数位身分与嵌入式安全

本报告探讨了数位身分和嵌入式安全的趋势，并对主要的基于硬体的嵌入式安全技术进行了市场预测，并根据硬体类型、部署场景和外形尺寸进行了详细分析。

实际优势：

• 确定最适合嵌入式身分技术的物联网应用。
• 根据可用的安全功能来决定嵌入式系统的最佳外形尺寸。
• 优化物联网产品开发的硬体安全策略。

关键问题解答：

• 哪些产业利用硬体为基础的安全技术？
• 原始设备製造商 (OEM) 青睐哪些识别外形尺寸？
• 哪些硬体安全技术引领嵌入式系统市场？

研究亮点：

• 三大基于硬体的嵌入式安全技术的市场预测：TPM（可信任平台模组）、TEE（可信任执行环境）、安全 MCU（微控制器单元）和安全元件 (SE)
• 按硬体类型和用例进行详细细分
• 每种设备形态和终端市场（五个区域）的出货量和收入预测

目录

表格

图表

• 图表 1：嵌入式安全出货量（依技术）
• 图表 2：嵌入式安全收入（按技术）
• 图表 3：NFC 嵌入式安全元件出货量
• 图表 4：可信任平台模组 (TPM) 出货量
• 图表 5：可信赖执行环境 (TEE) 出货量
• 图 6：内嵌 SIM (eSIM) 出货量
• 图 7：身份验证 IC 出货量
• 图 8：安全 MCU 出货量
• 图 9：安全元件出货量

Actionable Benefits:

• Identify the optimal Internet of Things (IoT) applications for your embedded authentication technologies.
• Determine the best form factor for your specific embedded systems based on available security features.
• Optimize hardware security strategies in your IoT product development.

Critical Questions Answered:

• Which industries are going to be leveraging hardware-based security?
• Which authentication form factors are Original Equipment Manufacturers (OEMs) going to be favoring?
• Which hardware security technologies are likely to lead for embedded systems?

Research Highlights:

• Market forecast for three primary hardware-based embedded security technologies: Trusted Platform Module (TPM), Trusted Execution Environment (TEE), secure Microcontroller Unit (MCU), and Secure Element (SE).
• A detailed breakdown by hardware type and application use case.
• Shipment and revenue forecasts for each form factor and end market across five regions.

Who Should Read This?

• Semiconductor and silicon Intellectual Property (IP) companies.
• Embedded systems OEMs.
• IoT service providers.

TABLE OF CONTENTS

Tables

• Table 1 Embedded Security Shipments by Technology
• Table 2 Shipments of NFC Embedded Secure Element by Application
• Table 3 Shipments of Trusted Platform Module by Application
• Table 4 Shipments of Trusted Execution Environment by Application
• Table 5 Shipments of Embedded SIM by Application
• Table 6 Shipments of Authentication IC by Application
• Table 7 Shipments of Secure MCUs by Application
• Table 8 Shipments of Secure Elements by Application
• Table 9 NFC Embedded Secure Element Shipments by Region
• Table 10 Trusted Platform Module Shipments by Region
• Table 11 Trusted Execution Environment Processor Shipments by Region
• Table 12 Embedded SIM Shipments by Region
• Table 13 Authentication IC Shipments by Region
• Table 14 Secure MCU Shipments by Region
• Table 15 Secure Elements Shipments by Region
• Table 16 NFC Embedded Secure Element Shipments ASPs and Revenue
• Table 17 NFC Embedded Secure Element Revenue by Region
• Table 18 Trusted Platform Module Shipments ASPs and Revenue
• Table 19 Trusted Platform Module Revenue by Region
• Table 20 Shipments ASPs and Revenue of Processors Supporting Trusted Execution Environment
• Table 21 Revenue of Processors Supporting Trusted Execution Environment
• Table 22 Embedded SIM Shipments ASPs and Revenue
• Table 23 Embedded SIM Consumer Revenue by Region
• Table 24 Embedded SIM M2M Revenue by Region
• Table 25 Authentication IC Shipments ASPs and Revenue
• Table 26 Authentication IC Revenue by Region
• Table 27 Secure MCU Shipments ASPs and Revenue
• Table 28 Secure MCU Revenue by Region
• Table 29 Secure Elements Shipments ASPs and Revenue
• Table 30 Secure Elements Revenue by Region

Charts

• Chart 1 Embedded Security Shipments by Technology
• Chart 2 Embedded Security Revenue by Technology
• Chart 3 Shipments of NFC Embedded Secure Element
• Chart 4 Shipments of Trusted Platform Module
• Chart 5 Shipments of Trusted Execution Environment
• Chart 6 Shipments of Embedded SIM
• Chart 7 Shipments of Authentication IC
• Chart 8 Shipments of Secure MCUs
• Chart 9 Shipments of Secure Elements