CMP材料的全球市场2024

化学机械抛光 (CMP) 材料市场正在经历显着成长，预计将从 2022 年的 37 亿美元增长到 2030 年的 65 亿美元以上，复合年增长率约为 8%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化的持续趋势都促进了对 CMP 材料的需求。

本报告提供化学的机器抛光(CMP)用材料详细评估，并深入探讨以下几点:

产品概要

CMP所使用的主要零组件定义

• CMP垫片
• CMP泥浆

化学的机器抛光的全球市场概要

CMP材料的现在(2022年)与预测(2030年)的全球市场相关洞察。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

各材料类型的全球市场市场区隔

聚合物，金属，陶瓷等，所使用的主要各材料的全球市场市场区隔

抛光消除率，平坦性，含均一性等的参数相关之客户迴响，材料选择的主要选择标准或性能参数

竞争概要:

主要的竞争企业的简介包含有3M, Dow, Merck, Resonac, DuPont等的10公司以上的竞争形势分析。

专利概要:

过去4-5年主要的专利转让处的主要专利系列的分析。还有专利的调查对象，也包含讨论中的材料，相关用途相关洞察。

市场展望

在广泛的二次和初步研究验证的支持下，本报告还提供了对市场前景及其影响因素的权威看法。

目录

第1章 简介

• 报告概要
• 产品焦点
• 调查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蚀刻
• 掺杂
• CMP
• 切割
• 引线接合法
• 包装

第3章 价值链概要

第4章 市场概要

第5章 详细市场评估

• CMP材料(泥浆&垫片)

第5章 专利概要

第6章 市场展望

第7章 市场展望附录

The Chemical Mechanical Planarization (CMP) materials market is poised for remarkable growth, projected to surpass USD 6.5 billion by 2030, with a compelling CAGR of approximately 8% from a value of USD 3.7 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for CMP materials.

This report provides a deep dive into the following points in this detailed assessment of materials for Chemical Mechanical Planarization:

Product Overview

Defining the major components used in CMP:

• CMP Pads
• CMP Slurries

Global Chemical Mechanical Planarization Market Overview

Insight on current (2022) and forecasted (2030) global market for CMP materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used ; Polymers, Metals, Ceramics, etc.

Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Polishing and Removal rate, Planarity, and Uniformity

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including 3M, Dow, Merck, Resonac, DuPont, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market Outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Materials for CMP (Slurries & pads)

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global CMP Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - CMP Materials
• Table 6.1: Patent Publications by Geography - CMP Slurries
• Table 6.2: Patent Listing - CMP Slurries
• Table 6.3: Patent Publications by Geography - CMP Polishing Pad
• Table 6.4: Patent Listing - CMP Polishing Pad

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global CMP Materials Market
• Chart 5.1.2: Global CMP Materials Market, By Material
• Chart 6.1: Patent Publication Trend - CMP Slurries
• Chart 6.2: Patent Publication Trend - CMP Polishing Pads