2024 年全球引线框架材料市场

引线框架材料市场预计将经历显着成长，从 2022 年的 30 亿美元增加到 2030 年的 45 亿美元以上，复合年增长率约为 5%。半导体技术的不断进步、消费性电子产品的使用不断增加以及电子产品小型化趋势的不断增强，都促进了对引线框架材料的需求。

本报告透过深入研究以下几点，对引线框架材料市场进行了详细评估：

产品概要

引线框架主要材料定义

• 铜及铜合金
• 钱
• 钯
• 银
• 铂
• 铝
• 铁镍合金等

全球半导体封装材料市场概况

对目前（2022 年）和预测（2030 年）全球引线框架材料市场的见解。包括对影响市场成长和材料选择的主要趋势和驱动因素的分析。

依材料类型划分的全球市场细分

依所用关键材料划分的全球市场细分 - 铜及铜合金、金、铝、钯、银、铂等。

材料选择的关键选择标准或性能参数，包括客户对引线框架设计、热管理、尺寸精度等参数的回馈。

竞争概况：

主要竞争对手概况及Mitsui High-tec, Inc, Shinko Electric Industries Co., Ltd, Chang Wah Technology Co., Ltd, Wiegel Tool Works, Inc, Seaki Precision Co.,Ltd等10余家企业竞争态势分析。

专利概述：

过去 4-5 年主要专利权人对主要同族专利的分析。它还包括对专利研究重点、正在考虑的材料以及相关应用的见解。

市场展望

该报告经过广泛的二次和初步研究验证，也对市场前景及其影响因素提供了权威的看法。

目录

第一章简介

• 报告概述
• 产品焦点
• 调查方法

第二章 流程概述

• 薄膜成型
• 光刻法
• 蚀刻
• 兴奋剂
• 化学机械抛光
• 切块
• 引线键合
• 打包

第三章价值链概述

第四章市场概况

第五章 详细市场评估

• 引线框架

第五章 专利概述

第六章市场展望

第七章 市场展望 附录

The Lead Frame materials market is poised for remarkable growth, projected to surpass USD 4.5 billion by 2030, with a compelling CAGR of approximately 5% from a value of USD 3 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for lead frame materials.

This report provides a deep-dive into the following points in this detailed assessment of lead frame materials market:

Product Overview

Defining the key materials used for lead frames:

• Copper & Copper alloys
• Gold
• Palladium
• Silver
• Platinum
• Aluminum
• Iron-nickel alloys, etc.

Global Semiconductor Packaging Materials Market overview

Insight on current (2022) and forecasted (2030) global market for Lead Frame Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Copper & Copper alloys, Gold, Aluminum, Palladium, Silver, Platinum, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as Lead Frame Design, Thermal Management, Dimensional Accuracy, etc.

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 10+ companies including Mitsui High-tec, Inc, Shinko Electric Industries Co., Ltd, Chang Wah Technology Co., Ltd, Wiegel Tool Works, Inc, Seaki Precision Co.,Ltd, etc.

Patent overview:

Analyzing key patent families by major assignees in the last 4-5 years. The Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Lead Frame

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Lead Frame Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Lead Frame
• Table 6.1: Patent Publications by Geography - Lead Frame
• Table 6.2: Patent Listing - Lead Frame

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Lead Frame Materials Market
• Chart 5.1.2: Global Lead Frame Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Lead Frame