封面
市场调查报告书
商品编码
1288896

全球电子保险丝市场研究报告 - 行业分析、规模、份额、增长、趋势和2023年至2030年预测

Global eFuse Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2023 to 2030

出版日期: | 出版商: Value Market Research | 英文 249 Pages | 商品交期: 最快1-2个工作天内

价格

据推测,到2030年,全球电子保险丝市场的需求将从2022年的358亿美元达到近50.9亿美元的市场规模,在2023-2030年的研究期间,年复合增长率为4.5%。

电子保险丝(eFuse)是一种嵌入计算机芯片的小型保险丝。IBM开发了这种技术,以实现半导体的动态实时重新编程。电子保险丝,或称eFuse,是一种集成电路,可以取代传统的保险丝或其他保护装置,如可复位的聚合物保险丝。它们包括一个控制电路和一个低电阻的电源开关,连接输入端口和负载,采用紧凑的塑料封装,如DFN和倒装芯片。

市场动态:

在预测期内,全球电子保险丝市场可能会受益于全球云计算需求的上升,汽车行业接受度的提高,以及电子保险丝IC在智能电子设备和VR/AR应用中的出现。电子保险丝在汽车应用中的使用越来越多,如汽车电子保险丝盒、车身控制模块和汽车电子子组件,如ABS卡、发动机控制单元、音频系统、导航系统和安全系统,推动了市场的发展。

该研究报告涵盖了波特五力模型、市场吸引力分析和价值链分析。这些工具有助于清楚地了解行业结构,并在全球范围内评估竞争的吸引力。此外,这些工具还对全球efuse市场的每个细分市场进行了全面评估。保险丝行业的增长和趋势为这项研究提供了一个全面的方法。

区域分析:

本节涵盖了区域前景,强调了北美、欧洲、亚太、拉丁美洲以及中东和非洲的电子保险丝市场的当前和未来需求。此外,报告重点关注所有重要地区的个别应用部门的需求、估计和预测。

该研究报告还涵盖了市场主要参与者的全面概况以及对全球竞争格局的深入看法。保险丝市场的主要参与者包括Analog Devices Inc., Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Qorvo, Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Electronic Devices & Storage Corporation。这一部分包括对竞争格局的整体看法,其中包括各种战略发展,如主要的合併和收购,未来的能力,伙伴关系,财务概况,合作,新产品的开发,新产品的推出,以及其他发展。

  • 如果你有任何定制要求,请写信给我们。我们的研究团队可以根据您的需要提供定制报告。

目录

第1章:前言

  • 报告描述
    • 目的
    • 目标受众
    • 独特的销售主张(USP)和产品
  • 研究范围
  • 研究方法
    • 市场研究过程
    • 市场研究方法

第二章:执行摘要

  • 市场的亮点
  • 全球市场简介

第三章:efuse - 行业分析

  • 简介 - 市场动态
  • 市场驱动力
  • 市场限制因素
  • 机会
  • 行业趋势
  • 波特的五力分析
  • 市场吸引力分析
    • 按类型
    • 按包装类型
    • 按应用分类
    • 按最终使用行业分类
    • 按地区

第四章:价值链分析

  • 价值链分析
  • 原材料分析
    • 原材料清单
    • 原材料制造商名单
    • 关键原材料的价格趋势
  • 潜在买家名单
  • 营销渠道
    • 直接营销
    • 间接营销
    • 营销渠道的发展趋势

第五章:Covid-19爆发的影响分析

第六章:全球电子保险丝市场分析:按类型划分

  • 按类型概述
  • 历史和预测数据
  • 按类型分析
  • 锁存型电子保险丝市场:按地区划分
  • 自动重试型电子保险丝市场:按地区划分

第7章 :全球电子保险丝市场分析:按封装类型划分

  • 按封装类型概述
  • 历史和预测数据
  • 按封装类型分析
  • 小尺寸无引线(SON)市场:按地区划分
  • 双平面无引线(DFN)市场:按地区划分
  • 四平无引线(QFN)市场:按地区划分
  • 薄型无引线封装(TSSOP)市场:按地区划分
  • 其他市场:按地区划分

第八章:全球电子保险丝市场分析:按应用分类

  • 概述:按应用分类
  • 历史和预测数据
  • 分析:按应用分类
  • 固态硬盘市场:按地区划分
  • 硬盘驱动器市场:按地区划分
  • 服务器和数据中心设备市场:按地区划分
  • 汽车电子市场:按地区划分
  • 其他市场:按地区划分

第九章:全球电子保险丝市场分析:按终端行业分类

  • 按最终用途行业概述
  • 历史和预测数据
  • 按最终用途行业的分析
  • 汽车和运输市场:按地区划分
  • 航空航天和国防市场:按地区划分
  • 消费电子市场:按地区划分
  • 医疗保健市场:按地区划分
  • IT和电信市场:按地区划分
  • 其他市场:按地区划分

第十章:全球电子保险丝市场分析:按地域划分

  • 区域展望
  • 简介
  • 北美洲
    • 概述、历史和预测数据
    • 北美:按细分市场划分
    • 北美洲:按国家划分
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 概述、历史和预测数据
    • 按部门分類的欧洲
    • 欧洲:按国家划分
    • 英国
    • 法国
    • 德国
    • 意大利
    • 俄罗斯
    • 欧洲其他地区
  • 亚太地区
    • 概述、历史和预测数据
    • 亚太地区按细分市场划分
    • 亚太地区:按国家划分
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳大利亚
    • 亚太其他地区
  • 拉美地区
    • 概述、历史和预测数据
    • 按部门分類的拉美地区
    • 拉丁美洲:按国家划分
    • 巴西
    • 阿根廷
    • 秘鲁
    • 智利
    • 拉美其他地区
  • 中东和非洲
    • 概述、历史和预测数据
    • 中东和非洲,按部门划分
    • 中东和非洲:按国家分类
    • 沙特阿拉伯
    • 阿拉伯联合酋长国
    • 以色列
    • 南非
    • 其他中东和非洲国家

第11章 :保险丝公司的竞争格局

  • EFuse的市场竞争
  • 伙伴关系/合作/协议
  • 合併和收购
  • 新产品发布
  • 其他方面的发展

第十二章 :公司简介

  • 公司份额分析
  • 市场集中度
  • Analog Devices Inc.
    • 公司概况
    • 产品
    • 近期发展情况
  • Diodes Incorporated
    • 公司概况
    • 产品
    • 近期发展
  • Microsemi Corporation
    • 公司概况
    • 产品
    • 近期发展
  • On Semiconductor Corporation
    • 公司概况
    • 产品
    • 近期发展
  • Qorvo, Inc.
    • 公司概况
    • 产品
    • 近期发展
  • STMicroelectronics N.V.
    • 公司概况
    • 产品
    • 近期发展
  • Texas Instruments Incorporated
    • 公司概况
    • 产品
    • 近期发展
  • Toshiba Electronic Devices & Storage Corporation
    • 公司概况
    • 产品
    • 近期发展情况

注意 - 在公司简介中,财务细节和最近的发展情况要视情况而定,如果是私营公司,可能不包括在内。

Product Code: VMR11216854

The global demand for eFuse Market is presumed to reach the market size of nearly USD 5.09 BN by 2030 from USD 3.58 BN in 2022 with a CAGR of 4.5% under the study period 2023 - 2030.

An electronic fuse (eFuse) is a small fuse embedded in a computer chip. IBM developed this technique to enable dynamic real-time reprogramming of semiconductors. Electronic fuses, or eFuses, are integrated circuits that can replace traditional fuses or other protective devices like resettable polymeric fuses. They include a control circuit and a low-on-resistance power switch, connecting the input port to the load, in compact plastic packages such as DFN and Flip-chip.

Market Dynamics:

During the forecast period, the worldwide eFuse market is likely to benefit from rising demand for cloud computing across the globe, increased acceptance in the automotive industry, and the advent of eFuse ICs for intelligent electronic devices and VR/AR applications. The market has been propelled by the increasing use of eFuses in automotive applications such as the automobile eFuse box, body control module, and automotive electronic subassemblies such as ABS cards, engine control units, audio systems, navigation systems, and security systems.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of efuse. The growth and trends of efuse industry provide a holistic approach to this study.

Market Segmentation:

This section of the efuse market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Type

  • Latched Type Efuse
  • Auto-Retry Type Efuse

By Package Type

  • Small Outline No Lead (SON)
  • Dual Flat No Leads (DFN)
  • Quad Flat No-Lead (QFN)
  • Thin Shrink Small Outline Package (TSSOP)
  • Others (Chip Scale Package [CSP], Ceramic Flat-Pack [CFP], Etc.)

By Application

  • Solid State Drives
  • Hard Disk Drives
  • Servers And Data Center Equipment
  • Automotive Electronics
  • Others (Power Tools, Surveillance Equipment, Networking Etc.)

By End-Use Industry

  • Automotive & Transportation
  • Aerospace & Defense
  • Consumer Electronics
  • Healthcare
  • It & Telecommunication
  • Others (Manufacturing, Agriculture, Etc.)

Regional Analysis:

This section covers the regional outlook, which accentuates current and future demand for the eFuse market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the efuse market include Analog Devices Inc., Diodes Incorporated, Microsemi Corporation, On Semiconductor Corporation, Qorvo, Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Toshiba Electronic Devices & Storage Corporation. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

  • In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

TABLE OF CONTENTS

1 . PREFACE

  • 1.1. Report Description
    • 1.1.1. Objective
    • 1.1.2. Target Audience
    • 1.1.3. Unique Selling Proposition (USP) & offerings
  • 1.2. Research Scope
  • 1.3. Research Methodology
    • 1.3.1. Market Research Process
    • 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

  • 2.1. Highlights of Market
  • 2.2. Global Market Snapshot

3 . EFUSE - INDUSTRY ANALYSIS

  • 3.1. Introduction - Market Dynamics
  • 3.2. Market Drivers
  • 3.3. Market Restraints
  • 3.4. Opportunities
  • 3.5. Industry Trends
  • 3.6. Porter's Five Force Analysis
  • 3.7. Market Attractiveness Analysis
    • 3.7.1 By Type
    • 3.7.2 By Package Type
    • 3.7.3 By Application
    • 3.7.4 By End-use Industry
    • 3.7.5 By Region

4 . VALUE CHAIN ANALYSIS

  • 4.1. Value Chain Analysis
  • 4.2. Raw Material Analysis
    • 4.2.1. List of Raw Materials
    • 4.2.2. Raw Material Manufactures List
    • 4.2.3. Price Trend of Key Raw Materials
  • 4.3. List of Potential Buyers
  • 4.4. Marketing Channel
    • 4.4.1. Direct Marketing
    • 4.4.2. Indirect Marketing
    • 4.4.3. Marketing Channel Development Trend

5 . IMPACT ANALYSIS OF COVID-19 OUTBREAK

6 . GLOBAL EFUSE MARKET ANALYSIS BY TYPE

  • 6.1 Overview by Type
  • 6.2 Historical and Forecast Data
  • 6.3 Analysis by Type
  • 6.4 Latched Type eFuse Market by Regions
  • 6.5 Auto-retry Type eFuse Market by Regions

7 . GLOBAL EFUSE MARKET ANALYSIS BY PACKAGE TYPE

  • 7.1 Overview by Package Type
  • 7.2 Historical and Forecast Data
  • 7.3 Analysis by Package Type
  • 7.4 Small Outline No Lead (SON) Market by Regions
  • 7.5 Dual Flat No Leads (DFN) Market by Regions
  • 7.6 Quad Flat No-lead (QFN) Market by Regions
  • 7.7 Thin Shrink Small Outline Package (TSSOP) Market by Regions
  • 7.8 Others Market by Regions

8 . GLOBAL EFUSE MARKET ANALYSIS BY APPLICATION

  • 8.1 Overview by Application
  • 8.2 Historical and Forecast Data
  • 8.3 Analysis by Application
  • 8.4 Solid State Drives Market by Regions
  • 8.5 Hard Disk Drives Market by Regions
  • 8.6 Servers and Data Center Equipment Market by Regions
  • 8.7 Automotive Electronics Market by Regions
  • 8.8 Others Market by Regions

9 . GLOBAL EFUSE MARKET ANALYSIS BY END-USE INDUSTRY

  • 9.1 Overview by End-use Industry
  • 9.2 Historical and Forecast Data
  • 9.3 Analysis by End-use Industry
  • 9.4 Automotive & Transportation Market by Regions
  • 9.5 Aerospace & Defense Market by Regions
  • 9.6 Consumer Electronics Market by Regions
  • 9.7 Healthcare Market by Regions
  • 9.8 IT & Telecommunication Market by Regions
  • 9.9 Others Market by Regions

10 . GLOBAL EFUSE MARKET ANALYSIS BY GEOGRAPHY

  • 10.1. Regional Outlook
  • 10.2. Introduction
  • 10.3. North America
    • 10.3.1. Overview, Historic and Forecast Data
    • 10.3.2. North America By Segment
    • 10.3.3. North America By Country
    • 10.3.4. United State
    • 10.3.5. Canada
    • 10.3.6. Mexico
  • 10.4. Europe
    • 10.4.1. Overview, Historic and Forecast Data
    • 10.4.2. Europe by Segment
    • 10.4.3. Europe by Country
    • 10.4.4. United Kingdom
    • 10.4.5. France
    • 10.4.6. Germany
    • 10.4.7. Italy
    • 10.4.8. Russia
    • 10.4.9. Rest Of Europe
  • 10.5. Asia Pacific
    • 10.5.1. Overview, Historic and Forecast Data
    • 10.5.2. Asia Pacific by Segment
    • 10.5.3. Asia Pacific by Country
    • 10.5.4. China
    • 10.5.5. India
    • 10.5.6. Japan
    • 10.5.7. South Korea
    • 10.5.8. Australia
    • 10.5.9. Rest Of Asia Pacific
  • 10.6. Latin America
    • 10.6.1. Overview, Historic and Forecast Data
    • 10.6.2. Latin America by Segment
    • 10.6.3. Latin America by Country
    • 10.6.4. Brazil
    • 10.6.5. Argentina
    • 10.6.6. Peru
    • 10.6.7. Chile
    • 10.6.8. Rest of Latin America
  • 10.7. Middle East & Africa
    • 10.7.1. Overview, Historic and Forecast Data
    • 10.7.2. Middle East & Africa by Segment
    • 10.7.3. Middle East & Africa by Country
    • 10.7.4. Saudi Arabia
    • 10.7.5. UAE
    • 10.7.6. Israel
    • 10.7.7. South Africa
    • 10.7.8. Rest Of Middle East And Africa

11 . COMPETITIVE LANDSCAPE OF THE EFUSE COMPANIES

  • 11.1. EFuse Market Competition
  • 11.2. Partnership/Collaboration/Agreement
  • 11.3. Merger And Acquisitions
  • 11.4. New Product Launch
  • 11.5. Other Developments

12 . COMPANY PROFILES OF EFUSE INDUSTRY

  • 12.1. Company Share Analysis
  • 12.2. Market Concentration Rate
  • 12.3. Analog Devices Inc.
    • 12.3.1. Company Overview
    • 12.3.2. Financials
    • 12.3.3. Products
    • 12.3.4. Recent Developments
  • 12.4. Diodes Incorporated
    • 12.4.1. Company Overview
    • 12.4.2. Financials
    • 12.4.3. Products
    • 12.4.4. Recent Developments
  • 12.5. Microsemi Corporation
    • 12.5.1. Company Overview
    • 12.5.2. Financials
    • 12.5.3. Products
    • 12.5.4. Recent Developments
  • 12.6. On Semiconductor Corporation
    • 12.6.1. Company Overview
    • 12.6.2. Financials
    • 12.6.3. Products
    • 12.6.4. Recent Developments
  • 12.7. Qorvo, Inc.
    • 12.7.1. Company Overview
    • 12.7.2. Financials
    • 12.7.3. Products
    • 12.7.4. Recent Developments
  • 12.8. STMicroelectronics N.V.
    • 12.8.1. Company Overview
    • 12.8.2. Financials
    • 12.8.3. Products
    • 12.8.4. Recent Developments
  • 12.9. Texas Instruments Incorporated
    • 12.9.1. Company Overview
    • 12.9.2. Financials
    • 12.9.3. Products
    • 12.9.4. Recent Developments
  • 12.10. Toshiba Electronic Devices & Storage Corporation
    • 12.10.1. Company Overview
    • 12.10.2. Financials
    • 12.10.3. Products
    • 12.10.4. Recent Developments

Note - in company profiling, financial details and recent development are subject to availability or might not be covered in case of private companies

LIST OF TABLES

  • Market Snapshot
  • Drivers : Impact Analysis
  • Restraints : Impact Analysis
  • List of Raw Material
  • List of Raw Material Manufactures
  • List of Potential Buyers
  • Analysis by Type (USD MN)
  • Latched Type eFuse Market by Geography (USD MN)
  • Auto-retry Type eFuse Market by Geography (USD MN)
  • Analysis Market by Package Type (USD MN)
  • Small Outline No Lead (SON) Market by Geography (USD MN)
  • Dual Flat No Leads (DFN) Market by Geography (USD MN)
  • Quad Flat No-lead (QFN) Market by Geography (USD MN)
  • Thin Shrink Small Outline Package (TSSOP) Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Analysis by Application (USD MN)
  • Solid State Drives Market by Geography (USD MN)
  • Hard Disk Drives Market by Geography (USD MN)
  • Servers and Data Center Equipment Market by Geography (USD MN)
  • Automotive Electronics Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Analysis by End-use Industry (USD MN)
  • Automotive & Transportation Market by Geography (USD MN)
  • Aerospace & Defense Market by Geography (USD MN)
  • Consumer Electronics Market by Geography (USD MN)
  • Healthcare Market by Geography (USD MN)
  • IT & Telecommunication Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global EFuse Market by Geography (USD MN)
  • North America Market Analysis (USD MN)
  • United State Market Analysis (USD MN)
  • Canada Market Analysis (USD MN)
  • Mexico Market Analysis (USD MN)
  • Europe Market Analysis (USD MN)
  • Europe Market Estimate by Country (USD MN)
  • United Kingdom Market Analysis (USD MN)
  • France Market Analysis (USD MN)
  • Germany Market Analysis (USD MN)
  • Italy Market Analysis (USD MN)
  • Russia Market Analysis (USD MN)
  • Spain Market Analysis (USD MN)
  • Rest of Europe Market Analysis (USD MN)
  • Asia Pacific Market Analysis (USD MN)
  • China Market Analysis (USD MN)
  • Japan Market Analysis (USD MN)
  • India Market Analysis (USD MN)
  • South Korea Market Analysis (USD MN)
  • Australia Market Analysis (USD MN)
  • Rest of Asia Pacific Market Analysis (USD MN)
  • Latin America Market Analysis (USD MN)
  • Brazil Market Analysis (USD MN)
  • Argentina Market Analysis (USD MN)
  • Peru Market Analysis (USD MN)
  • Chile Market Analysis (USD MN)
  • Rest of Latin America Market Analysis (USD MN)
  • Middle East & Africa Market Analysis (USD MN)
  • Saudi Arabia Market Analysis (USD MN)
  • UAE Market Analysis (USD MN)
  • Israel Market Analysis (USD MN)
  • South Africa Market Analysis (USD MN)
  • Rest of Middle East and Africa Market Analysis (USD MN)
  • Partnership/Collaboration/Agreement
  • Mergers And Acquisiton

LIST OF FIGURES

  • Research Scope of EFuse Report
  • Market Research Process
  • Market Research Methodology
  • Global EFuse Market Size, by Region (USD MN)
  • Porters Five Forces Analysis
  • Market Attractiveness Analysis by Type
  • Market Attractiveness Analysis by Package Type
  • Market Attractiveness Analysis by Application
  • Market Attractiveness Analysis by End-use Industry
  • Market Attractiveness Analysis by Region
  • Value Chain Analysis
  • Global Market Analysis by Type (USD MN)
  • Latched Type eFuse Market by Geography (USD MN)
  • Auto-retry Type eFuse Market by Geography (USD MN)
  • Global Market Analysis by Package Type (USD MN)
  • Small Outline No Lead (SON) Market by Geography (USD MN)
  • Dual Flat No Leads (DFN) Market by Geography (USD MN)
  • Quad Flat No-lead (QFN) Market by Geography (USD MN)
  • Thin Shrink Small Outline Package (TSSOP) Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market Analysis by Application (USD MN)
  • Solid State Drives Market by Geography (USD MN)
  • Hard Disk Drives Market by Geography (USD MN)
  • Servers and Data Center Equipment Market by Geography (USD MN)
  • Automotive Electronics Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market Analysis by End-use Industry (USD MN)
  • Automotive & Transportation Market by Geography (USD MN)
  • Aerospace & Defense Market by Geography (USD MN)
  • Consumer Electronics Market by Geography (USD MN)
  • Healthcare Market by Geography (USD MN)
  • IT & Telecommunication Market by Geography (USD MN)
  • Others Market by Geography (USD MN)
  • Global Market by Revenue
  • North America Market by Revenue
  • Europe Market by Revenue
  • Asia Pacific Market by Revenue
  • Latin America Market by Revenue
  • Middle East & Africa Market by Revenue
  • Recent Development in Industry
  • Company Market Share Analysis
  • Kindly note that the above listed are the basic tables and figures of the report and are not limited to the TOC.