clusters, the dependence on high-performance Ethernet silicon has grown critical for reducing latency and optimizing throughput. This massive infrastructure investment is reflected in the financial results of major suppliers shifting focus to high-speed architectures; for instance, Broadcom Inc. reported in its December 2024 financial results that AI networking revenue surged by 158 percent year-over-year, comprising 76 percent of its networking segment, which confirms the intense demand for chips supporting the shift to 800G and beyond.
Concurrently, the swift move toward Industrial Ethernet within smart manufacturing is boosting the market by generating volume in harsh-environment settings. Manufacturers are actively upgrading from legacy serial fieldbus systems to standard Ethernet to support the Industrial Internet of Things (IIoT) and merged IT/OT networks, prioritizing determinism and reliability. This trend is quantified by HMS Networks' May 2025 analysis, which noted that Industrial Ethernet now commands 76 percent of new factory automation nodes. Furthermore, Arista Networks, Inc. reported an annual revenue of $7 billion for fiscal year 2024 in February 2025, demonstrating the strong global spending on Ethernet connectivity across both enterprise and industrial domains.
Market Challenge
The increasing technical complexity of managing power efficiency and thermal dissipation represents a major hurdle for the Global Ethernet PHY Chip Market. As industry benchmarks push toward transmission speeds of 800G and 1.6T, physical layer transceivers demand increasingly dense circuit configurations to ensure signal integrity. These high-density designs produce substantial heat, requiring sophisticated and costly packaging or cooling solutions. Consequently, the escalating manufacturing expenses and energy demands reduce the economic viability of these advanced chips for broad deployment, particularly within cost-constrained industrial and enterprise sectors where energy budgets are tightly controlled.
This thermal challenge is intrinsically linked to the massive throughput capacity required by contemporary networks. In 2024, the IEEE Standards Association released an updated bandwidth assessment projecting that traffic volumes by 2025 would swell to 55.4 times the levels seen in 2017. This exponential rise in data traffic compels developers to stretch silicon performance boundaries, leading to devices with disproportionate energy consumption. As a result, data center operators encounter significant difficulties in reconciling the demand for higher bandwidth with the practical constraints of power usage, which directly impedes the commercial adoption rate of next-generation Ethernet PHYs.
Market Trends
The shift toward Ethernet-based zonal architectures in automotive electronics is reshaping in-vehicle networking by centralizing domain functions into high-bandwidth computing zones. This structural transformation notably decreases the weight and complexity of wiring harnesses while providing the scalable data backbones essential for Software-Defined Vehicles (SDVs), spurring major semiconductor firms to enhance their offerings through strategic acquisitions. Exemplifying this consolidation trend, Infineon Technologies AG finalized the acquisition of Marvell Technology's automotive Ethernet division for $2.5 billion in August 2025, a move aimed at broadening its system capabilities for secure and scalable zonal control architectures.
Simultaneously, the uptake of Multi-Gigabit (2.5G/5G/10G) NBASE-T standards is invigorating the enterprise and carrier infrastructure markets as organizations modernize campus networks to accommodate Wi-Fi 7 access points and metro connectivity. This resurgence differs from hyperscale drivers by focusing on upgrading conventional corporate and service provider environments with faster copper and optical PHYs to remove bandwidth constraints. Evidencing this strong market recovery, Marvell Technology, Inc. reported in its 'Second Quarter of Fiscal Year 2026 Financial Results' in August 2025 that revenue from its enterprise networking and carrier infrastructure segments collectively rose by 43 percent year-over-year, confirming renewed investment in non-data center connectivity.
Report Scope
In this report, the Global Ethernet PHY Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Company Profiles: Detailed analysis of the major companies present in the Global Ethernet PHY Chip Market.
Global Ethernet PHY Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report: