蚀刻材料的全球市场2024

蚀刻材料市场经历了显着成长，预计到 2030 年将达到约 50 亿美元，复合年增长率约为 6.5%，而 2022 年为 30 亿美元。半导体技术的不断进步、消费性电子产品使用的增加以及电子产品小型化的持续趋势都促进了对蚀刻材料的需求。

本报告提供蚀刻材料市场详细评估，并深入探讨以下几点:

产品概要

主要蚀刻剂所使用的主要材料定义

• 湿蚀刻剂
• 干蚀刻剂

蚀刻剂的全球市场概要

蚀刻材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型全球市场市场区隔

主要蚀刻剂类型市场区隔:湿蚀刻剂，干蚀刻剂

异向性，蚀刻均一性，含蚀刻选择性等的参数相关之客户迴响，材料选择的主要选择标准或性能参数。

竞争概要:

主要的竞争企业的简介和Morita Chemical, Kanto Chemical, Daikin, OCI 含Company, Honeywell等的10公司以上的竞争形势分析。

专利概要:

过去4-5年主要的专利转让处的主要专利系列的分析。还有专利的研究焦点，讨论中的材料，相关应用相关洞察也包含。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 蚀刻剂

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Etchant materials market is poised for remarkable growth, projected to reach approximately USD 5 billion by 2030, with a CAGR of approximately 6.5% from a value of USD 3 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Etchant materials.

This report provides a deep dive into the following points in this detailed assessment of etchant materials market:

Product Overview

Defining the key materials used for major etchant:

• Wet Etchant
• Dry Etchant

Global Etchant Market overview

Insight on current (2022) and forecasted (2030) global market for Etchant Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

market segmentation by key etchant type – Wet Etchant, Dry Etchant.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Anisotropy, Etch Uniformity, Etch Selectivity, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Morita Chemical, Kanto Chemical, Daikin, OCI Company, Honeywell, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Etchant

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Etchant Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Etchant
• Table 6.1: Patent Publications by Geography - Etchant
• Table 6.2: Patent Listing - Etchant

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Etchant Materials Market
• Chart 5.1.2: Global Etchant Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Etchant