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市场调查报告书
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汽车PCB市场－全球产业规模、份额、趋势、机会及预测（依车辆类型、动力类型、地区及竞争格局划分，2021-2031年）

Automotive PCB Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Vehicle Type (Passenger Car and Commercial Vehicle), By Propulsion Type (IC Engine and Electric), By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3个工作天内

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简介目录

全球汽车印刷电路基板(PCB) 市场预计将从 2025 年的 105.9 亿美元成长到 2031 年的 157.2 亿美元，复合年增长率达到 6.81%。

汽车印刷电路基板(PCB) 是电子元件的关键机械基础和电气互连部件，广泛应用于从高级资讯娱乐系统和安全功能到引擎控制单元等各种系统。汽车产业向电气化的快速转型是推动这一成长的主要动力，也因此产生了对耐热、高功率基板的特定需求，以满足电池管理系统和电动车动力传动系统的需求。此外，自动驾驶技术和高级驾驶辅助系统 (ADAS) 的兴起也推动了对能够处理复杂运算需求的柔性、高密度互连 PCB 的需求。

市场概览
预测期 2027-2031
市场规模：2025年 105.9亿美元
市场规模：2031年 157.2亿美元
复合年增长率：2026-2031年 6.81%
成长最快的细分市场 内燃机
最大的市场 亚太地区

根据台湾印刷基板协会预测，到2024年，汽车产业将占中国当地印刷电路基板（PCB）应用市场约26.9%的份额，凸显了该领域在全球最大电子产品生产基地中的重要地位。儘管需求强劲，市场仍面临原材料短缺和供应链不稳定的严峻挑战，尤其是高性能层压板和铜材。这些中断，加上地缘政治紧张局势的加剧，可能导致前置作业时间週期延长和生产成本上升，从而阻碍现代汽车组装所需关键部件的及时交付。

市场驱动因素

全球汽车电气化进程的加速是市场扩张的主要驱动力，从根本上改变了印刷电路基板(PCB) 的规格要求。随着产业从内燃机转型为电动动力传动系统，对耐用、高压 PCB 的需求日益增长，以支援电源逆变器和电池管理系统 (BMS)。这些组件需要具有优异温度控管性能和厚铜结构的基板才能有效处理高电流，而这一转变也体现在主要生产基地。根据中国乘用车协会预测，2024 年全年中国新能源乘用车零售将达到 1,098 万辆，较 2025 年 1 月的预测值成长 42%。同时，欧洲汽车製造商协会于 2025 年 11 月宣布，截至目前，电池式电动车已占欧盟市场份额的 16.4%。

同时，高阶驾驶辅助系统（ADAS）的日益普及正在重塑产业的技术格局。这一趋势正推动着向高密度基板（HDI）和柔性PCB架构的重大转变，而这些架构对于支援雷射雷达、雷达和相机模组所需的微型化和高速讯号传输至关重要。这些先进的基板能够实现分区车辆架构中即时资料处理单元所需的高密度组件封装。为了凸显这项发展对该产业的影响，台湾印刷基板协会（TPC）在其2025年3月发布的《生产趋势报告》中指出，2024年台湾製造商对HDI基板的需求将增加20.1%。这一成长主要由汽车电子产品的需求所驱动，显示安全性的提升如何直接转化为高价值製造业的机会。

市场挑战

供应链不稳定以及铜和高性能层压板等关键原材料的短缺正严重阻碍全球汽车印刷基板市场的成长。这些中断削弱了生产计划的可靠性，造成了严重的瓶颈，使製造商无法充分利用自动驾驶和电动车日益增长的需求。当关键印刷电路基板因材料短缺而无法供应时，汽车组装将被迫关闭生产线，直接限制收入实现，并减缓先进汽车技术的应用。

近期产业数据显示，原物料供应持续面临挑战，这印证了营运压力。根据IPC统计，2024年12月，45%的电子产品製造商报告原材料成本上涨，反映出稳定且价格合理的原材料供应仍面临挑战。这种波动迫使PCB製造商延长前置作业时间并提高价格，进而将负担转嫁给汽车原始设备製造商（OEM）。因此，市场难以维持稳定的生产水准以支持汽车电气化的快速发展，直接限制了整个产业的成长潜力。

市场趋势

除了标准运算需求之外，一个关键趋势是整合专为 5G 和车联网 (V2X) 连接设计的高频基板。随着汽车製造商部署协同智慧型运输系统，对能够最大限度降低毫米波频率讯号损耗的专用印刷电路基板的需求激增。这些低损耗材料对于实现车辆与基础设施之间的即时通讯至关重要，而标准的 FR-4 层压板在高频宽环境下难以可靠地支援这种通讯。这种连接方式的转变规模庞大，需要材料选择的快速发展。根据 5G 汽车协会 (5GAA) 于 2024 年 12 月发布的《先进驾驶用例、连接和技术蓝图》，全球蜂窝网路连接车辆的数量将超过 3 亿辆，这凸显了对支援基础设施的基板解决方案的即时需求。

同时，严格的环境法规和企业永续性目标正在推动环保可回收PCB材料的研发，并重塑製造策略。製造商正加速从难以回收的传统热固性塑胶向热塑性材料和可生物降解基板的转型，后者更有利于在车辆生命週期结束时回收零件。这项转型不仅受到监管压力的驱动，也源自于长期营运效率提升的潜力。产业趋势也支持这项策略转变：根据IPC 2025年3月的一项调查，58%的电子产业领导者表示，提高营运效率和降低成本是他们加速推动永续性的主要动机，证实了绿色製造已成为企业最重要的竞争优势之一。

目录

第一章概述

第二章调查方法

第三章执行摘要

第四章：客户评价

第五章 全球汽车PCB市场展望

  • 市场规模及预测
    • 按金额
  • 市占率及预测
    • 依车辆类型（乘用车、商用车）
    • 透过推进方式（内燃机、电力）
    • 按地区
    • 按公司（2025 年）
  • 市场地图

第六章：北美汽车PCB市场展望

  • 市场规模及预测
  • 市占率及预测
  • 北美洲：国家分析
    • 我们
    • 加拿大
    • 墨西哥

第七章：欧洲汽车PCB市场展望

  • 市场规模及预测
  • 市占率及预测
  • 欧洲：国家分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙

8. 亚太地区汽车PCB市场展望

  • 市场规模及预测
  • 市占率及预测
  • 亚太地区：国家分析
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲

第九章：中东和非洲汽车PCB市场展望

  • 市场规模及预测
  • 市占率及预测
  • 中东和非洲：国家分析
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 南非

第十章：南美汽车PCB市场展望

  • 市场规模及预测
  • 市占率及预测
  • 南美洲：国家分析
    • 巴西
    • 哥伦比亚
    • 阿根廷

第十一章 市场动态

  • 司机
  • 任务

第十二章 市场趋势与发展

  • 併购
  • 产品发布
  • 最新进展

第十三章 全球汽车PCB市场：SWOT分析

第十四章：波特五力分析

  • 产业竞争
  • 新进入者的可能性
  • 供应商电力
  • 顾客权力
  • 替代品的威胁

第十五章 竞争格局

  • Infineon Technologies AG
  • Samsung Electro Mechanics
  • CMK Corporation
  • Amitron Corporation
  • KCE Group
  • Deaduck Phil. Inc.
  • MEIKO ELECTRONICS Co., Ltd.
  • CHIN POON Industrial Co., Ltd.
  • Unimicron Group
  • STMicroelectronics NV

第十六章 策略建议

第十七章：关于研究公司及免责声明

简介目录
Product Code: 2201

The Global Automotive PCB Market is projected to expand from USD 10.59 Billion in 2025 to USD 15.72 Billion by 2031, achieving a CAGR of 6.81%. Acting as the critical mechanical backbone and electrical interconnects for electronic components, automotive Printed Circuit Boards (PCBs) are deployed in systems ranging from sophisticated infotainment and safety features to engine control units. This growth is primarily fueled by the automotive sector's rapid shift toward electrification, which creates a specific need for thermal-resistant and high-power boards suitable for battery management systems and electric vehicle powertrains. Additionally, the widespread incorporation of autonomous driving technologies and Advanced Driver Assistance Systems (ADAS) drives the demand for flexible and high-density interconnect PCBs capable of sustaining complex computing requirements.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 10.59 Billion
Market Size 2031USD 15.72 Billion
CAGR 2026-20316.81%
Fastest Growing SegmentIC Engine
Largest MarketAsia Pacific

According to the Taiwan Printed Circuit Association, the automotive sector comprised approximately 26.9% of the PCB application market in Mainland China in 2024, highlighting the segment's vital role within the world's largest electronics production hub. Despite this strong demand, the market encounters substantial hurdles regarding raw material scarcity and supply chain volatility, particularly involving high-performance laminates and copper. These disruptions, frequently intensified by geopolitical tensions, result in prolonged lead times and rising production costs, which can impede the timely delivery of essential components necessary for modern vehicle assembly.

Market Driver

The accelerating global transition toward vehicle electrification acts as the main catalyst for market expansion, fundamentally changing the specifications required for printed circuit boards (PCBs). As the industry moves from internal combustion engines to electric powertrains, there is a distinct need for durable, high-voltage PCBs capable of supporting power inverters and battery management systems (BMS). These components require boards with superior thermal management properties and thick copper configurations to effectively handle high currents, a shift reflected in major production hubs. According to the China Passenger Car Association, retail sales of new energy passenger vehicles in China reached 10.98 million units for the full year 2024, marking a 42% year-on-year increase as reported in January 2025, while the European Automobile Manufacturers' Association noted in November 2025 that battery-electric cars secured 16.4% of the EU market share year-to-date.

Concurrently, the increasing integration of Advanced Driver-Assistance Systems (ADAS) is reshaping the sector's technological landscape. This trend drives a critical migration toward High-Density Interconnect (HDI) and flexible PCB architectures, which are essential for supporting the miniaturization and high-speed signal transmission required by LIDAR, radar, and camera modules. These advanced boards enable the dense component placement necessary for real-time data processing units within zonal vehicle architectures. Highlighting the industrial impact of this evolution, the Taiwan Printed Circuit Association reported in its March 2025 production update that demand for HDI boards among Taiwanese manufacturers grew by 20.1% in 2024, a surge largely attributed to automotive electronics requirements, demonstrating how safety enhancements are directly translating into higher value-add manufacturing opportunities.

Market Challenge

The instability of the supply chain and the scarcity of essential raw materials, particularly copper and high-performance laminates, serve as a major restraint on the growth of the Global Automotive PCB Market. These disruptions compromise the reliability of production schedules, generating significant bottlenecks that prevent manufacturers from capitalizing on the rising demand for autonomous and electric vehicles. When critical printed circuit boards are unavailable due to material shortages, automotive assemblers are forced to suspend production lines, which directly limits revenue realization and slows the broader adoption of advanced automotive technologies.

This operational pressure is confirmed by recent industrial data indicating persistent challenges with inputs. According to the IPC, 45% of electronics manufacturers reported rising material costs in December 2024, reflecting the ongoing difficulty in securing consistent and affordable resources. Such volatility compels PCB fabricators to extend lead times and increase prices, passing the burden onto automotive OEMs. Consequently, the market struggles to maintain the consistent output levels required to support the rapid pace of vehicle electrification, directly dampening the sector's overall growth potential.

Market Trends

A critical trend distinct from standard computing requirements is the integration of high-frequency substrates designed for 5G and V2X (Vehicle-to-Everything) connectivity. As automakers deploy cooperative intelligent transport systems, there is a surging demand for specialized printed circuit boards capable of minimizing signal loss at millimeter-wave frequencies. These low-loss materials are essential for enabling real-time communication between vehicles and infrastructure, a capability that standard FR-4 laminates cannot reliably support in high-bandwidth environments. The scale of this connectivity shift is immense, necessitating a rapid evolution in material selection; according to the 5G Automotive Association (5GAA) in its December 2024 'Roadmap for Advanced Driving Use Cases, Connectivity, and Technologies', the number of global cellular-connected vehicles has exceeded 300 million, highlighting the immediate need for infrastructure-ready board solutions.

Simultaneously, manufacturing strategies are being reshaped by the development of eco-friendly and recyclable PCB materials to meet strict environmental regulations and corporate sustainability goals. Manufacturers are increasingly moving away from traditional, hard-to-recycle thermoset plastics in favor of thermoplastic materials and biodegradable substrates that allow for easier component reclamation at the end of a vehicle's life cycle. This transition is driven not only by regulatory pressure but also by the potential for long-term operational efficiencies. This strategic pivot is supported by industry sentiment; according to a March 2025 survey by the IPC, 58% of electronics leaders identified operational efficiency and cost savings as key motivators for accelerating their sustainability efforts, confirming that green manufacturing has become a central competitive priority.

Key Market Players

  • Infineon Technologies AG
  • Samsung Electro Mechanics
  • CMK Corporation
  • Amitron Corporation
  • KCE Group
  • Deaduck Phil. Inc.
  • MEIKO ELECTRONICS Co., Ltd.
  • CHIN POON Industrial Co., Ltd.
  • Unimicron Group
  • STMicroelectronics N.V.

Report Scope

In this report, the Global Automotive PCB Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Automotive PCB Market, By Vehicle Type

  • Passenger Car
  • Commercial Vehicle

Automotive PCB Market, By Propulsion Type

  • IC Engine
  • Electric

Automotive PCB Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Automotive PCB Market.

Available Customizations:

Global Automotive PCB Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Automotive PCB Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Vehicle Type (Passenger Car, Commercial Vehicle)
    • 5.2.2. By Propulsion Type (IC Engine, Electric)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Automotive PCB Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Vehicle Type
    • 6.2.2. By Propulsion Type
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Automotive PCB Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Vehicle Type
        • 6.3.1.2.2. By Propulsion Type
    • 6.3.2. Canada Automotive PCB Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Vehicle Type
        • 6.3.2.2.2. By Propulsion Type
    • 6.3.3. Mexico Automotive PCB Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Vehicle Type
        • 6.3.3.2.2. By Propulsion Type

7. Europe Automotive PCB Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Vehicle Type
    • 7.2.2. By Propulsion Type
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Automotive PCB Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Vehicle Type
        • 7.3.1.2.2. By Propulsion Type
    • 7.3.2. France Automotive PCB Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Vehicle Type
        • 7.3.2.2.2. By Propulsion Type
    • 7.3.3. United Kingdom Automotive PCB Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Vehicle Type
        • 7.3.3.2.2. By Propulsion Type
    • 7.3.4. Italy Automotive PCB Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Vehicle Type
        • 7.3.4.2.2. By Propulsion Type
    • 7.3.5. Spain Automotive PCB Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Vehicle Type
        • 7.3.5.2.2. By Propulsion Type

8. Asia Pacific Automotive PCB Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Vehicle Type
    • 8.2.2. By Propulsion Type
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Automotive PCB Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Vehicle Type
        • 8.3.1.2.2. By Propulsion Type
    • 8.3.2. India Automotive PCB Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Vehicle Type
        • 8.3.2.2.2. By Propulsion Type
    • 8.3.3. Japan Automotive PCB Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Vehicle Type
        • 8.3.3.2.2. By Propulsion Type
    • 8.3.4. South Korea Automotive PCB Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Vehicle Type
        • 8.3.4.2.2. By Propulsion Type
    • 8.3.5. Australia Automotive PCB Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Vehicle Type
        • 8.3.5.2.2. By Propulsion Type

9. Middle East & Africa Automotive PCB Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Vehicle Type
    • 9.2.2. By Propulsion Type
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Automotive PCB Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Vehicle Type
        • 9.3.1.2.2. By Propulsion Type
    • 9.3.2. UAE Automotive PCB Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Vehicle Type
        • 9.3.2.2.2. By Propulsion Type
    • 9.3.3. South Africa Automotive PCB Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Vehicle Type
        • 9.3.3.2.2. By Propulsion Type

10. South America Automotive PCB Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Vehicle Type
    • 10.2.2. By Propulsion Type
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Automotive PCB Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Vehicle Type
        • 10.3.1.2.2. By Propulsion Type
    • 10.3.2. Colombia Automotive PCB Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Vehicle Type
        • 10.3.2.2.2. By Propulsion Type
    • 10.3.3. Argentina Automotive PCB Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Vehicle Type
        • 10.3.3.2.2. By Propulsion Type

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Automotive PCB Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Infineon Technologies AG
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Samsung Electro Mechanics
  • 15.3. CMK Corporation
  • 15.4. Amitron Corporation
  • 15.5. KCE Group
  • 15.6. Deaduck Phil. Inc.
  • 15.7. MEIKO ELECTRONICS Co., Ltd.
  • 15.8. CHIN POON Industrial Co., Ltd.
  • 15.9. Unimicron Group
  • 15.10. STMicroelectronics N.V.

16. Strategic Recommendations

17. About Us & Disclaimer