嵌入式板模组系统

嵌入式硬体市场在产品外形、客户概况、最终用户产业/应用和竞争格局方面高度分散。工程组织，包括 OEM/ODM、系统整合商、服务提供者和企业/工业最终用户本身，对用于开发产品的嵌入式硬体平台有不同的要求和偏好。

本报告研究了各种嵌入式组件和系统的市场，包括电脑模组、系统模组、主机板、单板计算机、整合计算系统和伺服器，并分析了影响竞争因素和收入机会的关键市场趋势。本报告对影响商业嵌入式硬体市场及其未来供应商生态系统的最大发展和公司提供了研究驱动的评论。该报告附有融合计算系统和伺服器市场主要供应商的市场占有率数据（涵盖每种形式，按垂直市场细分）以及工程师之声调查数据。

调查对象

• 嵌入式主机板、模组、整合系统和嵌入式/OEM 伺服器的市场规模是多少？
• 嵌入式模组、主机板、单板电脑、整合系统和嵌入式/OEM 伺服器外形的主要供应商有哪些？
• 该市场领先供应商的主要产品、服务和差异化优势是什么？未来五年内，哪些因素对于赢得市占率最重要？
• 在采购不同规格的嵌入式硬体时，不同类型的工程组织最重视哪些选择标准？

本报告的技术供应商

主要调查结果

• 预计到 2023 年，全球商用嵌入式主机板、模组和系统/伺服器市场规模将超过 360 亿美元
• 各种外形的嵌入式硬体市场高度分散，大量小型供应商专注于支援特定目标系统类型或 OT 应用程式的开发。
• 少数公司已在多种嵌入式硬体市场形式中确立了领导地位：研华 (Advantech)、凌华科技 (ADLINK)、控创 (Kontron)、水星系统 (Mercury Systems)、超微 (Supermicro) 等。
• 包括戴尔科技、HPE、IBM、联想和 Supermicro 在内的多家领先的嵌入式/OEM 系统和伺服器供应商继续将企业/HPC 领域的产品和技术进步引入边缘运算解决方案。
• VDC 的 "工程师之声" 调查结果显示，软体支援/相容性、产品可用性、网路功能和製程技术的重要性在不同工程社群和不同外形规格之间差异很大

目录

本报告的技术供应商

需求方面的调查:概要

摘要整理

• 主要调查结果

全球市场概要

• 边缘运算推动广泛的硬体需求
• 进一步的应用优化和支持
• 法规范围扩大至嵌入式产业
• 开发者对支援的期望从未如此高涨
• 工作负载加速器进一步加剧碎片化
• 硅技术供应商扩大影响力
• 近期併购

竞争情形

• 嵌入式主机板与单板计算机
• 嵌入式运算模组
• 嵌入式整合电脑系统与伺服器
• 供应商洞察

终端用户的洞察

• 嵌入式板和模组的选择标准根据处理器架构的不同而有很大差异。
• 产业和专案类型对各种系统标准的重要性有显着影响
• 标准硬体平台受到许多人的青睐

业者简介

关于作者

关于VDC Research

Inside this Report

The embedded hardware market is extremely fragmented in its composition of product form factors, customer profiles/demographics, end user industries/applications, and competitive landscape. Engineering organizations, including OEMs/ODMs, system integrators, service providers, and enterprise/industrial end users themselves, all have different requirements and preferences for embedded hardware platforms used for their product development. As a result, the embedded boards, modules, and integrated systems markets each feature distinct growth opportunities addressing the evolving nature of embedded and edge computing architectures as well as rosters of competing vendors vying for new designs and engineering projects.

This market research study examines the leading market trends impacting the total revenue opportunity as well as the competitive landscape for a wide variety of embedded component and system form factors, including computer- on-modules, system-on-modules, motherboards, single-board computers, integrated computing systems and servers, and others. This report delivers research-driven commentary on the biggest developments and players influencing the commercial embedded hardware market and its future supplier ecosystem. The report is accompanied by leading vendor market share data for each form factor under study and for the integrated computing systems and server market segmented by vertical market as well as Voice of the Engineer survey data.

What Questions are Addressed?

• How large is the total addressable market opportunity and outlook for merchant embedded boards, modules, integrated systems, and embedded/OEM servers?
• Who are the leading suppliers for different form factors of merchant embedded modules, motherboards, single-board computers, integrated systems, and embedded/OEM servers?
• What are the key product, service, and corporate differentiators of leading providers in the market and which will be most important for gaining share over the next five years?
• Which selection criteria are most important to engineering organizations of different types when sourcing different embedded hardware form factors?

Who Should Read this Report?

This report was written for those making critical decisions regarding product, market, channel, and competitive strategy and tactics. This report is intended for senior decision-makers who are developing, or are a part of the ecosystem of, IoT, embedded, and/or edge computing solutions, including:

Technology Suppliers in this Report:

... and many others.

Demand-side Research Overview

VDC launches numerous surveys of the IoT and embedded engineering ecosystem every year using an online survey platform. Our global Voice of the Engineer survey in 2024 captured insights from a total of 600 qualified respondents. To support this research, VDC leverages its in-house panel of over 30,000 individuals from various roles and industries across the world. This survey was used to inform our insight into key trends, preferences, and predictions within the engineering community.

Executive Summary

The embedded hardware market is hotly contested with a variety of established players and new organizations joining the fray to diversify their businesses via access to a healthy marketspace that features strong long-term growth prospects. Edge computing, the Internet of Things (IoT), computer vision, operational AI, and machine learning will remain critical market growth drivers over the next several years, enabling highly valuable solution capabilities and services for end users in operational environments. Although embedded hardware deployment lifetimes remain protracted and still extend beyond a decade (or even a few decades) in some safety-/mission- critical applications, the pace of innovation in the market has accelerated on the back of rapid advancements in processor technology, edge AI models, workload optimization, and cloud-native software development. Engineering organizations of various origins, types, sizes, and target markets will continue to demand a wide range of hardware platforms and development solutions that no single vendor can completely satisfy on their own.

Competition in the embedded boards, modules, and integrated systems market is multi-dimensional, with several different technical and business elements separating the market leaders from the rest. From a technical perspective, embedded hardware providers continue to compete on core metrics such as performance, power consumption, size/weight/area, pre-certification, and price. However, new considerations related to dedicated workload performance, accelerator integration/support, embedded security, connectivity enablement, and a growing list of other factors are changing the status quo. On the business/strategic side, a trusted supply chain extending from embedded hardware inception to deployment is crucial for preserving the integrity of the final deployed systems or infrastructure. Many engineering organizations also require the tier 1 business services commonly associated with leading enterprise/IT technology suppliers that are also serving the embedded/OEM market.

The embedded hardware space and its competitive landscape are changing at an unprecedented rate in response to the rapid evolution of developer/engineer requirements, device/system stacks, and the associated large and growing revenue opportunity enabling IoT, embedded, and edge computing solutions.

Key Findings:

• The total addressable market for merchant embedded boards, modules, and system/servers worldwide amounted to more than $36B in 2023.
• The embedded hardware market for all form factors is highly fragmented with a long tail of smaller suppliers focused on supporting the development of specific target system types or OT applications.
• Only a few organizations have established leadership across multiple embedded hardware market form factors, such as Advantech, ADLINK, Kontron, Mercury Systems, and Supermicro.
• Several leading embedded/OEM system and server providers, such as Dell Technologies, HPE, IBM, Lenovo, and Supermicro, continue to bring product and technology advancements from the enterprise/HPC domains to their edge computing solutions.
• VDC's Voice of the Engineer survey results indicate that the importance of software support/compatibility, product availability, networking capabilities, and process technology vary considerably between different engineering communities and form factors.

Table of Contents

Technology Suppliers in this Report

Demand-side Research Overview

Executive Summary

• Key Findings

Global Market Overview

• Edge Computing Drives Widespread Hardware Demand
• Application Optimization and Support Gets Deeper
• Regulations are Expanding in Different Embedded Industries
• Expectations for Developer Support are Higher than Ever
• Workload Accelerators Drive Further Fragmentation
• Silicon Technology Providers are Expanding Their Influence
• Recent Acquisitions & Mergers

Competitive Landscape

• Embedded Motherboards & Single-board Computers
• Embedded Computing Modules
• Embedded Integrated Computer Systems & Servers
• Vendor Insights

End-user Insights

• Embedded Board & Modules Selection Criteria Vary Considerably by Processor Architecture
• Industry & Project Type Have a Major Impact on the Importance of Different Systems Criteria
• Standard Hardware Platforms are Preferred by Many

Vendor Profiles

About the Authors

About VDC Research

List of Report Exhibits*

• Exhibit 1: Global Market for Embedded Boards and Modules Segmented by Form Factor, 2023-2028 Exhibit 2 Global Market for Embedded Systems & Servers Segmented by Form Factor, 2023-2028
• Exhibit 3: Leading Embedded Motherboard Vendor Shares Segmented by Form Factor, 2023
• Exhibit 4: Leading Embedded Computing Module & Card Vendor Shares Segmented by Form Factor, 2023
• Exhibit 5: Leading Embedded Integrated Computer System & Server Vendor Shares Segmented by Vertical Market, 2023
• Exhibit 6: Most Important Selection Criteria for Embedded Computing Modules, Motherboards, and Single-board Computers Exhibit 7 Most Important Selection Criteria for Embedded Integrated Computer Systems & Servers
• Exhibit 8: Primary Configuration of the Embedded Systems/Subsystems Purchased/Sourced

List of Market Data Exhibits*

• Exhibit 1: Desktop Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 2 ITX Class Motherboards, Vendor Shares, Revenue, 2023
• Exhibit 3: Embedded/Stackable Class Motherboards, Vendor Shares, Revenue, 2023 Exhibit 4 Slot Single Board Computers & CPU Blades, Vendor Shares, Revenue, 2023 Exhibit 5 PC/104 Family Modules, Vendor Shares, Revenue, 2023
• Exhibit 6: Mezzanine Cards, Vendor Shares, Revenue, 2023
• Exhibit 7: Computer-on-Modules, Vendor Shares, Revenue, 2023 Exhibit 8 System-on-Modules, Vendor Shares, Revenue, 2023
• Exhibit 9: Embedded Integrated Computer Systems & Servers (EICSS), Vendor Shares, Revenue, 2023 Exhibit 10 EICSS in Aerospace & Defense, Vendor Shares, Revenue, 2023
• Exhibit 11: EICSS in Communications & Networking, Vendor Shares, Revenue, 2023 Exhibit 12 EICSS in Digital Security & Surveillance, Vendor Shares, Revenue, 2023 Exhibit 13 EICSS in Digital Signage, Vendor Shares, Revenue, 2023
• Exhibit 14: EICSS in Energy & Power, Vendor Shares, Revenue, 2023 Exhibit 15 EICSS in Gaming, Vendor Shares, Revenue, 2023
• Exhibit 16: EICSS in Industrial Automation & Control, Vendor Shares, Revenue, 2023 Exhibit 17 EICSS in Instrumentation, Vendor Shares, Revenue, 2023
• Exhibit 18: EICSS in Medical, Vendor Shares, Revenue, 2023 Exhibit 19 EICSS in Retail, Vendor Shares, Revenue, 2023
• Exhibit 20: EICSS in Transportation, Vendor Shares, Revenue, 2023

IoT & Embedded Engineering Survey*

• Exhibit 1: Primary Role Within Company/Organization Exhibit 2 Respondent's Organization's Primary Industry
• Exhibit 3: Total Number of Employees at Respondent's Organization Exhibit 4 Primary Region of Residence
• Exhibit 5: Primary Country of Residence
• Exhibit 6: Type of Most Current or Recent Project Exhibit 7 Involvement with Engineering
• Exhibit 8: Type of Purchase by Respondent's Organization Exhibit 9 Primary Industry Classification of Project
• Exhibit 10: Type of Aerospace & Defense Application for Most Recent Project Exhibit 11 Type of Automotive In-Vehicle Application for Most Recent Project
• Exhibit 12: Type of Communications & Networking Application for Most Recent Project Exhibit 13 Type of Consumer Electronics Application for Most Recent Project
• Exhibit 14: Type of Digital Security Application for Most Recent Project

* Partial list of the 416 IoT & Embedded Technology Voice of the Engineer Survey Exhibits.