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市场调查报告书
商品编码
1569407

全球晶圆背面研磨胶带市场规模研究，按类型（UV 固化、非 UV）、晶圆尺寸（6 英寸、8 英寸、12 英寸、其他）以及 2022-2032 年区域预测

Global Wafer Backgrinding Tape Market Size Study, by Type (UV Curable, Non-UV), by Wafer Size (6-Inch, 8-Inch, 12-Inch, Others), and Regional Forecasts 2022-2032
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 285 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023年全球晶圆背磨胶带市场价值约为2.3006亿美元，预计在2024-2032年预测期内将以超过4.5%的健康成长率成长。晶圆背面研磨是关键的半导体製造步骤，对于减少晶圆厚度以实现积体电路的堆迭和高密度封装至关重要。该工艺包括在组装前研磨晶圆背面以达到所需的厚度，从而确保设备的紧凑性和性能。对晶圆製造的需求不断增长以及研磨过程中对晶圆表面保护的日益关注正在推动市场的成长。此外，在智慧技术和设备兴起的推动下，半导体产业不断扩张，进一步推动了对晶圆背面研磨胶带的需求。

晶圆製造需求的成长是半导体和资料中心市场成长的主要动力。随着技术的进步和对电子设备（从智慧型手机到高效能运算系统）的需求的增加，对先进晶圆製造的需求也在增加。晶圆製造对于生产为这些设备供电的半导体晶片至关重要。然而，由于从非紫外线固化背面研磨胶带转向紫外线固化背面研磨胶带，市场面临挑战，这往往会增加晶圆製造的总体成本，从而可能限制市场成长。儘管存在这些挑战，但在晶圆製造设备和材料投资增加的推动下，市场仍将成长，特别是在中国、台湾和韩国等半导体产业快速发展的发展中地区。

全球晶圆背磨胶带市场研究考虑的关键区域包括亚太地区、北美、欧洲、拉丁美洲、中东和非洲以及世界其他地区。就收入而言，亚太地区是全球晶圆背磨胶带市场的主导地区。该地区市场的成长归因于其广泛的半导体製造业以及日本、韩国和中国等国家主要参与者的存在等因素。该地区成熟的电子产业和对半导体装置的高需求推动了背磨胶带的大量消耗，而背磨胶带对于晶圆减薄製程至关重要。然而，由于技术进步和半导体研发投资增加，预计北美市场在预测期内将以最快的速度成长。美国在这​​一增长中处于领先地位，这得益于对高效能运算和电子产品的需求激增，这反过来又增加了对高效能晶圆背面研磨解决方案的需求。

目录

第 1 章：全球晶圆背面研磨胶带市场执行摘要

  • 全球晶圆背磨胶带市场规模及预测（2022-2032）
  • 区域概要
  • 分部摘要
    • 按类型
    • 按晶圆尺寸
  • 主要趋势
  • 经济衰退的影响
  • 分析师推荐与结论

第 2 章：全球晶圆背面研磨胶带市场定义与研究假设

  • 研究目的
  • 市场定义
  • 研究假设
    • 包含与排除
    • 限制
    • 供给侧分析
      • 可用性
      • 基础设施
      • 监管环境
      • 市场竞争
      • 经济可行性（消费者的角度）
    • 需求面分析
      • 监理框架
      • 技术进步
      • 环境考虑
      • 消费者意识和接受度
  • 估算方法
  • 研究考虑的年份
  • 货币兑换率

第 3 章：全球晶圆背磨胶带市场动态

  • 市场驱动因素
    • 晶圆製造需求增加
    • 更重视研磨过程中晶圆表面的保护
    • 半导体产业的成长
  • 市场挑战
    • 增加从非 UV 固化背面研磨胶带带到 UV 固化背面研磨胶带的转变
    • 与晶圆製造相关的高营运成本
  • 市场机会
    • 加大晶圆製造设备及材料投资
    • 印度和菲律宾等新兴国家的机会不断增加

第 4 章：全球晶圆背磨胶带市场产业分析

  • 波特的五力模型
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争竞争
    • 波特五力模型的未来方法
    • 波特的 5 力影响分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社会的
    • 技术性
    • 环境的
    • 合法的
  • 顶级投资机会
  • 最佳制胜策略
  • 颠覆性趋势
  • 产业专家视角
  • 分析师推荐与结论

第 5 章：全球晶圆背磨胶带市场规模与预测：按类型 - 2022-2032

  • 细分仪表板
  • 全球晶圆背磨胶带市场：类型收入趋势分析，2022 年和 2032 年
    • 紫外线固化
    • 非紫外线

第 6 章：全球晶圆背磨胶带市场规模与预测：依晶圆尺寸 - 2022-2032

  • 细分仪表板
  • 全球晶圆背磨胶带市场：2022 年和 2032 年晶圆尺寸收入趋势分析
    • 6吋
    • 8寸
    • 12英吋
    • 其他的

第 7 章：全球晶圆背磨胶带市场规模及预测：按地区 - 2022-2032

  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 西班牙
    • 义大利
    • 欧洲其他地区
  • 亚太
    • 中国
    • 印度
    • 日本
    • 澳洲
    • 韩国
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 南非
    • 中东和非洲其他地区

第 8 章：竞争情报

  • 重点企业SWOT分析
  • 顶级市场策略
  • 公司简介
    • AI Technology Inc.
      • 关键讯息
      • 概述
      • 财务（视数据可用性而定）
      • 产品概要
      • 市场策略
    • Furukawa Electric Co. Ltd.
    • AMC Co. Ltd.
    • Denka Company Limited
    • Pantech Tape Co. Ltd.
    • Force-One Applied Materials
    • Minitron Elektronik GmbH
    • Nitto Denko Corporation
    • Mitsui Chemicals Inc.
    • Lintec of America Inc. (Lintec Corporation)
    • Sumitomo Bakelite
    • Ultron Systems
    • Nippon Pulse Motor
    • Loadpoint Limited
    • NEPTCO

第 9 章：研究过程

  • 研究过程
    • 资料探勘
    • 分析
    • 市场预测
    • 验证
    • 出版
  • 研究属性
简介目录

Global Wafer Backgrinding Tape Market is valued at approximately USD 230.06 Million in 2023 and is anticipated to grow with a healthy growth rate of more than 4.5% over the forecast period 2024-2032. Wafer backgrinding is a crucial semiconductor fabrication step, essential for reducing wafer thickness to enable stacking and high-density packaging of integrated circuits. This process involves grinding the backside of the wafer to achieve the desired thickness before assembly, ensuring the device's compactness and performance. The growing demand for wafer fabrication and the increased focus on wafer surface protection during the grinding process are driving the market's growth. Additionally, the expanding semiconductor industry, propelled by the rise in smart technologies and devices, further fuels the demand for wafer backgrinding tapes.

The rise in the need for wafer fabrication is a major driver for growth in the semiconductor and data center markets. As technology advances and demand for electronic devices, from smartphones to high-performance computing systems, increases so does the need for advanced wafer fabrication. Wafer fabrication is crucial for producing the semiconductor chips that power these devices. However, the market faces challenges due to the shift from non-UV to UV curable backgrinding tapes, which tends to increase the overall cost of wafer manufacturing, potentially restraining market growth. Despite these challenges, the market is poised to grow, driven by increasing investments in wafer fabrication equipment and materials, particularly in developing regions such as China, Taiwan, and South Korea, where the semiconductor industry is rapidly advancing.

The key regions considered for the Global Wafer Backgrinding Tape Market study include Asia Pacific, North America, Europe, Latin America, Middle East & Africa, and Rest of the World. Asia Pacific is a dominating region in the Global Wafer Backgrinding Tape Market in terms of revenue. The market growth in the region is being attributed to factors including its extensive semiconductor manufacturing industry and the presence of major players in countries like Japan, South Korea, and China. The region's established electronics sector and high demand for semiconductor devices drive significant consumption of backgrinding tape, which is essential for wafer thinning processes. Whereas, the market in North America is anticipated to grow at the fastest rate over the forecast period fueled by advancements in technology and increasing investments in semiconductor research and development. The U.S. is leading this growth, supported by a surge in demand for high-performance computing and electronics, which in turn boosts the need for efficient wafer backgrinding solutions.

Major market player included in this report are:

  • AI Technology Inc.
  • Furukawa Electric Co. Ltd.
  • AMC Co. Ltd.
  • Denka Company Limited
  • Pantech Tape Co. Ltd.
  • Force-One Applied Materials
  • Minitron Elektronik GmbH
  • Nitto Denko Corporation
  • Mitsui Chemicals Inc.
  • Lintec of America Inc. (Lintec Corporation)
  • Sumitomo Bakelite
  • Ultron Systems
  • Nippon Pulse Motor
  • Loadpoint Limited
  • NEPTCO

The detailed segments and sub-segment of the market are explained below:

By Type

  • UV Curable
  • Non-UV

By Wafer Size

  • 6-Inch
  • 8-Inch
  • 12-Inch
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Rest of Latin America
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • RoMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Wafer Backgrinding Tape Market Executive Summary

  • 1.1. Global Wafer Backgrinding Tape Market Size & Forecast (2022- 2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Type
    • 1.3.2. By Wafer Size
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Wafer Backgrinding Tape Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Wafer Backgrinding Tape Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Rise in need for wafer fabrication
    • 3.1.2. Increase in focus on wafer surface protection during grinding process
    • 3.1.3. Growth in the semiconductor industry
  • 3.2. Market Challenges
    • 3.2.1. Increase in shift from non-UV to UV curable backgrinding tapes
    • 3.2.2. High operational costs associated with wafer manufacturing
  • 3.3. Market Opportunities
    • 3.3.1. Increase in investment in wafer fabrication equipment and materials
    • 3.3.2. Growing opportunities in emerging countries like India and the Philippines

Chapter 4. Global Wafer Backgrinding Tape Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Wafer Backgrinding Tape Market Size & Forecasts by Type 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Wafer Backgrinding Tape Market: Type Revenue Trend Analysis, 2022 & 2032 (USD Million)
    • 5.2.1. UV Curable
    • 5.2.2. Non-UV

Chapter 6. Global Wafer Backgrinding Tape Market Size & Forecasts by Wafer Size 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Wafer Backgrinding Tape Market: Wafer Size Revenue Trend Analysis, 2022 & 2032 (USD Million)
    • 6.2.1. 6-Inch
    • 6.2.2. 8-Inch
    • 6.2.3. 12-Inch
    • 6.2.4. Others

Chapter 7. Global Wafer Backgrinding Tape Market Size & Forecasts by Region 2022-2032

  • 7.1. North America Wafer Backgrinding Tape Market
    • 7.1.1. U.S. Wafer Backgrinding Tape Market
      • 7.1.1.1. Type breakdown size & forecasts, 2022-2032
      • 7.1.1.2. Wafer Size breakdown size & forecasts, 2022-2032
    • 7.1.2. Canada Wafer Backgrinding Tape Market
  • 7.2. Europe Wafer Backgrinding Tape Market
    • 7.2.1. U.K. Wafer Backgrinding Tape Market
    • 7.2.2. Germany Wafer Backgrinding Tape Market
    • 7.2.3. France Wafer Backgrinding Tape Market
    • 7.2.4. Spain Wafer Backgrinding Tape Market
    • 7.2.5. Italy Wafer Backgrinding Tape Market
    • 7.2.6. Rest of Europe Wafer Backgrinding Tape Market
  • 7.3. Asia-Pacific Wafer Backgrinding Tape Market
    • 7.3.1. China Wafer Backgrinding Tape Market
    • 7.3.2. India Wafer Backgrinding Tape Market
    • 7.3.3. Japan Wafer Backgrinding Tape Market
    • 7.3.4. Australia Wafer Backgrinding Tape Market
    • 7.3.5. South Korea Wafer Backgrinding Tape Market
    • 7.3.6. Rest of Asia Pacific Wafer Backgrinding Tape Market
  • 7.4. Latin America Wafer Backgrinding Tape Market
    • 7.4.1. Brazil Wafer Backgrinding Tape Market
    • 7.4.2. Mexico Wafer Backgrinding Tape Market
    • 7.4.3. Rest of Latin America Wafer Backgrinding Tape Market
  • 7.5. Middle East & Africa Wafer Backgrinding Tape Market
    • 7.5.1. Saudi Arabia Wafer Backgrinding Tape Market
    • 7.5.2. South Africa Wafer Backgrinding Tape Market
    • 7.5.3. Rest of Middle East & Africa Wafer Backgrinding Tape Market

Chapter 8. Competitive Intelligence

  • 8.1. Key Company SWOT Analysis
  • 8.2. Top Market Strategies
  • 8.3. Company Profiles
    • 8.3.1. AI Technology Inc.
      • 8.3.1.1. Key Information
      • 8.3.1.2. Overview
      • 8.3.1.3. Financial (Subject to Data Availability)
      • 8.3.1.4. Product Summary
      • 8.3.1.5. Market Strategies
    • 8.3.2. Furukawa Electric Co. Ltd.
    • 8.3.3. AMC Co. Ltd.
    • 8.3.4. Denka Company Limited
    • 8.3.5. Pantech Tape Co. Ltd.
    • 8.3.6. Force-One Applied Materials
    • 8.3.7. Minitron Elektronik GmbH
    • 8.3.8. Nitto Denko Corporation
    • 8.3.9. Mitsui Chemicals Inc.
    • 8.3.10. Lintec of America Inc. (Lintec Corporation)
    • 8.3.11. Sumitomo Bakelite
    • 8.3.12. Ultron Systems
    • 8.3.13. Nippon Pulse Motor
    • 8.3.14. Loadpoint Limited
    • 8.3.15. NEPTCO

Chapter 9. Research Process

  • 9.1. Research Process
    • 9.1.1. Data Mining
    • 9.1.2. Analysis
    • 9.1.3. Market Estimation
    • 9.1.4. Validation
    • 9.1.5. Publishing
  • 9.2. Research Attributes