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市场调查报告书
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1808862

晶圆背磨胶带市场，按类型、晶圆尺寸、应用、最终用户、国家和地区划分 - 2025 年至 2032 年全球行业分析、市场规模、市场份额及预测

Wafer Backgrinding Tape Market, By Type, By Wafer Size, By Application, By End-user, By Country, and By Region - Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 377 Pages | 商品交期: 2-3个工作天内

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简介目录

2024 年晶圆背磨胶带市场规模价值 2.4512 亿美元，2025 年至 2032 年的复合年增长率为 4.5%。

晶圆背面研磨胶带市场主要围绕半导体製造中晶圆减薄製程中使用的专用胶带。这些胶带可在晶圆研磨至所需厚度的过程中保护精密晶圆免受损坏和污染。晶圆背面研磨胶带不仅具有强大的黏合力，可将晶圆牢固地固定在研磨框架上，还易于去除且不留残留物。它们有助于保持晶圆的完整性，防止晶圆碎裂或开裂，并确保半导体装置生产的高良率和高品质。

随着对更小、更薄、更强大的电子设备的需求不断增长，对高效能背磨胶带的需求也随之增长。这些胶带种类繁多，包括紫外光固化和热释放型，以满足不同的加工要求。半导体产业的扩张推动了市场发展，尤其是在消费性电子、汽车和电信等领域。胶带材料和黏合剂的创新不断提升终端用户的性能，使製造商能够满足日益增长的精度和可靠性标准。总而言之，晶圆背磨胶带是支援先进晶片製造製程的关键材料。

晶圆背磨胶带市场-市场动态

先进半导体设备对超薄晶圆的需求不断成长。

先进半导体装置对超薄晶圆的需求不断成长，是晶圆背磨胶带市场的关键驱动力。随着电子设备变得越来越小、越来越轻、功能越来越强大，製造商需要更薄的晶圆，以便在不影响性能的情况下适应紧凑的设计。超薄晶圆能够实现更好的散热性能、更佳的电气特性，并增强智慧型手机、穿戴式装置和物联网设备等晶圆尺寸的灵活性。

然而，晶圆减薄会增加其脆性，使其在加工过程中更容易出现裂缝和损坏。晶圆背磨胶带在研磨过程中起着至关重要的作用，它能够牢固地固定这些精密的晶圆，保护它们免受机械应力和污染。这种对超薄晶圆的需求推动了背磨胶带的创新，例如开发具有更强附着力和无残留去除能力的胶带。随着半导体製造商致力于满足这些小型化趋势，对先进晶圆背磨胶带的需求持续增长，从而支撑了市场的整体扩张。

晶圆背磨胶带市场－关键洞察

根据我们的研究分析师的分析，预测期内（2025-2032 年）全球市场预计年复合成长率约为 4.5%

根据类型细分，预计 UV 释放将在 2024 年占据最大市场份额

根据晶圆尺寸细分，6至8吋是2024年的主要晶圆尺寸

根据应用细分，半导体製造是 2024 年的领先应用

根据最终用户细分，消费性电子产品在 2024 年占据领先地位

按地区划分，北美是 2024 年最大的收入来源

晶圆背磨胶带市场-細項分析：

全球晶圆背磨胶带市场根据类型、晶圆尺寸、应用、最终用户和地区进行细分。

市场依类型分为两类：UV离型胶带和非UV离型胶带。 UV离型胶带在晶圆背磨胶带市场中占据主导地位。这种主导地位得益于其高效的离型机制，使得研磨製程后易于去除，且不会在晶圆表面留下残留物。 UV离型胶带能够实现精确的晶圆减薄，这对于生产用于先进半导体和电子应用的超薄晶圆至关重要。

它们在背面研磨过程中对精密晶圆的保护性能卓越，深受追求更高良率和品质的製造商青睐。微型化和高性能电子设备需求的不断增长，推动了该领域应用的强劲成长。

根据晶圆尺寸，市场分为三类：6吋以下、6至8吋、8吋以上。 6至8吋晶圆尺寸在晶圆背磨胶带市场中占据主导地位。这种主导地位源于其在半导体製造中的广泛应用，尤其是在消费性电子产品和汽车零件领域。

这些晶圆尺寸在成本效益和生产可扩展性之间实现了平衡，使其成为量产的理想选择。它们与各种製造工具和工艺的兼容性进一步巩固了其领先地位。随着对中型高性能晶片的需求持续增长，该领域保持着强劲的市场吸引力。

晶圆背磨胶带市场-地理洞察

北美凭藉其先进的半导体产业和技术创新，在晶圆背面研磨胶带市场中占据强势地位。受消费性电子产品、电动车和医疗保健设备需求成长的推动，美国在晶圆背面研磨技术的应用方面处于领先地位。加拿大和墨西哥也因製造业活动的增加而稳定成长。该地区对研发的重视，加上主要半导体製造商的布局，推动了晶圆背面研磨胶带解决方案的持续进步和市场扩张。

美国是晶圆背面研磨胶带市场的中心枢纽，这得益于其先进的半导体产业和技术创新。随着智慧型手机、穿戴式装置和电动车等微型电子设备需求的不断增长，晶圆背面研磨技术在美国的快速普及。这些产业需要超薄晶圆，而这需要藉助高品质的背面研磨胶带实现精确且高效的减薄製程。此外，美国政府为支持国内半导体製造业而推出的《晶片法案》（CHIPS Act）等倡议，进一步加剧了对可靠晶圆加工材料的需求。

晶圆背磨胶带市场-竞争格局：

晶圆背磨胶带市场竞争激烈，由专注于创新和品质以满足半导体行业不断变化的需求的知名企业主导。日东电工株式会社、三井化学、琳得科株式会社、古河电工和日本电化株式会社等领先公司在研发方面投入巨资，以提高胶带的附着力、无残留去除性能和耐热性，这些性能对于超薄晶圆加工至关重要。市场竞争推动环保和高性能胶带的不断进步，以支持永续发展趋势。

胶带製造商和半导体製造商之间的策略合作与伙伴关係增强了产品客製化和特定应用解决方案。地域扩张和产能提升也是关键的竞争策略。此外，企业透过卓越的技术支援和客户服务脱颖而出，旨在建立长期合作关係。 AI Technology, Inc. 和 D&X Inc. 等专业利基市场的进入加剧了竞争，鼓励了创新和成本效率。总体而言，竞争格局促进了技术的快速进步，使参与者能够应对晶圆背面研磨的复杂性并保持市场成长。

最新动态：

2023年3月，推出全新系列环保晶圆背磨胶带，增强半导体製造的永续性。

目录

第一章：晶圆背磨胶带市场概述

  • 研究范围
  • 市场估计年限

第二章：执行摘要

  • 市场片段
    • 晶圆背磨胶带市场片段（按类型）
    • 晶圆背磨胶带市场片段（依晶圆尺寸）
    • 晶圆背磨胶带市场应用片段
    • 晶圆背面研磨胶带市场（依最终用户）
    • 晶圆背磨胶带市场（按国家/地区）
    • 晶圆背磨胶带市场（按地区）
  • 竞争洞察

第三章：晶圆背磨胶带主要市场趋势

  • 晶圆背磨胶带市场驱动因素
    • 市场驱动因素的影响分析
  • 晶圆背面研磨胶带市场限制
    • 市场限制的影响分析
  • 晶圆背磨胶带市场机会
  • 晶圆背磨胶带市场未来趋势

第四章：晶圆背磨胶带产业研究

  • PEST分析
  • 波特五力分析
  • 成长前景图
  • 规范架构分析

第五章：晶圆背磨胶带市场：地缘政治紧张局势升级的影响

  • COVID-19 疫情的影响
  • 俄乌战争的影响
  • 中东衝突的影响

第六章：晶圆背磨胶带市场格局

  • 2024年晶圆背磨胶带市占率分析
  • 按主要製造商分類的细分数据
    • 成熟玩家分析
    • 新兴企业分析

第七章：晶圆背磨胶带市场－依类型

  • 概述
    • 按类型分類的细分市场占有率分析
    • 紫外线隔离胶带
    • 非紫外线离型胶带

第八章：晶圆背磨胶带市场－依晶圆尺寸

  • 概述
    • 按晶圆尺寸分類的细分市场份额分析
    • 最大 6 英寸
    • 6到8英寸
    • 8吋以上

第九章：晶圆背磨胶带市场－依应用

  • 概述
    • 按应用细分市场占有率分析
    • 半导体製造
    • LED製造
    • 其他的

第十章：晶圆背磨胶带市场－依最终用户

  • 概述
    • 按晶圆尺寸分類的细分市场份额分析
    • 消费性电子产品
    • 汽车电子
    • 医疗保健和医疗器械
    • 工业电子

第 11 章：晶圆背磨胶带市场-按地区

  • 介绍
    • 按地区分類的细分市场占有率分析
  • 北美洲
    • 概述
    • 北美晶圆背磨胶带主要製造商
    • 北美市场规模及预测（按国家/地区）
    • 北美市场规模和预测（按类型）
    • 北美市场规模及预测（依晶圆尺寸）
    • 北美市场规模和预测（按应用）
    • 北美市场规模及预测（按最终用户）
    • 我们
    • 加拿大
  • 欧洲
    • 概述
    • 欧洲晶圆背磨胶带主要製造商
    • 欧洲市场规模及预测（按国家/地区）
    • 欧洲市场规模与预测（按类型）
    • 欧洲市场规模及预测（依晶圆尺寸）
    • 欧洲市场规模和预测，按应用
    • 欧洲市场规模及预测（按最终用户）
    • 德国
    • 英国
    • 法国
    • 义大利
    • 西班牙
    • 荷兰
    • 瑞典
    • 俄罗斯
    • 波兰
    • 欧洲其他地区
  • 亚太地区 (APAC)
    • 概述
    • 亚太地区晶圆背磨胶带主要製造商
    • 亚太地区市场规模及预测（依国家）
    • 亚太地区市场规模及预测（按类型）
    • 亚太地区市场规模及预测（依晶圆尺寸）
    • 亚太地区市场规模及预测（按应用）
    • 亚太地区市场规模及预测（依最终用户）
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳洲
    • 印尼
    • 泰国
    • 菲律宾
    • 亚太地区其他地区
  • 拉丁美洲（LATAM）
    • 概述
    • 拉丁美洲晶圆背磨胶带主要製造商
    • 拉丁美洲市场规模及预测（按国家/地区）
    • 拉丁美洲市场规模及预测（按类型）
    • 拉丁美洲市场规模及预测（依晶圆尺寸）
    • 拉丁美洲市场规模及预测（按应用）
    • 拉丁美洲市场规模及预测（按最终用户）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥伦比亚
    • 拉丁美洲其他地区
  • 中东和非洲（MEA）
    • 概述
    • 中东和非洲晶圆背磨胶带主要製造商
    • MEA 市场规模及预测（依国家/地区）
    • MEA 市场规模和预测（按类型）
    • MEA市场规模及预测（依晶圆尺寸）
    • MEA 市场规模及预测（按应用）
    • MEA 市场规模及预测（依最终用户）
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 以色列
    • 土耳其
    • 阿尔及利亚
    • 埃及
    • MEA 其余地区

第十二章：晶圆背磨胶带产业主要供应商分析

  • 竞争仪錶板
    • Competitive Benchmarking
    • Competitive Positioning
  • 公司简介
    • Mitsui Chemicals America, Inc.
    • Nitto Denko Corporation
    • Lintec Corporation
    • Furukawa Electric Co., Ltd.
    • Denka Company Limited
    • LG Chem
    • Maxell Corporation
    • D&X Inc.
    • AI Technology, Inc.
    • AMC Co., Ltd.
    • Force-One Applied Materials Inc.
    • Pantech Tape Co., Ltd.
    • Minitron Elektron GmbH
    • NEPTCO, Inc.
    • Sumitomo Bakelite Co., Ltd.
    • Ultron Systems, Inc.
    • Teraoka Seisakusho Co., Ltd.
    • DaehyunST Co., Ltd.
    • QES Group Berhad
    • Advanced Dicing Technologies Ltd.

第 13 章：360 度分析师视角

第 14 章：附录

  • 研究方法
  • 参考
  • 缩写
  • 免责声明
  • 联络我们
简介目录
Product Code: ANV5516

Wafer Backgrinding Tape Market size was valued at US$ 245.12 Million in 2024, expanding at a CAGR of 4.5% from 2025 to 2032.

The Wafer Backgrinding Tape Market revolves around specialized adhesive tapes used during the wafer thinning process in semiconductor manufacturing. These tapes protect delicate wafers from damage and contamination while they are ground down to achieve the desired thickness. Wafer backgrinding tapes provide strong adhesion to hold the wafer securely on the grinding frame but also allow for easy removal without leaving residue. They help maintain wafer integrity, prevent chipping or cracking, and ensure high yield and quality in semiconductor device production.

As demand for smaller, thinner, and more powerful electronic devices grows, the need for efficient backgrinding tapes has increased. These tapes come in various types, including UV-curable and thermal release variants, to suit different processing requirements. The market is driven by the expansion of the semiconductor industry, especially in areas like consumer electronics, automotive, and telecommunications. Innovations in tape materials and adhesive End-user continue to improve performance, enabling manufacturers to meet the rising precision and reliability standards. Overall, wafer backgrinding tapes are critical materials supporting advanced chip manufacturing processes.

Wafer Backgrinding Tape Market- Market Dynamics

Rising demand for ultra-thin wafers in advanced semiconductor devices.

The rising demand for ultra-thin wafers in advanced semiconductor devices is a key driver for the wafer backgrinding tape market. As electronic devices become smaller, lighter, and more powerful, manufacturers require wafers that are thinner to fit into compact designs without compromising performance. Ultra-thin wafers enable better heat dissipation, improved electrical characteristics, and enhanced flexibility for Wafer Sizes like smartphones, wearables, and IoT devices.

However, thinning wafers increases their fragility, making them more prone to cracks and damage during processing. Wafer backgrinding tapes play a crucial role in securely holding these delicate wafers during the grinding process, protecting them from mechanical stress and contamination. This demand for ultra-thin wafers pushes innovation in backgrinding tape End-user, such as developing tapes with stronger adhesion and residue-free removal. As semiconductor manufacturers aim to meet these miniaturization trends, the need for advanced wafer backgrinding tapes continues to grow, supporting the overall expansion of the market.

Wafer Backgrinding Tape Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.5% over the forecast period (2025-2032)

Based on Type segmentation, UV Release was predicted to show maximum market share in the year 2024

Based on Wafer Size segmentation, 6 to 8 inches was the leading Wafer Size in 2024

Based on Application segmentation, Semiconductor Manufacturing was the leading Application in 2024

Based on End-user segmentation, Consumer Electronics was the leading in 2024End-user

On the basis of region, North America was the leading revenue generator in 2024

Wafer Backgrinding Tape Market- Segmentation Analysis:

The Global Wafer Backgrinding Tape Market is segmented on the basis of Type, Wafer Size, Application, End-user, and Region.

The market is divided into two categories based on Type: UV Release Tape, Non-UV Release Tape. The UV Release Tape segment is the most dominant in the wafer backgrinding tape market. This dominance is due to its efficient release mechanism, which allows for easy removal after the grinding process without leaving residue on the wafer surface. UV release tapes enable precise wafer thinning, which is crucial for producing ultra-thin wafers used in advanced semiconductor and electronic applications.

Their superior performance in protecting delicate wafers during backgrinding makes them highly preferred by manufacturers aiming for higher yield and quality. This segment's strong adoption is driven by the increasing demand for miniaturized and high-performance electronic devices.

The market is divided into Three categories based on Wafer Size: Up to 6 inches, 6 to 8 inches, above 8 inches. The 6 to 8 inches wafer size segment is the most dominant in the wafer backgrinding tape market. This dominance stems from its widespread use in semiconductor manufacturing, particularly for consumer electronics and automotive components.

These wafer sizes offer a balance between cost-efficiency and production scalability, making them ideal for mass production. Their compatibility with a wide range of fabrication tools and processes further supports their leading position. As demand for mid-sized, high-performance chips continues, this segment maintains strong market traction.

Wafer Backgrinding Tape Market- Geographical Insights

North America holds a strong position in the wafer backgrinding tape market due to its advanced semiconductor industry and technological innovation. The United States leads adoption of wafer backgrinding technologies, driven by growing demand in consumer electronics, electric vehicles, and healthcare devices. Canada and Mexico are also witnessing steady growth supported by increasing manufacturing activities. The region's focus on research and development, along with the presence of major semiconductor manufacturers, fuels ongoing advancements and market expansion in wafer backgrinding tape solutions.

The United States stands as a central hub in the wafer backgrinding tape market, driven by its advanced semiconductor industry and technological innovations. The nation's rapid adoption of wafer backgrinding technologies is propelled by the escalating demand for miniaturized electronic devices, including smartphones, wearables, and electric vehicles. These sectors necessitate ultra-thin wafers, which require precise and efficient thinning processes facilitated by high-quality backgrinding tapes. Moreover, the U.S. government's initiatives to bolster domestic semiconductor manufacturing, such as the CHIPS Act, have further intensified the need for reliable wafer processing materials.

Wafer Backgrinding Tape Market- Competitive Landscape:

The wafer backgrinding tape market is highly competitive, dominated by established players focusing on innovation and quality to meet the evolving demands of the semiconductor industry. Leading companies such as Nitto Denko Corporation, Mitsui Chemicals, Lintec Corporation, Furukawa Electric, and Denka Company Limited invest significantly in research and development to improve tape adhesion, residue-free removal, and heat resistance, which are critical for ultra-thin wafer processing. The market competition drives continuous advancements in eco-friendly and high-performance tapes to support sustainability trends.

Strategic collaborations and partnerships among tape manufacturers and semiconductor fabricators enhance product customization and application-specific solutions. Geographic expansion and increased production capacities also serve as key competitive strategies. Additionally, companies differentiate themselves through superior technical support and customer service, aiming to build long-term relationships. The entry of specialized niche players such as AI Technology, Inc. and D&X Inc. intensifies competition, encouraging innovation and cost efficiency. Overall, the competitive landscape fosters rapid technological progress, enabling players to address the complexities of wafer backgrinding and sustain market growth.

Recent Developments:

In March 2023, introduced a new series of eco-friendly wafer backgrinding tapes, enhancing sustainability in semiconductor manufacturing.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL WAFER BACKGRINDING TAPE MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Mitsui Chemicals America, Inc.
  • Nitto Denko Corporation
  • Lintec Corporation
  • Furukawa Electric Co., Ltd.
  • Denka Company Limited
  • LG Chem
  • Maxell Corporation
  • D&X Inc.
  • AI Technology, Inc.
  • AMC Co., Ltd.
  • Force-One Applied Materials Inc.
  • Pantech Tape Co., Ltd.
  • Minitron Elektron GmbH
  • NEPTCO, Inc.
  • Sumitomo Bakelite Co., Ltd.
  • Ultron Systems, Inc.
  • Teraoka Seisakusho Co., Ltd.
  • DaehyunST Co., Ltd.
  • QES Group Berhad
  • Advanced Dicing Technologies Ltd.

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032

  • UV Release Tape
  • Non-UV Release Tape

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE- MARKET ANALYSIS, 2019 - 2032

  • Up to 6 inches
  • 6 to 8 inches
  • Above 8 inches

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

  • Semiconductor Manufacturing
  • LED Manufacturing
  • Others

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • Consumer Electronics
  • Automotive Electronics
  • Healthcare & Medical Devices
  • Industrial Electronics

GLOBAL WAFER BACKGRINDING TAPE MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Wafer Backgrinding Tape Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Wafer Backgrinding Tape Market Snippet by Type
    • 2.1.2. Wafer Backgrinding Tape Market Snippet by Wafer Size
    • 2.1.3. Wafer Backgrinding Tape Market Snippet by Application
    • 2.1.4. Wafer Backgrinding Tape Market Snippet by End-user
    • 2.1.5. Wafer Backgrinding Tape Market Snippet by Country
    • 2.1.6. Wafer Backgrinding Tape Market Snippet by Region
  • 2.2. Competitive Insights

3. Wafer Backgrinding Tape Key Market Trends

  • 3.1. Wafer Backgrinding Tape Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Wafer Backgrinding Tape Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Wafer Backgrinding Tape Market Opportunities
  • 3.4. Wafer Backgrinding Tape Market Future Trends

4. Wafer Backgrinding Tape Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Wafer Backgrinding Tape Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Wafer Backgrinding Tape Market Landscape

  • 6.1. Wafer Backgrinding Tape Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Wafer Backgrinding Tape Market - By Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Type, 2024 & 2032 (%)
    • 7.1.2. UV Release Tape
    • 7.1.3. Non-UV Release Tape

8. Wafer Backgrinding Tape Market - By Wafer Size

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Wafer Size, 2024 & 2032 (%)
    • 8.1.2. Up to 6 inches
    • 8.1.3. 6 to 8 inches
    • 8.1.4. Above 8 inches

9. Wafer Backgrinding Tape Market - By Application

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Application, 2024 & 2032 (%)
    • 9.1.2. Semiconductor Manufacturing
    • 9.1.3. LED Manufacturing
    • 9.1.4. Others

10. Wafer Backgrinding Tape Market - By End-user

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By Wafer Size, 2024 & 2032 (%)
    • 10.1.2. Consumer Electronics
    • 10.1.3. Automotive Electronics
    • 10.1.4. Healthcare & Medical Devices
    • 10.1.5. Industrial Electronics

11. Wafer Backgrinding Tape Market- By Geography

  • 11.1. Introduction
    • 11.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 11.2. North America
    • 11.2.1. Overview
    • 11.2.2. Wafer Backgrinding Tape Key Manufacturers in North America
    • 11.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.2.4. North America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.2.5. North America Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.2.6. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.2.7. North America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.2.8. U.S.
      • 11.2.8.1. Overview
      • 11.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.8.3. U.S. Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.8.4. U.S. Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.2.8.5. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.2.8.6. U.S. Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.2.9. Canada
      • 11.2.9.1. Overview
      • 11.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.9.3. Canada Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.9.4. Canada Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.2.9.5. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.2.9.6. Canada Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.3. Europe
    • 11.3.1. Overview
    • 11.3.2. Wafer Backgrinding Tape Key Manufacturers in Europe
    • 11.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.3.4. Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.3.5. Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.3.6. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.3.7. Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.8. Germany
      • 11.3.8.1. Overview
      • 11.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.8.3. Germany Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.8.4. Germany Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.8.5. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.8.6. Germany Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.9. UK
      • 11.3.9.1. Overview
      • 11.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.9.3. UK Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.9.4. UK Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.9.5. UK Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.9.6. UK Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.10. France
      • 11.3.10.1. Overview
      • 11.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.10.3. France Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.10.4. France Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.10.5. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.10.6. France Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.11. Italy
      • 11.3.11.1. Overview
      • 11.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.11.3. Italy Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.11.4. Italy Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.11.5. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.11.6. Italy Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.12. Spain
      • 11.3.12.1. Overview
      • 11.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.12.3. Spain Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.12.4. Spain Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.12.5. Spain Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.12.6. Spain Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.13. The Netherlands
      • 11.3.13.1. Overview
      • 11.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.13.3. The Netherlands Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.13.4. The Netherlands Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.13.5. The Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.13.6. The Netherlands Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.14. Sweden
      • 11.3.14.1. Overview
      • 11.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.14.3. Sweden Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.14.4. Sweden Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.14.5. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.14.6. Sweden Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.15. Russia
      • 11.3.15.1. Overview
      • 11.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.15.3. Russia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.15.4. Russia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.15.5. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.15.6. Russia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.16. Poland
      • 11.3.16.1. Overview
      • 11.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.16.3. Poland Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.16.4. Poland Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.16.5. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.16.6. Poland Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.3.17. Rest of Europe
      • 11.3.17.1. Overview
      • 11.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.17.3. Rest of the Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.17.4. Rest of the Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.3.17.5. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.3.17.6. Rest of the Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.4. Asia Pacific (APAC)
    • 11.4.1. Overview
    • 11.4.2. Wafer Backgrinding Tape Key Manufacturers in Asia Pacific
    • 11.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.4.4. APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.4.5. APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.4.6. APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.4.7. APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.8. China
      • 11.4.8.1. Overview
      • 11.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.8.3. China Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.8.4. China Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.8.5. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.8.6. China Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.9. India
      • 11.4.9.1. Overview
      • 11.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.9.3. India Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.9.4. India Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.9.5. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.9.6. India Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.10. Japan
      • 11.4.10.1. Overview
      • 11.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.10.3. Japan Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.10.4. Japan Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.10.5. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.10.6. Japan Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.11. South Korea
      • 11.4.11.1. Overview
      • 11.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.11.3. South Korea Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.11.4. South Korea Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.11.5. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.11.6. South Korea Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.12. Australia
      • 11.4.12.1. Overview
      • 11.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.12.3. Australia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.12.4. Australia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.12.5. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.12.6. Australia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.13. Indonesia
      • 11.4.13.1. Overview
      • 11.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.13.3. Indonesia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.13.4. Indonesia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.13.5. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.13.6. Indonesia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.14. Thailand
      • 11.4.14.1. Overview
      • 11.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.14.3. Thailand Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.14.4. Thailand Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.14.5. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.14.6. Thailand Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.15. Philippines
      • 11.4.15.1. Overview
      • 11.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.15.3. Philippines Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.15.4. Philippines Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.15.5. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.15.6. Philippines Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.4.16. Rest of APAC
      • 11.4.16.1. Overview
      • 11.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.16.3. Rest of APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.16.4. Rest of APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.4.16.5. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.4.16.6. Rest of APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.5. Latin America (LATAM)
    • 11.5.1. Overview
    • 11.5.2. Wafer Backgrinding Tape Key Manufacturers in Latin America
    • 11.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.5.4. LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.5.5. LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.5.6. LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.5.7. LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.8. Brazil
      • 11.5.8.1. Overview
      • 11.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.8.3. Brazil Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.8.4. Brazil Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.8.5. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.8.6. Brazil Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.9. Mexico
      • 11.5.9.1. Overview
      • 11.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.9.3. Mexico Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.9.4. Mexico Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.9.5. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.9.6. Mexico Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.10. Argentina
      • 11.5.10.1. Overview
      • 11.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.10.3. Argentina Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.10.4. Argentina Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.10.5. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.10.6. Argentina Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.11. Colombia
      • 11.5.11.1. Overview
      • 11.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.11.3. Colombia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.11.4. Colombia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.11.5. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.11.6. Colombia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.5.12. Rest of LATAM
      • 11.5.12.1. Overview
      • 11.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.12.3. Rest of LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.12.4. Rest of LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.5.12.5. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.5.12.6. Rest of LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 11.6. Middle East and Africa (MEA)
    • 11.6.1. Overview
    • 11.6.2. Wafer Backgrinding Tape Key Manufacturers in Middle East and Africa
    • 11.6.3. MEA Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.6.4. MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.6.5. MEA Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
    • 11.6.6. MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 11.6.7. MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.8. Saudi Arabia
      • 11.6.8.1. Overview
      • 11.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.8.3. Saudi Arabia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.8.4. Saudi Arabia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.8.5. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.8.6. Saudi Arabia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.9. United Arab Emirates
      • 11.6.9.1. Overview
      • 11.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.9.3. United Arab Emirates Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.9.4. United Arab Emirates Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.9.5. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.9.6. United Arab Emirates Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.10. Israel
      • 11.6.10.1. Overview
      • 11.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.10.3. Israel Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.10.4. Israel Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.10.5. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.10.6. Israel Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.11. Turkey
      • 11.6.11.1. Overview
      • 11.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.11.3. Turkey Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.11.4. Turkey Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.11.5. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.11.6. Turkey Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.12. Algeria
      • 11.6.12.1. Overview
      • 11.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.12.3. Algeria Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.12.4. Algeria Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.12.5. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.12.6. Algeria Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.13. Egypt
      • 11.6.13.1. Overview
      • 11.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.13.3. Egypt Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.13.4. Egypt Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.13.5. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.13.6. Egypt Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 11.6.14. Rest of MEA
      • 11.6.14.1. Overview
      • 11.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.14.3. Rest of MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.14.4. Rest of MEA Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
      • 11.6.14.5. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 11.6.14.6. Rest of MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)

12. Key Vendor Analysis- Wafer Backgrinding Tape Industry

  • 12.1. Competitive Dashboard
    • 12.1.1. Competitive Benchmarking
    • 12.1.2. Competitive Positioning
  • 12.2. Company Profiles
    • 12.2.1. Mitsui Chemicals America, Inc.
    • 12.2.2. Nitto Denko Corporation
    • 12.2.3. Lintec Corporation
    • 12.2.4. Furukawa Electric Co., Ltd.
    • 12.2.5. Denka Company Limited
    • 12.2.6. LG Chem
    • 12.2.7. Maxell Corporation
    • 12.2.8. D&X Inc.
    • 12.2.9. AI Technology, Inc.
    • 12.2.10. AMC Co., Ltd.
    • 12.2.11. Force-One Applied Materials Inc.
    • 12.2.12. Pantech Tape Co., Ltd.
    • 12.2.13. Minitron Elektron GmbH
    • 12.2.14. NEPTCO, Inc.
    • 12.2.15. Sumitomo Bakelite Co., Ltd.
    • 12.2.16. Ultron Systems, Inc.
    • 12.2.17. Teraoka Seisakusho Co., Ltd.
    • 12.2.18. DaehyunST Co., Ltd.
    • 12.2.19. QES Group Berhad
    • 12.2.20. Advanced Dicing Technologies Ltd.

13. 360 Degree AnalystView

14. Appendix

  • 14.1. Research Methodology
  • 14.2. References
  • 14.3. Abbreviations
  • 14.4. Disclaimer
  • 14.5. Contact Us