5G 和未来 RAN 半导体

本报告探讨了 5G 和未来 RAN 半导体市场，概述了 RAN 协定堆迭和半导体、主要趋势、Open RAN 部署的驱动因素和障碍、主要晶片组供应商概况以及 RAN 晶片。我们编制了建议加速套件开发。

报告的优点：

• 确定 5G 和未来无线接取网路 (RAN) 半导体市场的主要趋势和挑战
• 我们可以帮助您决定在行动产业部署 Open RAN
• 确定 mmIMO 的处理需求以及硬体加速的需求
• 取得加速未来 RAN 晶片组开发的重要建议

关键问题的答案：

• 大规模 mMIMO 部署的主要挑战是什么？
• COT硬体和加速卡如何共同满足Open RAN的RAN处理需求？
• Open RAN 晶片组的最新趋势是什么？

研究亮点：

• 有关 RAN 协定堆迭和半导体的详细说明
• 详细概述可用于 RAN 处理的半导体类型，包括第 1 层、第 2 层和第 3 层（传统 RAN、开放式 RAN）

目录

简介/市场概览

市场发展/问题

• mMIMO技术背景
• 半导体市场概览
• 5G RAN 半导体

传统供应商的 RAN 半导体方法

开放 RAN 市场发展

• 开放 RAN 硬体加速
• 具有第 1 层加速功能的通用处理器
• 可能针对上行链路效能进行新的 O-RAN 联盟功能划分
• 基于 RISC-V 的 Open RAN 设计

晶片组供应商简介

• Picocom
• NXP Semiconductors
• Intel Corporation
• Marvell Technology
• Qualcomm

概述/建议

Actionable Benefits:

• Determine key trends and challenges in 5G and future Radio Access Network (RAN) semiconductor market.
• Assist the mobile industry in making decisions for Open RAN deployments.
• Identify the processing requirements for Massive Multiple Input, Multiple Output (mMIMO) and the need for hardware acceleration.
• Key recommendations to accelerate chipset development for future RANs.

Critical Questions Answered:

• What are the major challenges related to large-scale mMIMO deployments?
• How can Commercial-Off-the-Shelf (COTs) hardware, in combination with accelerator cards, fulfill the RAN processing demands for Open RAN?
• What are the most recent developments related to chipsets for Open RAN?

Research Highlights:

• Detailed description of RAN protocol stack and semiconductors.
• Detailed overview of the types of semiconductors available for RAN processing, including Layers 1, 2, and 3 (traditional RAN, and Open RAN).

Who Should Read This?

• Decision makers for mobile networks who need to understand the role of semiconductors in RANs.
• Open RAN vendors and service providers.
• Chipset vendors.
• Innovation leaders who need to understand the role of semiconductors in future 5G deployments.

Table of Contents

Introduction and Market Overview

Market Developments and Challenges

• mMIMO Technical Background
• Semiconductor Market Overview
• Semiconductors for 5G RAN

Traditional Vendor Approach toward RAN Semiconductors

Open RAN Market Developments

• Hardware Acceleration in Open RAN
• General-Purpose Processors with Layer-1 Acceleration
• Potential New O-RAN Alliance Functional Splits for Uplink Performance
• RISC-V Based Designs for Open RAN

Chipset Vendor Profiles

• Picocom
• NXP Semiconductors
• Intel Corporation
• Marvell Technology
• Qualcomm

Conclusions and Recommendations