蚀刻掩模材料的全球市场2024

蚀刻掩模材料市场经历了显着成长，预计将从 2022 年的 16 亿美元增长到 2030 年的 34 亿美元以上，复合年增长率约为 10%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势都促进了对蚀刻掩模的需求。

本报告提供蚀刻掩模材料市场详细评估，并深入探讨以下几点:

产品概要

所使用的蚀刻掩模材料的种类定义

• 硬面罩
• 软体面罩

蚀刻掩模材料的全球市场概要

蚀刻掩模材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型全球市场市场区隔

主要蚀刻掩模材料各类型全球市场市场区隔- 硬面罩和软体面罩

蚀刻抗性，含化学的稳定性等的参数相关之客户迴响，材料选择主要的选择标准或性能参数

竞争概要:

主要的竞争企业的简介和JSR Corporation, Samsung SDI, YC Chem, PiBond, DNF等的主要企业的竞争形势分析。

专利概要:

过去4-5年主要的专利转让处的主要专利系列的分析。还有专利的研究焦点，也包含讨论中的材料，相关用途相关洞察。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• 蚀刻掩模材料

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Etch Mask materials market is poised for remarkable growth, projected to surpass USD 3.4 billion by 2030, with a compelling CAGR of approximately 10% from a value of USD 1.6 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for Etch Mask.

This report provides a deep-dive into the following points in this detailed assessment of etch mask market:

Product Overview

Defining the type of etch mask used:

• Hard Mask
• Soft Mask

Global Etch Mask Market Overview

Insight on current (2022) and forecasted (2030) global market for Etch Mask Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key Etch Mask type – Hard Mask and Soft Mask

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Etching-resistance, Chemical stability, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of the major companies including JSR Corporation, Samsung SDI, YC Chem, PiBond, DNF, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Etch Mask

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Etch Mask Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Etch Mask
• Table 6.1: Patent Publications by Geography - Etch Mask
• Table 6.2: Patent Listing - Etch Mask

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Etch Mask Materials Market
• Chart 5.1.2: Global Etch Mask Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Etch Mask