Product Code: A16421
The space electronics can be identified as electronics components such as microprocessors, controllers, memory chips, and application-specific integrated circuits (ASIC) among others that are designed and developed for application in satellites, rocket launchers, and deep space probes. These electronics are exposed to extreme vibrations, radiation, and other harsh environment in space, posing a demand for radiation treatment that allows them to operate flawlessly in harsh environments. Every space electronics are either radiation-hardened or radiation tolerant, depending upon their scope of application and operator specification. The radiation-hardened segment within the space electronics market will capture the majority of the market share, due to its demand in the conventional market. The radiation tolerant segment within the space electronics market will witness an accelerated growth rate within the forecast period of 2022-2031 backed by a shift in consumer buying behavior and rise in acceptance of commercial off the shelf (COTS) electronics components within the space segment.
The growth in space electronics market is driven by factors such as an increase in investment in space ventures, a rise in launch activities by some of the major private and public players, the establishment of a communication satellite constellation in LEO, and the adoption of space tourism in coming years. Rise in application of satellites for a range of activities such as surveillance, real-time imaging, communication, navigation, weather forecasting, broadband and connectivity, research, development, and testing, and IoT integration for various government, commercial, and civil-military domains is leading to evolution in the space electronics industry. More than 6,000 satellites were expected to be launched within the timeframe of 2020 to 2027 with rising year-on-year launch rates. Rise in satellite launches has generated demand for various satellite electronics components and other peripheral systems, supporting business opportunities.
The space electronics market is segmented on the basis of platform, application, type, component, and region. By platform, it is categorized into satellite, launch vehicles, and deep space probes. Depending on application, it is classified into communication, earth observation, navigation, a global positioning system (GPS) & surveillance, technology development, and education, and others. By type, it is bifurcated into radiation hardened and radiation tolerant. The component segment is divided into microprocessors and controllers, sensors, application specific integrated circuits (ASIC), memory chips, power source and cables, discrete semiconductors, and other. Region-wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Companies have adopted product development and product launch as their key development strategies in the space electronics industry. Moreover, collaborations and acquisitions are expected to enable leading players to enhance their product portfolios and expand into different regions. The key players operating in the space electronics market are BAE Systems, Cobham, Honeywell International Inc., Microsemi Corporation, Texas Instruments, STMicroelectronics, Teledyne e2v (UK) Ltd, TT Electronics, Xilinx Inc., and Ruag Group.
KEY BENEFITS FOR STAKEHOLDERS
- This study presents the analytical depiction of the global space electronics market analysis along with the current trends and future estimations to depict imminent investment pockets.
- The overall space electronics market opportunity is determined by understanding profitable trends to gain a stronger foothold.
- The report presents information related to the key drivers, restraints, and opportunities of the global space electronics market with a detailed impact analysis.
- The current space electronics market is quantitatively analyzed from 2021 to 2031 to benchmark the financial competency.
- Porter's five forces analysis illustrates the potency of the buyers and suppliers in the industry.
Key Market Segments
By Platform
- Satellite
- Launch Vehicles
- Deep Space Probes
By Application
- Communication
- Earth Observation
- Navigation, Global Positioning System (GPS) and Surveillance
- Technology Development and Education
- Others
By Type
- Radiation Hardened
- Radiation Tolerant
By Component
- Microprocessors and Controllers
- Sensors
- Application Specific Integrated Circuits (ASIC)
- Memory Chips
- Power Source and Cables
- Discrete Semiconductors
- Other
By Region
- North America
- Europe
- Germany
- France
- Italy
- Spain
- Russia
- U.K.
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
- Key Market Players
- BAE System
- Cobham Limited
- Honeywell International Inc.
- Microchip Technology Inc
- RUAG Group
- STMicroelectronics
- Teledyne Technologies Incorporated
- Texas Instruments Incorporated
- TT Electronics
- Xilinx, Inc
TABLE OF CONTENTS
CHAPTER 1:INTRODUCTION
- 1.1.Report description
- 1.2.Key market segments
- 1.3.Key benefits to the stakeholders
- 1.4.Research Methodology
- 1.4.1.Secondary research
- 1.4.2.Primary research
- 1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
- 2.1.Key findings of the study
- 2.2.CXO Perspective
CHAPTER 3:MARKET OVERVIEW
- 3.1.Market definition and scope
- 3.2.Key findings
- 3.2.1.Top investment pockets
- 3.3.Porter's five forces analysis
- 3.4.Top player positioning
- 3.5.Market dynamics
- 3.5.1.Drivers
- 3.5.2.Restraints
- 3.5.3.Opportunities
- 3.6.COVID-19 Impact Analysis on the market
CHAPTER 4: SPACE ELECTRONICS MARKET, BY PLATFORM
- 4.1 Overview
- 4.1.1 Market size and forecast
- 4.2 Satellite
- 4.2.1 Key market trends, growth factors and opportunities
- 4.2.2 Market size and forecast, by region
- 4.2.3 Market analysis by country
- 4.3 Launch Vehicles
- 4.3.1 Key market trends, growth factors and opportunities
- 4.3.2 Market size and forecast, by region
- 4.3.3 Market analysis by country
- 4.4 Deep Space Probes
- 4.4.1 Key market trends, growth factors and opportunities
- 4.4.2 Market size and forecast, by region
- 4.4.3 Market analysis by country
CHAPTER 5: SPACE ELECTRONICS MARKET, BY APPLICATION
- 5.1 Overview
- 5.1.1 Market size and forecast
- 5.2 Communication
- 5.2.1 Key market trends, growth factors and opportunities
- 5.2.2 Market size and forecast, by region
- 5.2.3 Market analysis by country
- 5.3 Earth Observation
- 5.3.1 Key market trends, growth factors and opportunities
- 5.3.2 Market size and forecast, by region
- 5.3.3 Market analysis by country
- 5.4 Navigation, Global Positioning System (GPS) and Surveillance
- 5.4.1 Key market trends, growth factors and opportunities
- 5.4.2 Market size and forecast, by region
- 5.4.3 Market analysis by country
- 5.5 Technology Development and Education
- 5.5.1 Key market trends, growth factors and opportunities
- 5.5.2 Market size and forecast, by region
- 5.5.3 Market analysis by country
- 5.6 Others
- 5.6.1 Key market trends, growth factors and opportunities
- 5.6.2 Market size and forecast, by region
- 5.6.3 Market analysis by country
CHAPTER 6: SPACE ELECTRONICS MARKET, BY TYPE
- 6.1 Overview
- 6.1.1 Market size and forecast
- 6.2 Radiation Hardened
- 6.2.1 Key market trends, growth factors and opportunities
- 6.2.2 Market size and forecast, by region
- 6.2.3 Market analysis by country
- 6.3 Radiation Tolerant
- 6.3.1 Key market trends, growth factors and opportunities
- 6.3.2 Market size and forecast, by region
- 6.3.3 Market analysis by country
CHAPTER 7: SPACE ELECTRONICS MARKET, BY COMPONENT
- 7.1 Overview
- 7.1.1 Market size and forecast
- 7.2 Microprocessors and Controllers
- 7.2.1 Key market trends, growth factors and opportunities
- 7.2.2 Market size and forecast, by region
- 7.2.3 Market analysis by country
- 7.3 Sensors
- 7.3.1 Key market trends, growth factors and opportunities
- 7.3.2 Market size and forecast, by region
- 7.3.3 Market analysis by country
- 7.4 Application Specific Integrated Circuits (ASIC)
- 7.4.1 Key market trends, growth factors and opportunities
- 7.4.2 Market size and forecast, by region
- 7.4.3 Market analysis by country
- 7.5 Memory Chips
- 7.5.1 Key market trends, growth factors and opportunities
- 7.5.2 Market size and forecast, by region
- 7.5.3 Market analysis by country
- 7.6 Power Source and Cables
- 7.6.1 Key market trends, growth factors and opportunities
- 7.6.2 Market size and forecast, by region
- 7.6.3 Market analysis by country
- 7.7 Discrete Semiconductors
- 7.7.1 Key market trends, growth factors and opportunities
- 7.7.2 Market size and forecast, by region
- 7.7.3 Market analysis by country
- 7.8 Other
- 7.8.1 Key market trends, growth factors and opportunities
- 7.8.2 Market size and forecast, by region
- 7.8.3 Market analysis by country
CHAPTER 8: SPACE ELECTRONICS MARKET, BY REGION
- 8.1 Overview
- 8.1.1 Market size and forecast
- 8.2 North America
- 8.2.1 Key trends and opportunities
- 8.2.2 North America Market size and forecast, by Platform
- 8.2.3 North America Market size and forecast, by Application
- 8.2.4 North America Market size and forecast, by Type
- 8.2.5 North America Market size and forecast, by Component
- 8.2.6 North America Market size and forecast, by country
- 8.2.6.1 U.S.
- 8.2.6.1.1 Market size and forecast, by Platform
- 8.2.6.1.2 Market size and forecast, by Application
- 8.2.6.1.3 Market size and forecast, by Type
- 8.2.6.1.4 Market size and forecast, by Component
- 8.2.6.2 Canada
- 8.2.6.2.1 Market size and forecast, by Platform
- 8.2.6.2.2 Market size and forecast, by Application
- 8.2.6.2.3 Market size and forecast, by Type
- 8.2.6.2.4 Market size and forecast, by Component
- 8.2.6.3 Mexico
- 8.2.6.3.1 Market size and forecast, by Platform
- 8.2.6.3.2 Market size and forecast, by Application
- 8.2.6.3.3 Market size and forecast, by Type
- 8.2.6.3.4 Market size and forecast, by Component
- 8.3 Europe
- 8.3.1 Key trends and opportunities
- 8.3.2 Europe Market size and forecast, by Platform
- 8.3.3 Europe Market size and forecast, by Application
- 8.3.4 Europe Market size and forecast, by Type
- 8.3.5 Europe Market size and forecast, by Component
- 8.3.6 Europe Market size and forecast, by country
- 8.3.6.1 Germany
- 8.3.6.1.1 Market size and forecast, by Platform
- 8.3.6.1.2 Market size and forecast, by Application
- 8.3.6.1.3 Market size and forecast, by Type
- 8.3.6.1.4 Market size and forecast, by Component
- 8.3.6.2 France
- 8.3.6.2.1 Market size and forecast, by Platform
- 8.3.6.2.2 Market size and forecast, by Application
- 8.3.6.2.3 Market size and forecast, by Type
- 8.3.6.2.4 Market size and forecast, by Component
- 8.3.6.3 Italy
- 8.3.6.3.1 Market size and forecast, by Platform
- 8.3.6.3.2 Market size and forecast, by Application
- 8.3.6.3.3 Market size and forecast, by Type
- 8.3.6.3.4 Market size and forecast, by Component
- 8.3.6.4 Spain
- 8.3.6.4.1 Market size and forecast, by Platform
- 8.3.6.4.2 Market size and forecast, by Application
- 8.3.6.4.3 Market size and forecast, by Type
- 8.3.6.4.4 Market size and forecast, by Component
- 8.3.6.5 Russia
- 8.3.6.5.1 Market size and forecast, by Platform
- 8.3.6.5.2 Market size and forecast, by Application
- 8.3.6.5.3 Market size and forecast, by Type
- 8.3.6.5.4 Market size and forecast, by Component
- 8.3.6.6 U.K.
- 8.3.6.6.1 Market size and forecast, by Platform
- 8.3.6.6.2 Market size and forecast, by Application
- 8.3.6.6.3 Market size and forecast, by Type
- 8.3.6.6.4 Market size and forecast, by Component
- 8.3.6.7 Rest of Europe
- 8.3.6.7.1 Market size and forecast, by Platform
- 8.3.6.7.2 Market size and forecast, by Application
- 8.3.6.7.3 Market size and forecast, by Type
- 8.3.6.7.4 Market size and forecast, by Component
- 8.4 Asia-Pacific
- 8.4.1 Key trends and opportunities
- 8.4.2 Asia-Pacific Market size and forecast, by Platform
- 8.4.3 Asia-Pacific Market size and forecast, by Application
- 8.4.4 Asia-Pacific Market size and forecast, by Type
- 8.4.5 Asia-Pacific Market size and forecast, by Component
- 8.4.6 Asia-Pacific Market size and forecast, by country
- 8.4.6.1 China
- 8.4.6.1.1 Market size and forecast, by Platform
- 8.4.6.1.2 Market size and forecast, by Application
- 8.4.6.1.3 Market size and forecast, by Type
- 8.4.6.1.4 Market size and forecast, by Component
- 8.4.6.2 India
- 8.4.6.2.1 Market size and forecast, by Platform
- 8.4.6.2.2 Market size and forecast, by Application
- 8.4.6.2.3 Market size and forecast, by Type
- 8.4.6.2.4 Market size and forecast, by Component
- 8.4.6.3 Japan
- 8.4.6.3.1 Market size and forecast, by Platform
- 8.4.6.3.2 Market size and forecast, by Application
- 8.4.6.3.3 Market size and forecast, by Type
- 8.4.6.3.4 Market size and forecast, by Component
- 8.4.6.4 South Korea
- 8.4.6.4.1 Market size and forecast, by Platform
- 8.4.6.4.2 Market size and forecast, by Application
- 8.4.6.4.3 Market size and forecast, by Type
- 8.4.6.4.4 Market size and forecast, by Component
- 8.4.6.5 Rest of Asia-Pacific
- 8.4.6.5.1 Market size and forecast, by Platform
- 8.4.6.5.2 Market size and forecast, by Application
- 8.4.6.5.3 Market size and forecast, by Type
- 8.4.6.5.4 Market size and forecast, by Component
- 8.5 LAMEA
- 8.5.1 Key trends and opportunities
- 8.5.2 LAMEA Market size and forecast, by Platform
- 8.5.3 LAMEA Market size and forecast, by Application
- 8.5.4 LAMEA Market size and forecast, by Type
- 8.5.5 LAMEA Market size and forecast, by Component
- 8.5.6 LAMEA Market size and forecast, by country
- 8.5.6.1 Latin America
- 8.5.6.1.1 Market size and forecast, by Platform
- 8.5.6.1.2 Market size and forecast, by Application
- 8.5.6.1.3 Market size and forecast, by Type
- 8.5.6.1.4 Market size and forecast, by Component
- 8.5.6.2 Middle East
- 8.5.6.2.1 Market size and forecast, by Platform
- 8.5.6.2.2 Market size and forecast, by Application
- 8.5.6.2.3 Market size and forecast, by Type
- 8.5.6.2.4 Market size and forecast, by Component
- 8.5.6.3 Africa
- 8.5.6.3.1 Market size and forecast, by Platform
- 8.5.6.3.2 Market size and forecast, by Application
- 8.5.6.3.3 Market size and forecast, by Type
- 8.5.6.3.4 Market size and forecast, by Component
CHAPTER 9: COMPANY LANDSCAPE
- 9.1. Introduction
- 9.2. Top winning strategies
- 9.3. Product Mapping of Top 10 Player
- 9.4. Competitive Dashboard
- 9.5. Competitive Heatmap
- 9.6. Key developments
CHAPTER 10: COMPANY PROFILES
- 10.1 BAE System
- 10.1.1 Company overview
- 10.1.2 Company snapshot
- 10.1.3 Operating business segments
- 10.1.4 Product portfolio
- 10.1.5 Business performance
- 10.1.6 Key strategic moves and developments
- 10.2 Cobham Limited
- 10.2.1 Company overview
- 10.2.2 Company snapshot
- 10.2.3 Operating business segments
- 10.2.4 Product portfolio
- 10.2.5 Business performance
- 10.2.6 Key strategic moves and developments
- 10.3 Honeywell International Inc.
- 10.3.1 Company overview
- 10.3.2 Company snapshot
- 10.3.3 Operating business segments
- 10.3.4 Product portfolio
- 10.3.5 Business performance
- 10.3.6 Key strategic moves and developments
- 10.4 Microchip Technology Inc
- 10.4.1 Company overview
- 10.4.2 Company snapshot
- 10.4.3 Operating business segments
- 10.4.4 Product portfolio
- 10.4.5 Business performance
- 10.4.6 Key strategic moves and developments
- 10.5 RUAG Group
- 10.5.1 Company overview
- 10.5.2 Company snapshot
- 10.5.3 Operating business segments
- 10.5.4 Product portfolio
- 10.5.5 Business performance
- 10.5.6 Key strategic moves and developments
- 10.6 STMicroelectronics
- 10.6.1 Company overview
- 10.6.2 Company snapshot
- 10.6.3 Operating business segments
- 10.6.4 Product portfolio
- 10.6.5 Business performance
- 10.6.6 Key strategic moves and developments
- 10.7 Teledyne Technologies Incorporated
- 10.7.1 Company overview
- 10.7.2 Company snapshot
- 10.7.3 Operating business segments
- 10.7.4 Product portfolio
- 10.7.5 Business performance
- 10.7.6 Key strategic moves and developments
- 10.8 Texas Instruments Incorporated
- 10.8.1 Company overview
- 10.8.2 Company snapshot
- 10.8.3 Operating business segments
- 10.8.4 Product portfolio
- 10.8.5 Business performance
- 10.8.6 Key strategic moves and developments
- 10.9 TT Electronics
- 10.9.1 Company overview
- 10.9.2 Company snapshot
- 10.9.3 Operating business segments
- 10.9.4 Product portfolio
- 10.9.5 Business performance
- 10.9.6 Key strategic moves and developments
- 10.10 Xilinx, Inc
- 10.10.1 Company overview
- 10.10.2 Company snapshot
- 10.10.3 Operating business segments
- 10.10.4 Product portfolio
- 10.10.5 Business performance
- 10.10.6 Key strategic moves and developments