Product Code: TMRGL781
TMR's report on the global e-scrap and printed circuit board (PCB) e-scrap market studies the past as well as the current growth trends and opportunities to gain valuable insights of the indicators of the market during the forecast period from 2022 to 2031. The report provides revenue of the global e-scrap and printed circuit board (PCB) e-scrap market for the period 2017-2031, considering 2021 as the base year and 2031 as the forecast year. The report also provides the compound annual growth rate (CAGR %) of the global e-scrap and printed circuit board (PCB) e-scrap market from 2022 to 2031.
The report has been prepared after an extensive research. Primary research involved bulk of the research efforts, wherein analysts carried out interviews with key opinion leaders, industry leaders, and opinion makers. Secondary research involved referring to key players' product literature, annual reports, press releases, and relevant documents to understand the e-scrap and printed circuit board (PCB) e-scrap market.
The report delves into the competitive landscape of the global e-scrap and printed circuit board (PCB) e-scrap market. Key players operating in the global e-scrap and printed circuit board (PCB) e-scrap market have been identified and each one of these has been profiled, in terms of various attributes. Company overview, financial standings, recent developments, and SWOT are attributes of players in the global e-scrap and printed circuit board (PCB) e-scrap market profiled in this report.
Table of Contents
1. Preface
- 1.1. Market Introduction
- 1.2. Market and Segments Definition
- 1.3. Market Taxonomy
- 1.4. Research Methodology
- 1.5. Assumption and Acronyms
2. Executive Summary
- 2.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Overview
- 2.2. Regional Outline
- 2.3. Industry Outline
- 2.4. Market Dynamics Snapshot
- 2.5. Competition Blueprint
3. Market Dynamics
- 3.1. Macro-economic Factors
- 3.2. Drivers
- 3.3. Restraints
- 3.4. Opportunities
- 3.5. Key Trends
- 3.6. Regulatory Scenario
4. Associated Industry and Key Indicator Assessment
- 4.1. Parent Industry Overview - Global Waste Recycling Industry Overview
- 4.2. Supply Chain Analysis
- 4.3. Pricing Trend Analysis
- 4.4. Technology Roadmap Analysis
- 4.5. Industry SWOT Analysis
- 4.6. Porter Five Forces Analysis
- 4.7. COVID-19 Impact and Recovery Analysis
5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Component
- 5.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 5.1.1. Motherboards
- 5.1.2. Connectors
- 5.1.3. Hard Drives
- 5.1.4. Memory Cards
- 5.1.5. RAM
- 5.1.6. Displays
- 5.1.7. Cables
- 5.1.8. Others
- 5.2. Market Attractiveness Analysis, by Component
6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Material
- 6.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 6.1.1. Plastics
- 6.1.2. Glass
- 6.1.3. Metals (Copper, Aluminum, Tin)
- 6.1.4. Ferrous Components (Steel, Iron, Nickel)
- 6.1.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 6.1.6. Rare Metals
- 6.2. Market Attractiveness Analysis, by Material
7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Source
- 7.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 7.1.1. Household Appliances
- 7.1.2. IT & Telecommunication Hardware
- 7.1.3. Smartphones & Tablets
- 7.1.4. Computers & Laptops
- 7.1.5. Industrial Electronics
- 7.1.6. Printers & Scanners
- 7.1.7. Entertainment Devices (TVs, Speakers, etc.)
- 7.1.8. Others
- 7.2. Market Attractiveness Analysis, by Source
8. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis, by Process
- 8.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 8.1.1. E-waste Collection
- 8.1.2. E-waste Management
- 8.1.3. E-waste Recycling
- 8.2. Market Attractiveness Analysis, by Process
9. E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast, by Region
- 9.1. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Region, 2017-2031
- 9.1.1. North America
- 9.1.2. Europe
- 9.1.3. Asia Pacific
- 9.1.4. Middle East & Africa
- 9.1.5. South America
- 9.2. Market Attractiveness Analysis, by Region
10. North America E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
- 10.1. Market Snapshot
- 10.2. Drivers and Restraints: Impact Analysis
- 10.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 10.3.1. Motherboards
- 10.3.2. Connectors
- 10.3.3. Hard Drives
- 10.3.4. Memory Cards
- 10.3.5. RAM
- 10.3.6. Displays
- 10.3.7. Cables
- 10.3.8. Others
- 10.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 10.4.1. Plastics
- 10.4.2. Glass
- 10.4.3. Metals (Copper, Aluminum, Tin)
- 10.4.4. Ferrous Components (Steel, Iron, Nickel)
- 10.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 10.4.6. Rare Metals
- 10.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 10.5.1. Household Appliances
- 10.5.2. IT & Telecommunication Hardware
- 10.5.3. Smartphones & Tablets
- 10.5.4. Computers & Laptops
- 10.5.5. Industrial Electronics
- 10.5.6. Printers & Scanners
- 10.5.7. Entertainment Devices (TVs, Speakers, etc.)
- 10.5.8. Others
- 10.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 10.6.1. E-waste Collection
- 10.6.2. E-waste Management
- 10.6.3. E-waste Recycling
- 10.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017-2031
- 10.7.1. The U.S.
- 10.7.2. Canada
- 10.7.3. Rest of North America
- 10.8. Market Attractiveness Analysis
- 10.8.1. By Component
- 10.8.2. By Material
- 10.8.3. By Source
- 10.8.4. By Process
- 10.8.5. By Country/Sub-region
11. Europe E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
- 11.1. Market Snapshot
- 11.2. Drivers and Restraints: Impact Analysis
- 11.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 11.3.1. Motherboards
- 11.3.2. Connectors
- 11.3.3. Hard Drives
- 11.3.4. Memory Cards
- 11.3.5. RAM
- 11.3.6. Displays
- 11.3.7. Cables
- 11.3.8. Others
- 11.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 11.4.1. Plastics
- 11.4.2. Glass
- 11.4.3. Metals (Copper, Aluminum, Tin)
- 11.4.4. Ferrous Components (Steel, Iron, Nickel)
- 11.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 11.4.6. Rare Metals
- 11.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 11.5.1. Household Appliances
- 11.5.2. IT & Telecommunication Hardware
- 11.5.3. Smartphones & Tablets
- 11.5.4. Computers & Laptops
- 11.5.5. Industrial Electronics
- 11.5.6. Printers & Scanners
- 11.5.7. Entertainment Devices (TVs, Speakers, etc.)
- 11.5.8. Others
- 11.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 11.6.1. E-waste Collection
- 11.6.2. E-waste Management
- 11.6.3. E-waste Recycling
- 11.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017-2031
- 11.7.1. The U.K.
- 11.7.2. Germany
- 11.7.3. France
- 11.7.4. Rest of Europe
- 11.8. Market Attractiveness Analysis
- 11.8.1. By Component
- 11.8.2. By Material
- 11.8.3. By Source
- 11.8.4. By Process
- 11.8.5. By Country/Sub-region
12. Asia Pacific E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
- 12.1. Market Snapshot
- 12.2. Drivers and Restraints: Impact Analysis
- 12.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 12.3.1. Motherboards
- 12.3.2. Connectors
- 12.3.3. Hard Drives
- 12.3.4. Memory Cards
- 12.3.5. RAM
- 12.3.6. Displays
- 12.3.7. Cables
- 12.3.8. Others
- 12.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 12.4.1. Plastics
- 12.4.2. Glass
- 12.4.3. Metals (Copper, Aluminum, Tin)
- 12.4.4. Ferrous Components (Steel, Iron, Nickel)
- 12.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 12.4.6. Rare Metals
- 12.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 12.5.1. Household Appliances
- 12.5.2. IT & Telecommunication Hardware
- 12.5.3. Smartphones & Tablets
- 12.5.4. Computers & Laptops
- 12.5.5. Industrial Electronics
- 12.5.6. Printers & Scanners
- 12.5.7. Entertainment Devices (TVs, Speakers, etc.)
- 12.5.8. Others
- 12.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 12.6.1. E-waste Collection
- 12.6.2. E-waste Management
- 12.6.3. E-waste Recycling
- 12.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017-2031
- 12.7.1. China
- 12.7.2. Japan
- 12.7.3. India
- 12.7.4. South Korea
- 12.7.5. ASEAN
- 12.7.6. Rest of Asia Pacific
- 12.8. Market Attractiveness Analysis
- 12.8.1. By Component
- 12.8.2. By Material
- 12.8.3. By Source
- 12.8.4. By Process
- 12.8.5. By Country/Sub-region
13. Middle East & Africa E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
- 13.1. Market Snapshot
- 13.2. Drivers and Restraints: Impact Analysis
- 13.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 13.3.1. Motherboards
- 13.3.2. Connectors
- 13.3.3. Hard Drives
- 13.3.4. Memory Cards
- 13.3.5. RAM
- 13.3.6. Displays
- 13.3.7. Cables
- 13.3.8. Others
- 13.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 13.4.1. Plastics
- 13.4.2. Glass
- 13.4.3. Metals (Copper, Aluminum, Tin)
- 13.4.4. Ferrous Components (Steel, Iron, Nickel)
- 13.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 13.4.6. Rare Metals
- 13.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 13.5.1. Household Appliances
- 13.5.2. IT & Telecommunication Hardware
- 13.5.3. Smartphones & Tablets
- 13.5.4. Computers & Laptops
- 13.5.5. Industrial Electronics
- 13.5.6. Printers & Scanners
- 13.5.7. Entertainment Devices (TVs, Speakers, etc.)
- 13.5.8. Others
- 13.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 13.6.1. E-waste Collection
- 13.6.2. E-waste Management
- 13.6.3. E-waste Recycling
- 13.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017-2031
- 13.7.1. GCC
- 13.7.2. South Africa
- 13.7.3. Rest of Middle East & Africa
- 13.8. Market Attractiveness Analysis
- 13.8.1. By Component
- 13.8.2. By Material
- 13.8.3. By Source
- 13.8.4. By Process
- 13.8.5. By Country/Sub-region
14. South America E-scrap and Printed Circuit Board (PCB) E-scrap Market Analysis and Forecast
- 14.1. Market Snapshot
- 14.2. Drivers and Restraints: Impact Analysis
- 14.3. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units) Analysis & Forecast, by Component, 2017-2031
- 14.3.1. Motherboards
- 14.3.2. Connectors
- 14.3.3. Hard Drives
- 14.3.4. Memory Cards
- 14.3.5. RAM
- 14.3.6. Displays
- 14.3.7. Cables
- 14.3.8. Others
- 14.4. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Metric Tons) Analysis & Forecast, by Material, 2017-2031
- 14.4.1. Plastics
- 14.4.2. Glass
- 14.4.3. Metals (Copper, Aluminum, Tin)
- 14.4.4. Ferrous Components (Steel, Iron, Nickel)
- 14.4.5. Precious Metals (Gold, Silver, Palladium, etc.)
- 14.4.6. Rare Metals
- 14.5. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Source, 2017-2031
- 14.5.1. Household Appliances
- 14.5.2. IT & Telecommunication Hardware
- 14.5.3. Smartphones & Tablets
- 14.5.4. Computers & Laptops
- 14.5.5. Industrial Electronics
- 14.5.6. Printers & Scanners
- 14.5.7. Entertainment Devices (TVs, Speakers, etc.)
- 14.5.8. Others
- 14.6. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) Analysis & Forecast, by Process, 2017-2031
- 14.6.1. E-waste Collection
- 14.6.2. E-waste Management
- 14.6.3. E-waste Recycling
- 14.7. E-scrap and Printed Circuit Board (PCB) E-scrap Market Size (US$ Bn) and Volume (Million Units & Metric Tons) Analysis & Forecast, by Country and Sub-region, 2017-2031
- 14.7.1. Brazil
- 14.7.2. Rest of South America
- 14.8. Market Attractiveness Analysis
- 14.8.1. By Component
- 14.8.2. By Material
- 14.8.3. By Source
- 14.8.4. By Process
- 14.8.5. By Country/Sub-region
15. Competition Assessment
- 15.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Competition Matrix - a Dashboard View
- 15.1.1. Global E-scrap and Printed Circuit Board (PCB) E-scrap Market Company Share Analysis, by Value (2021)
- 15.1.2. Technological Differentiator
16. Company Profiles (Global Manufacturers/Suppliers)
- 16.1. Aurubis AG
- 16.1.1. Overview
- 16.1.2. Product Portfolio
- 16.1.3. Sales Footprint
- 16.1.4. Key Subsidiaries or Distributors
- 16.1.5. Strategy and Recent Developments
- 16.1.6. Key Financials
- 16.2. Boliden Group
- 16.2.1. Overview
- 16.2.2. Product Portfolio
- 16.2.3. Sales Footprint
- 16.2.4. Key Subsidiaries or Distributors
- 16.2.5. Strategy and Recent Developments
- 16.2.6. Key Financials
- 16.3. DOWA ECO-SYSTEM Co., Ltd.
- 16.3.1. Overview
- 16.3.2. Product Portfolio
- 16.3.3. Sales Footprint
- 16.3.4. Key Subsidiaries or Distributors
- 16.3.5. Strategy and Recent Developments
- 16.3.6. Key Financials
- 16.4. ERI
- 16.4.1. Overview
- 16.4.2. Product Portfolio
- 16.4.3. Sales Footprint
- 16.4.4. Key Subsidiaries or Distributors
- 16.4.5. Strategy and Recent Developments
- 16.4.6. Key Financials
- 16.5. E-scrap, Inc.
- 16.5.1. Overview
- 16.5.2. Product Portfolio
- 16.5.3. Sales Footprint
- 16.5.4. Key Subsidiaries or Distributors
- 16.5.5. Strategy and Recent Developments
- 16.5.6. Key Financials
- 16.6. Quantum Lifecycle Partners
- 16.6.1. Overview
- 16.6.2. Product Portfolio
- 16.6.3. Sales Footprint
- 16.6.4. Key Subsidiaries or Distributors
- 16.6.5. Strategy and Recent Developments
- 16.6.6. Key Financials
- 16.7. Sims Limited
- 16.7.1. Overview
- 16.7.2. Product Portfolio
- 16.7.3. Sales Footprint
- 16.7.4. Key Subsidiaries or Distributors
- 16.7.5. Strategy and Recent Developments
- 16.7.6. Key Financials
- 16.8. Spas Recycling Pvt. Ltd.
- 16.8.1. Overview
- 16.8.2. Product Portfolio
- 16.8.3. Sales Footprint
- 16.8.4. Key Subsidiaries or Distributors
- 16.8.5. Strategy and Recent Developments
- 16.8.6. Key Financials
- 16.9. Umicore
- 16.9.1. Overview
- 16.9.2. Product Portfolio
- 16.9.3. Sales Footprint
- 16.9.4. Key Subsidiaries or Distributors
- 16.9.5. Strategy and Recent Developments
- 16.9.6. Key Financials
- 16.10. Zolopik E-Waste Recycling Trivendent Technologies Pvt. Ltd.
- 16.10.1. Overview
- 16.10.2. Product Portfolio
- 16.10.3. Sales Footprint
- 16.10.4. Key Subsidiaries or Distributors
- 16.10.5. Strategy and Recent Developments
- 16.10.6. Key Financials
17. Recommendation
- 17.1. Opportunity Assessment
- 17.1.1. By Component
- 17.1.2. By Material
- 17.1.3. By Source
- 17.1.4. By Process
- 17.1.5. By Region