晶圆基板的全球市场2024年

晶圆基板市场正在经历显着成长，预计将从 2022 年的 150 亿美元增长到 2030 年的超过 250 亿美元，复合年增长率约为 6.5%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势正在推动对晶圆基板的需求。

本报告提供晶圆基板市场详细评估，并深入探讨以下几点:

产品概要

作为晶圆基板所使用的主要材料概要

• 硅
• 碳化硅
• 砷化镓
• 氮化镓等

晶圆基板的全球市场概要

晶圆基板的全球市场的现在(2022年)及预测(2030年)相关的洞察。对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型的全球市场市场区隔

硅，硅碳化物，镓砷，氮化镓等，所使用的主要各材料的全球市场市场区隔

纯度，缺陷率，每含晶片的成本等，客户的迴响的材料选择主要的选择标准或性能参数

竞争概要:

分析Sumco、Siltronic、SK Siltron、Episil Precision、Soitec等10多家公司的主要竞争对手概况及竞争格局。

专利概要:

过去 4-5 年主要受让人公司对超过 15 个专利族的分析。它还包括对专利研究重点、正在考虑的材料以及相关应用的见解。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 晶圆基板

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Wafer Substrate market is poised for remarkable growth, projected to surpass USD 25 billion by 2030, with a compelling CAGR of approximately 6.5% from a value of USD 15 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Wafer Substrate.

This report provides a deep dive into the following points in this detailed assessment of Wafer Substrate Market:

Product Overview

Overview of key materials used as wafer substrate:

• Silicon
• Silicon Carbide
• Gallium Arsenide
• Gallium Nitride, etc.

Global Wafer Substrate Market Overview

Insight into the current (2022) and forecasted (2030) global market for Wafer Substrate including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Silicon, Silicon Carbide, Gallium Arsenide, Gallium Nitride, etc.,

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Purity, Defect Rate, Cost per chip, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Sumco, Siltronic, SK Siltron, Episil Precision, Soitec, etc.

Patent overview:

Analyzing about 15+ patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Wafer Substrate

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Wafer Substrate Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Wafer Substrate
• Table 6.1: Patent Publications by Geography - Wafer Substrate
• Table 6.2: Patent Listing - Wafer Substrate

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Wafer Substrate Market
• Chart 5.1.2: Global Wafer Substrate Market, By Material
• Chart 6.1: Patent Publication Trend - Wafer Substrate