数位身分与嵌入式安全：市场数据概览（2025 年第三季）

本报告探讨了数位身分与嵌入式安全的趋势，并提供了可信任平台模组 (TPM)、可信任执行环境 (TEE)、安全微控制器单元 (MCU) 和安全元件 (SE) 的市场预测，以及按地区、外形尺寸和其他细分市场的详细分析。

实际优势：

• 确定最适合嵌入式身分技术的物联网应用。
• 根据可用的安全功能来决定嵌入式系统的最佳外形尺寸。
• 优化物联网产品开发的硬体安全策略。

关键问题解答：

• 哪些产业利用硬体为基础的安全性？
• 原始设备製造商 (OEM) 偏好哪些识别外形尺寸？
• 哪些硬体安全技术引领嵌入式系统市场？

研究亮点：

• 三大类基于硬体的嵌入式安全技术的市场预测：TPM（可信任平台模组）、TEE（可信任执行环境）、安全 MCU（微控制器单元）和 SE（安全元件）
• 按硬体类型和用例进行详细细分
• 五大地区各类型设备及终端市场的出货量及收入预测

目录

本产品建议与 "数位身分验证与嵌入式安全性 MD-DAES-114" 和 "数位身分验证与嵌入式安全 物联网网路安全 MD-IOTDAES-104" 配合阅读。

主要发现

新资讯

研究方法

主要预测

Actionable Benefits:

• Identify the optimal Internet of Things (IoT) applications for your embedded authentication technologies.
• Determine the best form factor for your specific embedded systems based on available security features.
• Optimize hardware security strategies in your IoT product development.

Critical Questions Answered:

• Which industries are going to be leveraging hardware-based security?
• Which authentication form factors are Original Equipment Manufacturers (OEMs) going to be favoring?
• Which hardware security technologies are likely to lead for embedded systems?

Research Highlights:

• Market forecast for three primary hardware-based embedded security technologies: Trusted Platform Module (TPM), Trusted Execution Environment (TEE), secure Microcontroller Unit (MCU), and Secure Element (SE).
• A detailed breakdown by hardware type and application use case.
• Shipment and revenue forecasts for each form factor and end market across five regions.

Who Should Read This?

• Semiconductor and silicon Intellectual Property (IP) companies.
• Embedded systems OEMs.
• IoT service providers.

TABLE OF CONTENTS

This product is meant to be read in conjunction with Digital Authentication and Embedded Security MD-DAES-114 and Digital Authentication and Embedded Security IoT Cybersecurity MD-IOTDAES-104

Key Findings

Whats New

Methodology

Significant Forecasts