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市场调查报告书
商品编码
1622117

全球 IGBT 针翅散热器市场（按材料类型、地区、范围和预测）

Global Pin Fin Heat Sink For IGBT Market By Material Type, By Geographic Scope And Forecast
出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3个工作天内

价格
简介目录

IGBT 针翅散热器的市场规模及预测

2023 年 IGBT 针翅散热器市场规模价值 25 亿美元，预计到 2030 年将达到 61.7 亿美元，2024 年至 2030 年的复合年增长率为 5.3%。电动车、家居装修和厨房升级的趋势正在推动 IGBT 针翅散热器市场的发展。近年来，基于 IGBT 的功率模组变得更加先进和强大。这些模组装有大批耗电的电子元件，需要高性能的散热器来防止因过热而造成损坏或毁坏。这将推动市场成长。

全球 IGBT 针翅散热器市场报告对市场进行了全面评估。它对关键细分市场、趋势、市场推动因素、阻碍因素、竞争格局以及在市场中发挥关键作用的因素进行了全面的分析。

IGBT 针翅散热器的全球市场定义

针翅散热器在平坦底座上嵌有圆形针脚。从金属底座升起的长方形金属片，其翅片垂直于金属底座但彼此平行。这些散热器的几何设计和结构非常有效率。散热器有铜和铝两种材质，针脚密度可适应各种空速环境。散热器是一块实心的铜或铝块，带有重复的翅片，可以增加可用于传热的表面积。针状翅片同时增加了传热面积和传热係数。有多种尺寸可供选择，以适应从小型半导体到大型功率设备的各种应用和设备。

IGBT 针翅散热器的全球市场概况

透过适当的散热方法对消费性电子设备进行有效冷却的需求不断增加，由于人口增长和数位化而对高功率电源的需求不断增加是推动全球针翅散热器IGBT 市场成长的主要因素。一个促成因素。此外，与其他类型的散热器相比，针翅散热器具有体积效率高、成本低等多种优势，因此对针翅散热器的需求不断增长，也有望推动IGBT 针翅散热器市场的成长。预计。此外，汽车领域混合动力车和混合针翅散热器对 IGBT 模组的使用不断增加，也有望推动全球针翅散热器 IGBT 市场的成长。

存在一些阻碍市场整体成长的限制和障碍。针翅散热器製造商的利用率低是限制市场成长的因素之一。然而，技术进步、汽车领域混合动力汽车和混合针翅散热器对 IGBT 模组的日益使用以及新兴市场的尚未开发的潜力提供了有利可图的成长机会。

目录

第 1 章 IGBT 针翅散热器的全球市场：简介

    市场概况
  • 研究范围
  • 先决条件

第 2 章执行摘要

第 3 章：经过验证的市场研究方法

  • 资料探勘
  • 验证
  • 第一次面试
  • 资料来源列表

第 4 章 IGBT 针翅散热器全球市场展望

  • 概述
  • 市场动态
    • 驱动程式
    • 阻碍因素
    • 机会
  • 波特五力模型
  • 价值链分析
第 5 章 IGBT 针翅散热器全球市场（按材料）
  • 概述
  • 铜
  • 铝
第6章 IGBT 针翅散热器全球市场（按地区）
  • 概述
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 其他欧洲国家
    亚太地区
    • 中国
    • 日本
    • 印度
    • 其他亚太地区
  • 世界其他地区
    • 拉丁美洲
    • 中东和非洲

第 7 章 IGBT 针翅散热器全球市场：竞争格局

  • 概述
  • 各公司的市场排名
  • 主要发展策略

第 8 章 公司简介

  • Advanced Micro Devices（AMD）
  • Apex Microtechnology
  • Aavid Thermalloy, LLC
  • Advanced Thermal Solutions, Inc.
  • Allbrass Industrial The Brass
  • CUI Inc
  • Comair Rotron
  • Honeywell International Inc
  • Kunshan Googe Metal Products Co., Ltd.

第9章 附录

  • 关联调查
简介目录
Product Code: 15425

Pin Fin Heat Sink For IGBT Market Size And Forecast

Pin Fin Heat Sink For IGBT Market size was valued at USD 2.5 Billion in 2023 and is projected to reach USD 6.17 Billion by 2030 , growing at a CAGR of 5.3% from 2024 to 2030. The increasing trend of electric mobility, home remodeling, and kitchen updates is boosting the Pin Fin Heat Sink For IGBT Market. IGBT-based power modules have become significantly more advanced and powerful in recent times. These modules contain large arrays of power-hungry electronic components that require high-performance heat sinks to prevent them from overheating and being damaged or destroyed. This will foster market growth.

The Global Pin Fin Heat Sink For IGBT Market report provides a holistic evaluation of the market. The report offers a comprehensive analysis of key segments, trends, drivers, restraints, competitive landscape, and factors that are playing a substantial role in the market.

Global Pin Fin Heat Sink For IGBT Market Definition

Pin Fin Heat Sink is comprised of a flat base with a scale of round pins that are implanted into the base. It is a rectangular-shaped piece of metal that rises from a metal base, the fins are situated perpendicular to the metal base, but are parallel to one another. These heat sinks are designed and structured geometrically to make them highly effective. These are available in copper and aluminum material and comes in different pin densities, which are suitable for different airspeed environments. A heat sink is a solid block of copper or aluminum with recurring fins that expand the possible surface area for heat transfer. Pin fins concurrently increase both the heat transfer surface region and the heat transfer coefficient. These are available in different sizes with a wide array of applications and devices, ranging from miniature semiconductors to large power devices.

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Global Pin Fin Heat Sink For IGBT Market Overview

The increasing need for effective cooling of consumer electronics by proper heat dissipation method, supported by an escalation in demand for huge power supply due to growing population and digitization are some of the prime factors that drive the global pin fin heat sink IGBT market growth. Moreover, the rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for the IGBT market. Also, an increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sinks has positively anticipated in propelling the growth of the global pin fin heat sink IGBT market.

There are certain restrictions and barriers that will hinder the overall market growth. Factors such as low capacity utilization of pin fin heat sink manufacturers are limiting the market growth. Nevertheless, the advancements in technologies, the increase in the use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink, and untapped potential in emerging markets offer beneficial growth opportunities.

Global Pin Fin Heat Sink For IGBT Market: Segmentation Analysis

The Global Pin Fin Heat Sink For IGBT Market Segmented On The Basis Of Material Type, And Geography.

Pin Fin Heat Sink For IGBT Market, By Material Type

  • Copper
  • Aluminium

Based on Material Type, the market is bifurcated into Copper and Aluminium. The Aluminium segment holds the largest market share during the forecast period. The factors that can be attributed to the increasing need by electronic manufacturers owing to benefits such as high thermal performance and flexibility to fit into a variety of systems and designs are accelerating the demand for this segment.

Pin Fin Heat Sink For IGBT Market, By Geography

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World
  • On the basis of regional analysis, the Global Pin Fin Heat Sink For IGBT Market is classified into North America, Europe, Asia Pacific, and Rest of the world. Asia-Pacific holds the largest market share. The increasing consumer electronics and ongoing projects will boost the market in the APAC region.

Key Players

  • The study report will provide a valuable insight with an emphasis on the global market including some of the major players such as
  • Advanced Micro Devices (AMD), Apex Microtechnology, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Allbrass Industrial The Brass, CUI Inc, Comair Rotron, Honeywell International Inc and Kunshan Googe Metal Products Co., Ltd.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis.

TABLE OF CONTENTS

1. INTRODUCTION OF GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET

  • 1.1. Overview of the Market
  • 1.2. Scope of Report
  • 1.3. Assumptions

2. EXECUTIVE SUMMARY

3. RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1. Data Mining
  • 3.2. Validation
  • 3.3. Primary Interviews
  • 3.4. List of Data Sources

4. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET OUTLOOK

  • 4.1. Overview
  • 4.2. Market Dynamics
    • 4.2.1. Drivers
    • 4.2.2. Restraints
    • 4.2.3. Opportunities
  • 4.3. Porters Five Force Model
  • 4.4. Value Chain Analysis

5. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL

  • 5.1. Overview
  • 5.2. Copper
  • 5.3. Aluminium

6. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, BY GEOGRAPHY

  • 6.1. Overview
  • 6.2. North America
    • 6.2.1. U.S.
    • 6.2.2. Canada
    • 6.2.3. Mexico
  • 6.3. Europe
    • 6.3.1. Germany
    • 6.3.2. U.K.
    • 6.3.3. France
    • 6.3.4. Rest of Europe
  • 6.4. Asia Pacific
    • 6.4.1. China
    • 6.4.2. Japan
    • 6.4.3. India
    • 6.4.4. Rest of Asia Pacific
  • 6.5. Rest of the World
    • 6.5.1. Latin America
    • 6.5.2. Middle East & Africa

7. GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET COMPETITIVE LANDSCAPE

  • 7.1. Overview
  • 7.2. Company Market Ranking
  • 7.3. Key Development Strategies

8. COMPANY PROFILES

  • 8.1. Advanced Micro Devices (AMD)
    • 8.1.1. Overview
    • 8.1.2. Financial Performance
    • 8.1.3. Product Outlook
    • 8.1.4. Key Developments
  • 8.2. Apex Microtechnology
    • 8.2.1. Overview
    • 8.2.2. Financial Performance
    • 8.2.3. Product Outlook
    • 8.2.4. Key Developments
  • 8.3. Aavid Thermalloy, LLC
    • 8.3.1. Overview
    • 8.3.2. Financial Performance
    • 8.3.3. Product Outlook
    • 8.3.4. Key Developments
  • 8.4. Advanced Thermal Solutions, Inc.
    • 8.4.1. Overview
    • 8.4.2. Financial Performance
    • 8.4.3. Product Outlook
    • 8.4.4. Key Developments
  • 8.5. Allbrass Industrial The Brass
    • 8.5.1. Overview
    • 8.5.2. Financial Performance
    • 8.5.3. Product Outlook
    • 8.5.4. Key Developments
  • 8.6. CUI Inc
    • 8.6.1. Overview
    • 8.6.2. Financial Performance
    • 8.6.3. Product Outlook
    • 8.6.4. Key Developments
  • 8.7. Comair Rotron
    • 8.7.1. Overview
    • 8.7.2. Financial Performance
    • 8.7.3. Product Outlook
    • 8.7.4. Key Developments
  • 8.8. Honeywell International Inc
    • 8.8.1. Overview
    • 8.8.2. Financial Performance
    • 8.8.3. Product Outlook
    • 8.8.4. Key Developments
  • 8.9. Kunshan Googe Metal Products Co., Ltd.
    • 8.9.1. Overview
    • 8.9.2. Financial Performance
    • 8.9.3. Product Outlook
    • 8.9.4. Key Developments

9. Appendix

  • 9.1. Related Reports