板载晶片LED市场－全球产业规模、份额、趋势、机会、预测：按类型、应用、最终用户、地区和竞争格局划分，2021-2031年

全球板载晶片LED市场预计将从2025年的39.9亿美元成长到2031年的71.7亿美元，复合年增长率为10.25%。

这项技术将多个裸露的LED晶片直接键合到基板上，形成单一高亮度模组，无需单独封装晶片。这种结构可实现卓越的流明密度、紧凑的面积以及均匀的光输出，且无可见光斑。推动这项技术发展的关键因素包括全球商业和工业基础设施对节能照明的需求，以及COB阵列优异的导热性能，这对于汽车和路灯照明高功率应用至关重要。

儘管LED照明具有许多优势，但市场仍面临一项重大挑战：如何有效控制集中的热通量。随着晶片密度的增加，需要更复杂的散热解决方案，这使得製造流程更加复杂。根据美国能源局2024年固体照明预测，到2035年，LED产品预计将占所有照明装置的84%。这一趋势凸显了热工程领域持续创新对于确保先进照明系统的可靠性和广泛应用至关重要。

市场驱动因素

全球对节能照明解决方案日益增长的需求是板载晶片（COB）LED市场的关键驱动因素。与表面黏着型元件相比，COB LED具有更高的流明/瓦比和导热性，对于旨在降低能耗的商业应用至关重要。随着各国加快实现永续性目标的步伐，LED作为主流照明方式的趋势正在加速发展。国际能源总署（IEA）预测，到2025年11月，全球初级能源强度预计将以每年1.8%的速度下降，这主要得益于老旧系统采用高效率模组进行维修。昕诺飞（Signify）2025年1月发布的报告也强调了这一趋势，报告显示，2024年LED产品的收入占总销售额的93%，这表明市场对节能技术的偏好十分明显。

另一个重要的驱动因素是COB LED在汽车和运输设备照明领域的日益普及。这些模组体积小巧，亮度密度高，对于需要强大且不显眼光源的现代头灯设计和自适应远光灯系统至关重要。这种小型化使得在不降低照明标准的前提下，能够实现更复杂的车辆设计。该领域的强劲发展势头也支撑着这一趋势。根据海拉公司（Forbia Hella）预测，到2025年3月，该公司照明业务集团的销售额将在2024年达到40亿欧元，同比增长2.8%，这主要得益于新系列产品的推出以及其先进亚洲照明业务的整合。

市场挑战

全球板载晶片（COB）LED市场的主要障碍在于难以控制集中的热通量。 COB阵列中的高密度晶片会在有限区域内产生大量热能，因此必须采用复杂的散热机制。这项要求增加了製造流程的复杂性。整合高负载散热解决方案会增加材料清单（BOM）成本并引入技术复杂性，可能导致生产延误和单位成本上升。因此，这些高製造要求限制了该技术在成本敏感应用中的经济性，实际上阻碍了其快速规模化发展。

这项技术壁垒对市场稳定性造成了显着影响，尤其是在整体产业情势严峻的情况下。为降低热损伤而增加的成本和严格的设计要求阻碍了其广泛应用。根据美国国家电气製造商协会（NEMA）的预测，到2025年4月，电气产业状况指数预计将降至16.7，显示商业环境严重恶化。在如此严峻的经济环境下，高成本的热设计需求进一步加剧了挑战，并限制了市场的成长潜力。

市场趋势

虚拟製作和广播显示技术的普及正在重塑市场格局，其驱动力在于摄影棚以身临其境型LED显示器取代绿幕。板载晶片（COB）技术在这一领域至关重要，与表面黏着型元件（SMD）相比，它能提供更小的像素间距和更高的对比度，并有效消除摄影机感测器上的摩尔纹效应。这种提供无缝、高动态范围背景的能力，正促使製造商增加投资，优化模组以提升摄影机性能。根据优利明集团2024年5月发布的新闻稿，该公司在LED电视墙行业排名第一，其智慧显示业务凭藉先进的COB技术，在2023财年实现了66.9亿元人民币的营收。

向高精度园艺应用领域的拓展代表着另一项变革性趋势，它正从单纯的温室辅助照明发展到可控的垂直农业。 COB LED尤其适用于此应用，它能从紧凑的光源中提供高光通量密度，并实现精确的频谱调节，而不会像大型灯具那样产生阴影。这种配置使种植者能够将照明设备放置在更靠近树冠的位置，从而最大限度地提高单位面积产量。这项转变得益于严谨的产品研发；根据《温室产品新闻》2024年2月刊报道，经DesignLights联盟认证的园艺LED产品数量已从2020年的不足100种增至2024年初的约1500种。

目录

第一章概述

第二章：调查方法

第三章执行摘要

第四章：客户心声

第五章：全球板载晶片LED市场展望

• 市场规模及预测
  • 按金额
• 市占率及预测
  • 按类型（有机发光二极体、其他LED类型）
  • 依应用领域（汽车照明、家用电子电器、通用照明、医疗设备、工业照明）
  • 依最终用户（住宅、商业、工业、汽车、医疗）划分
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章：北美板载晶片LED市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国别分析
  • 我们
  • 加拿大
  • 墨西哥

第七章：欧洲板载晶片LED市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国别分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区板载晶片LED市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国别分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲板载晶片LED市场展望

• 市场规模及预测
• 市占率及预测
• 中东与非洲：国别分析
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 南非

第十章：南美板载晶片LED市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国别分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章 市场动态

• 促进因素
• 任务

第十二章 市场趋势与发展

• 併购
• 产品发布
• 近期趋势

第十三章 全球板载晶片LED市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商的议价能力
• 顾客权力
• 替代品的威胁

第十五章 竞争格局

• Cree, Inc.
• OSRAM Licht AG
• Nichia Corporation
• Seoul Semiconductor Co., Ltd.
• Everlight Electronics Co., Ltd.
• Lumileds Holding BV
• LG Innotek Co., Ltd.
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Lighting Co., Ltd.
• Bridgelux, Inc.

第十六章 策略建议

第十七章：关于研究公司及免责声明

The Global Chip On Board LED Market is projected to expand from USD 3.99 Billion in 2025 to USD 7.17 Billion by 2031, registering a CAGR of 10.25%. This technology involves bonding multiple bare LED chips directly onto a substrate to form a single, high-intensity module, eliminating the need for individual chip packaging. This configuration results in superior lumen density, a compact footprint, and uniform light output devoid of visible dots. Key drivers fueling this growth include the global demand for energy-efficient lighting in commercial and industrial infrastructures, as well as the exceptional thermal conductivity of COB arrays, which is crucial for high-power applications like automotive and street lighting.

Despite these benefits, the market encounters a major challenge in managing concentrated heat flux, as the high density of chips necessitates sophisticated heat sinking solutions that complicate the manufacturing process. According to the U.S. Department of Energy's 2024 solid-state lighting forecast, LED products are expected to account for 84% of all lighting installations by 2035. This trajectory underscores the critical need for ongoing innovation in thermal engineering to ensure the reliability and widespread adoption of these advanced lighting systems.

Market Driver

The increasing global demand for energy-efficient lighting solutions serves as a fundamental anchor for the Chip-on-Board (COB) LED market. Offering superior lumen-per-watt ratios and thermal conductivity compared to surface-mounted devices, this technology is essential for commercial applications aiming to reduce power consumption. As nations accelerate efforts to meet sustainability goals, the shift toward LED dominance is gaining momentum. According to the International Energy Agency, in November 2025, global primary energy intensity is on track to improve by 1.8 percent for the year, encouraging the retrofit of legacy systems with high-efficiency modules. This trend is highlighted by Signify's January 2025 report, which noted that LED-based revenue rose to 93 percent of total sales in 2024, demonstrating a clear market preference for energy-saving technologies.

A further pivotal driver is the growing adoption of COB LEDs in automotive and transportation lighting. These modules offer high-flux density within a compact footprint, making them critical for modern headlamp designs and adaptive driving beam systems that require powerful yet unobtrusive light sources. This miniaturization allows designers to achieve sleeker vehicle aesthetics without compromising illumination standards. The sector's momentum confirms this trajectory; according to Forvia Hella, in March 2025, sales in their Business Group Lighting grew by 2.8 percent year-on-year to €4.0 billion in 2024, a rise attributed to new series launches and the integration of advanced Asian lighting ventures.

Market Challenge

The primary obstacle hindering the Global Chip On Board LED Market is the difficulty of managing concentrated heat flux. The high density of chips within COB arrays generates significant thermal energy in a limited area, necessitating the use of complex heat sinking mechanisms. This requirement complicates the manufacturing process, as integrating heavy-duty thermal solutions increases the bill of materials and introduces technical intricacies that can delay production and inflate unit costs. Consequently, these elevated manufacturing demands restrict the technology's economic viability in cost-sensitive applications, effectively creating a barrier to rapid scalability.

This technical hurdle significantly impacts market stability, particularly when broader industry conditions are unfavorable. The added expense and engineering rigor required to mitigate thermal failure act as a deterrent to widespread adoption. According to the National Electrical Manufacturers Association (NEMA), in April 2025, the Current Conditions Index for the electroindustry declined to 16.7, indicating a severe contraction in business sentiment. In such a constricting economic environment, the imperative for costly thermal engineering exacerbates the challenge, further restricting the market's growth potential.

Market Trends

Penetration into Virtual Production and Broadcast Displays is reshaping the market as studios replace green screens with immersive LED volumes. Chip-on-Board (COB) technology is crucial in this sector, offering finer pixel pitches and superior contrast compared to Surface-Mounted Devices, effectively eliminating the moire effect on camera sensors. This capability for seamless, high-dynamic-range backgrounds has driven substantial investment from manufacturers optimizing modules for on-camera performance. According to Unilumin Group's May 2024 press release regarding their top ranking in the LED video wall industry, the company's intelligent display business, which leverages these advanced COB capabilities, achieved a revenue of RMB 6.69 billion for the fiscal year 2023.

Expansion into High-Precision Horticultural Applications represents another transformative trend, moving beyond simple greenhouse supplementation to controlled vertical farming. COB LEDs are uniquely suited for this, delivering high Photon Flux Density from a compact source and allowing precise spectral tuning without the shadowing effects of bulkier fixtures. This configuration enables growers to place lighting closer to the canopy, maximizing yield per square foot. This shift is evidenced by rigorous product development; according to Greenhouse Product News in February 2024, the number of qualified LED products for horticulture listed by the DesignLights Consortium reached approximately 1,500 in early 2024, up from fewer than 100 in 2020.

Key Market Players

• Cree, Inc.
• OSRAM Licht AG
• Nichia Corporation
• Seoul Semiconductor Co., Ltd.
• Everlight Electronics Co., Ltd.
• Lumileds Holding B.V.
• LG Innotek Co., Ltd.
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Lighting Co., Ltd.
• Bridgelux, Inc.

Report Scope

In this report, the Global Chip On Board Led Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Chip On Board Led Market, By Type

• OLED
• Other LED types

Chip On Board Led Market, By Application

• Automotive Lighting
• Consumer Electronics
• General Lighting
• Medical Devices
• Industrial Lighting

Chip On Board Led Market, By End User

• Residential
• Commercial
• Industrial
• Automotive
• Healthcare

Chip On Board Led Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Chip On Board Led Market.

Available Customizations:

Global Chip On Board Led Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Chip On Board Led Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (OLED, Other LED types)
  • 5.2.2. By Application (Automotive Lighting, Consumer Electronics, General Lighting, Medical Devices, Industrial Lighting)
  • 5.2.3. By End User (Residential, Commercial, Industrial, Automotive, Healthcare)
  • 5.2.4. By Region
  • 5.2.5. By Company (2025)
• 5.3. Market Map

6. North America Chip On Board Led Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Application
  • 6.2.3. By End User
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Chip On Board Led Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Application
      • 6.3.1.2.3. By End User
  • 6.3.2. Canada Chip On Board Led Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Application
      • 6.3.2.2.3. By End User
  • 6.3.3. Mexico Chip On Board Led Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Application
      • 6.3.3.2.3. By End User

7. Europe Chip On Board Led Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Application
  • 7.2.3. By End User
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Chip On Board Led Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Application
      • 7.3.1.2.3. By End User
  • 7.3.2. France Chip On Board Led Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Application
      • 7.3.2.2.3. By End User
  • 7.3.3. United Kingdom Chip On Board Led Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Application
      • 7.3.3.2.3. By End User
  • 7.3.4. Italy Chip On Board Led Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Application
      • 7.3.4.2.3. By End User
  • 7.3.5. Spain Chip On Board Led Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Application
      • 7.3.5.2.3. By End User

8. Asia Pacific Chip On Board Led Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Application
  • 8.2.3. By End User
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Chip On Board Led Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Application
      • 8.3.1.2.3. By End User
  • 8.3.2. India Chip On Board Led Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Application
      • 8.3.2.2.3. By End User
  • 8.3.3. Japan Chip On Board Led Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Application
      • 8.3.3.2.3. By End User
  • 8.3.4. South Korea Chip On Board Led Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Application
      • 8.3.4.2.3. By End User
  • 8.3.5. Australia Chip On Board Led Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Application
      • 8.3.5.2.3. By End User

9. Middle East & Africa Chip On Board Led Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Application
  • 9.2.3. By End User
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Chip On Board Led Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Application
      • 9.3.1.2.3. By End User
  • 9.3.2. UAE Chip On Board Led Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Application
      • 9.3.2.2.3. By End User
  • 9.3.3. South Africa Chip On Board Led Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Application
      • 9.3.3.2.3. By End User

10. South America Chip On Board Led Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Application
  • 10.2.3. By End User
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Chip On Board Led Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Application
      • 10.3.1.2.3. By End User
  • 10.3.2. Colombia Chip On Board Led Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Application
      • 10.3.2.2.3. By End User
  • 10.3.3. Argentina Chip On Board Led Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Application
      • 10.3.3.2.3. By End User

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Chip On Board Led Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Cree, Inc.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. OSRAM Licht AG
• 15.3. Nichia Corporation
• 15.4. Seoul Semiconductor Co., Ltd.
• 15.5. Everlight Electronics Co., Ltd.
• 15.6. Lumileds Holding B.V.
• 15.7. LG Innotek Co., Ltd.
• 15.8. Samsung Electronics Co., Ltd.
• 15.9. Taiwan Semiconductor Lighting Co., Ltd.
• 15.10. Bridgelux, Inc.

16. Strategic Recommendations

17. About Us & Disclaimer