Product Code: ANV3426
REPORT HIGHLIGHT
Package Substrate Market was valued at USD 4,208.32 million in 2023, expanding at a CAGR of 5.10% from 2024 to 2032.
The substrate of the package establishes electrical connections between the chip and various circuits on the traditional PCB, while also offering protection, structural support, heat dissipation pathways for the chip, and ensuring compliance with standard installation dimensions. In recent years, technological advancements have led to a significant increase in the utilization of semiconductor package substrates such as BGA, CSP, and flip-chip (FC) across various industries. These semiconductor packaging materials are crucial in safeguarding IC chips from external factors and facilitating the electrical connection required for mounting the chips on printed wiring boards.
Package Substrate Market- Market Dynamics
The market is anticipated to experience growth due to the emergence of electric and autonomous vehicles, as well as advancements in mobile technology
Electric and autonomous vehicles necessitate advanced electronic systems, leading to a growing need for high-performance package substrates to guarantee effective electrical connections and overall device performance. The International Energy Agency reports that the electric car market is experiencing strong growth, with sales approaching 14 million in 2023. The proportion of electric cars in total sales has risen from approximately 4% in 2020 to 18% in 2023. Furthermore, ongoing developments in mobile technology, such as the evolution of 5G networks and more powerful mobile processors, are driving the demand for sophisticated package substrates. These substrates play a critical role in ensuring efficient electrical connections and overall device performance. Nevertheless, the expansion of network infrastructure, particularly in developing regions, is fueling the need for high-performance package substrates. Additionally, high manufacturing costs could impede market growth.
Package Substrate Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 5.10% over the forecast period (2024-2032)
Based on Type segmentation, FCCSP was predicted to show maximum market share in the year 2023
Based on Application segmentation, Mobile Devices was the leading type in 2023
Based on region, Asia Pacific was the leading revenue generator in 2023
Package Substrate Market- Segmentation Analysis:
The Global Package Substrate Market is segmented based on Type, Application, and Region.
The market is segmented into five categories according to Type: FCCSP, WBCSP, SiP, BOC, and FCBGA. FCCSP leads the market. FCCSP allows for the development of smaller and more condensed semiconductor packages, a key requirement for contemporary electronic devices with advanced functionality in constrained spaces.
The market is segmented into two categories according to Application: Mobile Devices, Automotive Industry, and Other sectors. Mobile Devices hold the largest market share. With the increasing power of mobile devices, effectively managing heat dissipation poses a growing challenge, necessitating ongoing innovation in substrate materials and designs.
Package Substrate Market- Geographical Insights
The market is geographically spread across North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. These regions are further segmented by countries contributing to business activities. Asia Pacific stands out as the dominant market, driven by the increasing demand for consumer electronics. With a significant portion of the global population residing in the Asia Pacific region, there is a high demand for consumer electronics. China leads as the largest producer and exporter of consumer electronics worldwide, boasting the most extensive electronics manufacturing ecosystem with a labor force of nearly 150 million workers in the electrical goods sector. Following closely, Europe is the second-largest region for market growth, attributed to the growing industrial automation sector and the necessity for durable electronic components.
Package Substrate Market- Competitive Landscape:
The competitive landscape of the Package Substrate Market is shaped by technological advancements, product innovations, manufacturing capabilities, and strategic partnerships. Firms allocate significant resources to research and development to create cutting-edge substrates that deliver superior performance, miniaturization, and reliability. The introduction of new materials such as organic substrates, along with innovative manufacturing methods like Fan-Out Wafer Level Packaging (FOWLP), plays a crucial role in maintaining a competitive advantage. Companies that offer customized solutions tailored to meet specific customer needs and provide strong technical support employ essential competitive strategies. These approaches help in establishing enduring relationships with key clients and gaining a deeper insight into market demands.
Recent Developments:
Fujitsu announced on Tuesday that it will be selling its Tokyo-listed semiconductor packaging unit, Shinko Electric Industries, to a consortium led by Japan Investment Corp. This move is part of the company's efforts to divest noncore units, and the deal is valued at 700 billion yen (USD4.8 billion).
Amkor Technology is increasing its production capacity for advanced packaging, aiming to produce 5,000 wafers of 2.5D packaging per month by the first half of 2024. This is a significant increase from the 3,000 units produced in early 2023, as reported by industry sources.
SCOPE OF THE REPORT
The scope of this report covers the market by its major segments, which include as follows:
GLOBAL PACKAGE SUBSTRATE MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS
Amkor Technology
ASE Group
AT&S AG
Daeduck
Eastern
Fujitsu
Hitachi
Ibiden Co., Ltd.
Kinsus
Kyocera
LG Innotek
Nan Ya Printed Circuit Board Corporation
Samsung Electro-Mechanics
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries
Simmtech
TTM Technologies
Unimicron Technology Corporation
Zhen Ding Technology
Others
GLOBAL PACKAGE SUBSTRATE MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032
- FCCSP
- WBCSP
- SiP
- BOC
- FCBGA
GLOBAL PACKAGE SUBSTRATE MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032
- Mobile Devices
- Automotive Industry
- Others
GLOBAL PACKAGE SUBSTRATE MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032
- North America
- The U.S.
- Canada
- Europe
- Germany
- France
- Italy
- Spain
- United Kingdom
- Russia
- Netherlands
- Sweden
- Poland
- Rest of Europe
- Asia Pacific
- India
- China
- South Korea
- Japan
- Australia
- Thailand
- Indonesia
- Philippines
- Rest of APAC
- Latin America
- Brazil
- Mexico
- Argentina
- Colombia
- Rest of LATAM
- The Middle East and Africa
- Saudi Arabia
- United Arab Emirates
- Israel
- Turkey
- Algeria
- Egypt
- Rest of MEA
Table of Contents
1. Package Substrate Market Overview
- 1.1. Study Scope
- 1.2. Market Estimation Years
2. Executive Summary
- 2.1. Market Snippet
- 2.1.1. Package Substrate Market Snippet by Type
- 2.1.2. Package Substrate Market Snippet by Application
- 2.1.3. Package Substrate Market Snippet by Country
- 2.1.4. Package Substrate Market Snippet by Region
- 2.2. Competitive Insights
3. Package Substrate Key Market Trends
- 3.1. Package Substrate Market Drivers
- 3.1.1. Impact Analysis of Market Drivers
- 3.2. Package Substrate Market Restraints
- 3.2.1. Impact Analysis of Market Restraints
- 3.3. Package Substrate Market Opportunities
- 3.4. Package Substrate Market Future Trends
4. Package Substrate Industry Study
- 4.1. PEST Analysis
- 4.2. Porter's Five Forces Analysis
- 4.3. Growth Prospect Mapping
- 4.4. Regulatory Framework Analysis
5. Package Substrate Market: COVID-19 Impact Analysis
- 5.1. Pre-COVID-19 Impact Analysis
- 5.2. Post-COVID-19 Impact Analysis
- 5.2.1. Top Performing Segments
- 5.2.2. Marginal Growth Segments
- 5.2.3. Top Looser Segments
- 5.2.4. Marginal Loss Segments
6. Package Substrate Market Landscape
- 6.1. Package Substrate Market Share Analysis, 2022
- 6.2. Breakdown Data, by Key Manufacturer
- 6.2.1. Established Players' Analysis
- 6.2.2. Emerging Players' Analysis
7. Package Substrate Market - By Type
- 7.1. Overview
- 7.1.1. Segment Share Analysis, By Type, 2022 & 2030 (%)
- 7.1.2. FCCSP
- 7.1.3. WBCSP
- 7.1.4. SiP
- 7.1.5. BOC
- 7.1.6. FCBGA
8. Package Substrate Market - By Application
- 8.1. Overview
- 8.1.1. Segment Share Analysis, By Application, 2022 & 2030 (%)
- 8.1.2. Mobile Devices
- 8.1.3. Automotive Industry
- 8.1.4. Others
9. Package Substrate Market- By Geography
- 9.1. Introduction
- 9.1.1. Segment Share Analysis, By Geography, 2022 & 2030 (%)
- 9.2. North America
- 9.2.1. Overview
- 9.2.2. Package Substrate Key Manufacturers in North America
- 9.2.3. North America Market Size and Forecast, By Country, 2018 - 2030 (US$ Million)
- 9.2.4. North America Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.2.5. North America Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.2.6. U.S.
- 9.2.6.1. Overview
- 9.2.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.2.6.3. U.S. Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.2.6.4. U.S. Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.2.7. Canada
- 9.2.7.1. Overview
- 9.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.2.7.3. Canada Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.2.7.4. Canada Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3. Europe
- 9.3.1. Overview
- 9.3.2. Package Substrate Key Manufacturers in Europe
- 9.3.3. Europe Market Size and Forecast, By Country, 2018 - 2030 (US$ Million)
- 9.3.4. Europe Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.5. Europe Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.6. Germany
- 9.3.6.1. Overview
- 9.3.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.6.3. Germany Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.6.4. Germany Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.7. Italy
- 9.3.7.1. Overview
- 9.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.7.3. Italy Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.7.4. Italy Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.8. United Kingdom
- 9.3.8.1. Overview
- 9.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.8.3. United Kingdom Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.8.4. United Kingdom Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.9. France
- 9.3.9.1. Overview
- 9.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.9.3. France Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.9.4. France Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.10. Russia
- 9.3.10.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.10.2. Russia Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.10.3. Russia Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.11. Netherlands
- 9.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.11.2. Netherlands Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.11.3. Netherlands Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.12. Sweden
- 9.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.12.2. Sweden Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.12.3. Sweden Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.13. Poland
- 9.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.13.2. Poland Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.13.3. Poland Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.3.14. Rest of Europe
- 9.3.14.1. Overview
- 9.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.3.14.3. Rest of the Europe Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.3.14.4. Rest of the Europe Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4. Asia Pacific (APAC)
- 9.4.1. Overview
- 9.4.2. Package Substrate Key Manufacturers in Asia Pacific
- 9.4.3. Asia Pacific Market Size and Forecast, By Country, 2018 - 2030 (US$ Million)
- 9.4.4. Asia Pacific Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.5. Asia Pacific Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.6. India
- 9.4.6.1. Overview
- 9.4.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.6.3. India Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.6.4. India Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.7. China
- 9.4.7.1. Overview
- 9.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.7.3. China Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.7.4. China Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.8. Japan
- 9.4.8.1. Overview
- 9.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.8.3. Japan Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.8.4. Japan Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.9. South Korea
- 9.4.9.1. Overview
- 9.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.9.3. South Korea Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.9.4. South Korea Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.10. Australia
- 9.4.10.1. Overview
- 9.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.10.3. Australia Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.10.4. Australia Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.11. Thailand
- 9.4.11.1. Overview
- 9.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.11.3. Thailand Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.11.4. Thailand Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.12. Indonesia
- 9.4.12.1. Overview
- 9.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.12.3. Indonesia Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.12.4. Indonesia Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.13. Philippines
- 9.4.13.1. Overview
- 9.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.13.3. Philippines Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.13.4. Philippines Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.4.14. Rest of APAC
- 9.4.14.1. Overview
- 9.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.4.14.3. Rest of APAC Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.4.14.4. Rest of APAC Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5. Latin America
- 9.5.1. Overview
- 9.5.2. Package Substrate Key Manufacturers in Latin America
- 9.5.3. Latin America Market Size and Forecast, By Country, 2018 - 2030 (US$ Million)
- 9.5.4. Latin America Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.5. Latin America Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5.6. Brazil
- 9.5.6.1. Overview
- 9.5.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.5.6.3. Brazil Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.6.4. Brazil Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5.7. Mexico
- 9.5.7.1. Overview
- 9.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.5.7.3. Mexico Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.7.4. Mexico Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5.8. Argentina
- 9.5.8.1. Overview
- 9.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.5.8.3. Argentina Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.8.4. Argentina Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5.9. Colombia
- 9.5.9.1. Overview
- 9.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.5.9.3. Colombia Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.9.4. Colombia Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.5.10. Rest of LATAM
- 9.5.10.1. Overview
- 9.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.5.10.3. Rest of LATAM Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.5.10.4. Rest of LATAM Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6. Middle East and Africa
- 9.6.1. Overview
- 9.6.2. Package Substrate Key Manufacturers in Middle East and Africa
- 9.6.3. Middle East and Africa Market Size and Forecast, By Country, 2018 - 2030 (US$ Million)
- 9.6.4. Middle East and Africa Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.5. Middle East and Africa Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.6. Saudi Arabia
- 9.6.6.1. Overview
- 9.6.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.6.3. Saudi Arabia Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.6.4. Saudi Arabia Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.7. United Arab Emirates
- 9.6.7.1. Overview
- 9.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.7.3. United Arab Emirates Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.7.4. United Arab Emirates Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.8. Israel
- 9.6.8.1. Overview
- 9.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.8.3. Israel Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.8.4. Israel Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.9. Turkey
- 9.6.9.1. Overview
- 9.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.9.3. Turkey Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.9.4. Turkey Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.10. Algeria
- 9.6.10.1. Overview
- 9.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.10.3. Algeria Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.10.4. Algeria Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.11. Egypt
- 9.6.11.1. Overview
- 9.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.11.3. Egypt Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.11.4. Egypt Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
- 9.6.12. Rest of MEA
- 9.6.12.1. Overview
- 9.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2018 - 2030, (US$ Million)
- 9.6.12.3. Rest of MEA Market Size and Forecast, By Type, 2018 - 2030 (US$ Million)
- 9.6.12.4. Rest of MEA Market Size and Forecast, By Application, 2018 - 2030 (US$ Million)
10. Key Vendor Analysis- Package Substrate Industry
- 10.1. Competitive Dashboard
- 10.2. Company Profiles
- 10.2.1. Amkor Technology
- 10.2.2. ASE Group
- 10.2.3. AT&S AG
- 10.2.4. Daeduck
- 10.2.5. Eastern
- 10.2.6. Fujitsu
- 10.2.7. Hitachi
- 10.2.8. Ibiden Co., Ltd.
- 10.2.9. Kinsus
- 10.2.10. Kyocera
- 10.2.11. LG Innotek
- 10.2.12. Nan Ya Printed Circuit Board Corporation
- 10.2.13. Samsung Electro-Mechanics
- 10.2.14. Shenzhen Fastprint Circuit Tech
- 10.2.15. Shinko Electric Industries
- 10.2.16. Simmtech
- 10.2.17. TTM Technologies
- 10.2.18. Unimicron Technology Corporation
- 10.2.19. Zhen Ding Technology
- 10.2.20. Others
11. 360 Degree Analyst View
12. Appendix
- 12.1. Research Methodology
- 12.2. References
- 12.3. Abbreviations
- 12.4. Disclaimer
- 12.5. Contact Us