物联网晶片市场－全球产业规模、份额、趋势、机会、预测：按产品、最终用户、地区和竞争对手划分，2021-2031年

全球物联网晶片市场预计将经历显着成长，从 2025 年的 1.26 兆美元成长到 2031 年的 3.35 兆美元，复合年增长率为 17.70%。

这些专用积体电路，包括感测器、连接模组、储存单元和微控制器，专为在互联设备环境中实现资料处理和无线通讯而设计。市场扩张的主要驱动力是工业自动化对营运效率日益增长的需求，以及高速 5G 基础设施的同步部署，这两者都需要高效能的处理组件。这种强劲的需求也体现在更广泛的组件产业中。根据世界半导体贸易统计（WSTS）的数据，包括关键物联网处理器在内的逻辑积体电路类别预计在 2024 年将成长 16.9%。

儘管市场成长势头强劲，但仍面临许多挑战，包括大量设备互联带来的日益增长的隐私和安全风险。终端数量的激增扩大了网路威胁的潜在攻击面，迫使製造商在复杂的加密技术和硬体级安全标准方面投入大量资金。对如此严格的安全通讯协定的需求往往会导致更高的开发成本和更长的上市时间，这可能会阻碍成本敏感型企业和消费者市场对该技术的接受速度。

市场驱动因素

5G 和先进无线连接技术的部署是推动市场发展的根本动力，这促使半导体製造商生产能够支援低延迟、高频宽资料传输的积体电路。这种网路演进迫使半导体製造商开发节能型调变解调器和晶片，并增强其射频性能，以满足大规模机器通讯的需求。网路存取的改善与硬体部署直接相关，设备製造商需要相容的组件，才能在从自动驾驶汽车到远端监控等各种应用中利用高速通讯。为了支持这项基础设施的扩展，5G Americas 在 2024 年 6 月的新闻稿中指出，2024 年第一季全球 5G 无线连接数量达到 19 亿，显示用户基数不断扩大，足以支撑对先进连接模组的需求。

同时，边缘运算和人工智慧的融合正将资料处理从云端转移到设备层面，从而改变组件架构。这一趋势迫使晶片製造商在微控制器中整合加速器和专用神经网路处理单元，从而在工业和消费应用中实现自动化决策和即时分析。因此，对片上智慧的需求要求半导体效能显着提升，以应对复杂的演算法工作负载。根据罗克韦尔自动化公司2024年2月发布的《智慧製造现状》报告，83%的製造商计划在2024年将生成式人工智慧应用于其运营，这将推动对能够处理资料密集型任务的处理器的需求。为了满足这些技术需求，SEMI预测2024年全球半导体製造产能将成长6%，确保供应链能够因应智慧感测器和逻辑装置产量的成长。

市场挑战

全球物联网晶片市场面临的一大障碍是设备间连接日益普及带来的安全和隐私风险。随着连网设备数量的增加，网路威胁的潜在攻击面也随之扩大，进而在生态系统中造成严重的安全漏洞。这种情况迫使半导体製造商将硬体级安全措施和复杂的加密通讯协定直接整合到晶片设计中，以防止资料外洩和未授权存取。

这些严格的安全标准要求直接影响市场成长，导致新组件的开发成本增加，上市时间延长。实施安全区域和加密加速器所需的工程资源显着提高了晶片的最终价格。因此，这些成本的增加可能会延缓工业物流和家用电子电器等对成本敏感的产业的采用。需要保护的设备数量庞大，也反映了安全负担的沉重。根据GSMA预测，到2024年，获得许可的蜂巢式物联网连线数将达到35亿，这意味着需要建置安全架构的终端数量极为庞大。保护如此庞大的基础设施所带来的财务和技术负担，限制了製造商部署经济实惠解决方案的速度。

市场趋势

RISC-V 指令集架构的快速普及正在从根本上改变市场格局，它提供了一种无需授权的开放标准，可取代专有处理器设计。这种架构允许製造商客製化设计针对特定物联网工作负载（例如嵌入式处理和超低功耗感测）优化的内核，而无需承担传统架构相关的高额专利费。这种柔软性正在推动大规模出货，领先的半导体製造商正将这些核心整合到其产品组合中，以增强供应链韧性和设计灵活性。根据 RISC-V International 于 2024 年 12 月发布的简报，NVIDIA 预测仅在 2024 年一年内，RISC-V 核心的出货量就将达到 10 亿至 20 亿颗，这凸显了嵌入式应用领域向模组化架构的快速产业转型。

同时，新一代无线标准（尤其是 Wi-Fi 7）的采用，满足了本地设备网路中对确定性延迟和跨厂商互通性的关键需求。与 5G 专注于广域覆盖不同，Wi-Fi 7 利用多链路操作 (MLO) 等特性，可在多个频段上同时传输数据，从而确保高密度工业IoT环境和频宽密集型智慧家庭应用所需的可靠性。随着设备製造商升级其连接模组以支援这些先进规范，这种演进正在商用硬体中迅速实现。根据 Wi-Fi 联盟 2024 年 1 月发布的新闻稿《Wi-Fi Certified 7 正式发布》，预计到 2024 年，市场上将有超过 2.33 亿台 Wi-Fi 7 设备，这标誌着向高效本地连接解决方案的重大转变。

目录

第一章概述

第二章：调查方法

第三章执行摘要

第四章：客户心声

第五章：全球物联网晶片市场展望

• 市场规模及预测
  • 按金额
• 市占率及预测
  • 依产品类别（处理器、感测器、连接积体电路、记忆体、逻辑装置）
  • 按最终用户（医疗、家用电子电器、工业、汽车、银行、金融服务和保险、零售、建筑自动化）
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章：北美物联网晶片市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国别分析
  • 我们
  • 加拿大
  • 墨西哥

第七章：欧洲物联网晶片市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国别分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太地区物联网晶片市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国别分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲物联网晶片市场展望

• 市场规模及预测
• 市占率及预测
• 中东与非洲：国别分析
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 南非

第十章：南美物联网晶片市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国别分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章 市场动态

• 促进因素
• 任务

第十二章 市场趋势与发展

• 併购
• 产品发布
• 近期趋势

第十三章：全球物联网晶片市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商的议价能力
• 顾客权力
• 替代品的威胁

第十五章 竞争格局

• Intel Corporation
• Qualcomm Technologies, Inc.
• Texas Instruments Incorporated
• NXP Semiconductors NV
• Broadcom Inc.
• STMicroelectronics NV
• MediaTek Inc.
• Microchip Technology Inc.
• Renesas Electronics Corporation
• Infineon Technologies AG

第十六章 策略建议

第十七章：关于研究公司及免责声明

The Global IoT Chips Market is projected to experience substantial growth, expanding from USD 1.26 Trillion in 2025 to USD 3.35 Trillion by 2031, reflecting a CAGR of 17.70%. These specialized integrated circuits, which encompass sensors, connectivity modules, memory units, and microcontrollers, are explicitly engineered to enable data processing and wireless communication within connected device ecosystems. This market expansion is primarily underpinned by the rising demand for operational efficiency via industrial automation and the simultaneous rollout of high-speed 5G infrastructure, both of which require high-performance processing components. This strong demand is mirrored in the broader component industry; according to World Semiconductor Trade Statistics, the Logic integrated circuit category, which includes essential IoT processors, was forecast to grow by 16.9 percent in 2024.

Despite this positive growth trajectory, the market encounters a major hurdle regarding the elevated privacy and security risks resulting from massive device interconnectivity. The rapid increase in endpoints widens the potential attack surface for cyber threats, necessitating that manufacturers invest significantly in complex encryption and hardware-level security standards. This need for strict security protocols often raises development costs and extends time-to-market, which potentially hinders the pace of adoption across cost-sensitive enterprise and consumer sectors.

Market Driver

The rollout of 5G and advanced wireless connectivity acts as a fundamental market driver, necessitating the production of integrated circuits capable of supporting low-latency and high-bandwidth data transmission. This network evolution compels semiconductor manufacturers to engineer chips with energy-efficient modems and enhanced radio frequency capabilities suitable for massive machine-type communications. Increased network accessibility is directly linked to hardware adoption, as device makers require compatible components to utilize faster speeds for applications ranging from autonomous vehicles to remote monitoring. Highlighting this infrastructure expansion, 5G Americas reported in a June 2024 press release that global 5G wireless connections rose to 1.9 billion in the first quarter of 2024, illustrating the growing foundation supporting the demand for advanced connectivity modules.

Simultaneously, the integration of edge computing and artificial intelligence is transforming component architecture by shifting data processing from the cloud to the device level. This trend forces chipmakers to embed accelerators and dedicated neural processing units within microcontrollers, enabling automated decision-making and real-time analytics in industrial and consumer applications. Consequently, the demand for on-chip intelligence necessitates substantial upgrades in semiconductor performance to manage complex algorithmic workloads. According to Rockwell Automation's 'State of Smart Manufacturing Report' from February 2024, 83 percent of manufacturers planned to deploy generative AI in their operations in 2024, driving the need for processors capable of data-intensive tasks. To meet these technological needs, SEMI projected that global semiconductor manufacturing capacity would rise by 6 percent in 2024, ensuring the supply chain can accommodate the increased volume of intelligent sensors and logic devices.

Market Challenge

The primary obstacle hindering the Global IoT Chips Market is the intensified security and privacy risk associated with widespread device interconnectivity. As the number of connected endpoints multiplies, the potential attack surface for cyber threats expands, creating critical vulnerabilities within the ecosystem. This situation compels semiconductor manufacturers to integrate hardware-level security measures and complex encryption protocols directly into their chip designs to prevent data breaches and unauthorized access.

This requirement for rigorous security standards directly impacts market growth by increasing development costs and extending the time-to-market for new components. The engineering resources required to implement secure enclaves and cryptographic accelerators significantly raise the final price of the chips. Consequently, cost-sensitive sectors such as industrial logistics and consumer electronics may delay adoption due to these rising expenses. The magnitude of this security burden is evident in the sheer volume of devices requiring protection; according to the GSMA, licensed cellular IoT connections reached 3.5 billion in 2024, representing a massive scale of endpoints that necessitate distinct security architecture. The financial and technical strain of securing such a vast infrastructure restricts the pace at which manufacturers can deploy affordable solutions.

Market Trends

The accelerated adoption of the RISC-V Instruction Set Architecture is fundamentally reshaping the market by offering a license-free, open-standard alternative to proprietary processor designs. This architecture allows manufacturers to custom-design cores optimized for specific IoT workloads, such as embedded processing or ultra-low power sensing, without the prohibitive royalty costs associated with traditional architectures. This flexibility is driving massive volume shipments as major semiconductor players integrate these cores into their portfolios to enhance supply chain resilience and design agility. According to the RISC-V International Newsletter from December 2024, NVIDIA estimated that it would ship between one and two billion RISC-V cores in 2024 alone, underscoring the rapid industrial transition toward this modular architecture for embedded applications.

Concurrently, the adoption of Next-Generation Wireless Standards, particularly Wi-Fi 7, is addressing the critical need for deterministic latency and cross-vendor interoperability within local device networks. Unlike the broad coverage focus of 5G, Wi-Fi 7 utilizes features like Multi-Link Operation (MLO) to simultaneously transmit data across multiple bands, ensuring the reliability required for dense industrial IoT environments and bandwidth-heavy smart home applications. This evolution is rapidly materializing in commercial hardware as device makers upgrade connectivity modules to support these advanced specifications. According to the Wi-Fi Alliance's January 2024 'Wi-Fi Certified 7 Arrives' press release, it was expected that more than 233 million Wi-Fi 7 devices would enter the market in 2024, signaling a major shift toward these high-efficiency local connectivity solutions.

Key Market Players

• Intel Corporation
• Qualcomm Technologies, Inc.
• Texas Instruments Incorporated
• NXP Semiconductors N.V.
• Broadcom Inc.
• STMicroelectronics N.V.
• MediaTek Inc.
• Microchip Technology Inc.
• Renesas Electronics Corporation
• Infineon Technologies AG

Report Scope

In this report, the Global IoT Chips Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

IoT Chips Market, By Product

• Processor
• Sensor
• Connectivity IC
• Memory Device
• logic Device

IoT Chips Market, By End-user

• Healthcare
• Consumer Electronics
• Industrial
• Automotive
• BFSI
• Retail
• Building Automation

IoT Chips Market, By Region

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global IoT Chips Market.

Available Customizations:

Global IoT Chips Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global IoT Chips Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Product (Processor, Sensor, Connectivity IC, Memory Device, logic Device)
  • 5.2.2. By End-user (Healthcare, Consumer Electronics, Industrial, Automotive, BFSI, Retail, Building Automation)
  • 5.2.3. By Region
  • 5.2.4. By Company (2025)
• 5.3. Market Map

6. North America IoT Chips Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Product
  • 6.2.2. By End-user
  • 6.2.3. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States IoT Chips Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Product
      • 6.3.1.2.2. By End-user
  • 6.3.2. Canada IoT Chips Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Product
      • 6.3.2.2.2. By End-user
  • 6.3.3. Mexico IoT Chips Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Product
      • 6.3.3.2.2. By End-user

7. Europe IoT Chips Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Product
  • 7.2.2. By End-user
  • 7.2.3. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany IoT Chips Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Product
      • 7.3.1.2.2. By End-user
  • 7.3.2. France IoT Chips Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Product
      • 7.3.2.2.2. By End-user
  • 7.3.3. United Kingdom IoT Chips Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Product
      • 7.3.3.2.2. By End-user
  • 7.3.4. Italy IoT Chips Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Product
      • 7.3.4.2.2. By End-user
  • 7.3.5. Spain IoT Chips Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Product
      • 7.3.5.2.2. By End-user

8. Asia Pacific IoT Chips Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Product
  • 8.2.2. By End-user
  • 8.2.3. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China IoT Chips Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Product
      • 8.3.1.2.2. By End-user
  • 8.3.2. India IoT Chips Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Product
      • 8.3.2.2.2. By End-user
  • 8.3.3. Japan IoT Chips Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Product
      • 8.3.3.2.2. By End-user
  • 8.3.4. South Korea IoT Chips Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Product
      • 8.3.4.2.2. By End-user
  • 8.3.5. Australia IoT Chips Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Product
      • 8.3.5.2.2. By End-user

9. Middle East & Africa IoT Chips Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Product
  • 9.2.2. By End-user
  • 9.2.3. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia IoT Chips Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Product
      • 9.3.1.2.2. By End-user
  • 9.3.2. UAE IoT Chips Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Product
      • 9.3.2.2.2. By End-user
  • 9.3.3. South Africa IoT Chips Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Product
      • 9.3.3.2.2. By End-user

10. South America IoT Chips Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Product
  • 10.2.2. By End-user
  • 10.2.3. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil IoT Chips Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Product
      • 10.3.1.2.2. By End-user
  • 10.3.2. Colombia IoT Chips Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Product
      • 10.3.2.2.2. By End-user
  • 10.3.3. Argentina IoT Chips Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Product
      • 10.3.3.2.2. By End-user

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global IoT Chips Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Intel Corporation
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Qualcomm Technologies, Inc.
• 15.3. Texas Instruments Incorporated
• 15.4. NXP Semiconductors N.V.
• 15.5. Broadcom Inc.
• 15.6. STMicroelectronics N.V.
• 15.7. MediaTek Inc.
• 15.8. Microchip Technology Inc.
• 15.9. Renesas Electronics Corporation
• 15.10. Infineon Technologies AG

16. Strategic Recommendations

17. About Us & Disclaimer