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市场调查报告书
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1476999

3nM 半导体製造技术市场:依最终用途产业、技术类型和地区划分

Global 3nM Semiconductor Manufacturing Technology Market: Focus on End Use Industry, Technology Type, and Region

出版日期: | 出版商: BIS Research | 英文 | 商品交期: 7-10个工作天内

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简介目录

全球3nM半导体製造技术市场正处于半导体产业的模式转移之中,与传统节点相比,效能提高、功耗降低、电晶体密度增加。

随着消费性电子产品、汽车和医疗保健等各个领域对更小、更高性能晶片的需求加速成长,3nM 技术的采用预计将彻底改变半导体格局。

推动全球3nM半导体製造技术市场成长的关键因素包括人工智慧、5G连接和物联网设备等以资料为中心的应用的快速成长。对高效能运算解决方案不断增长的需求以及奈米技术和材料科学的进步也推动了 3nM 技术的开发和采用。此外,市场正在经历半导体公司之间不断增加的垂直整合和策略联盟,以克服製造复杂性并实现规模经济。

北美和亚太地区是全球半导体产业的领跑者,特别是中国、日本、韩国和台湾等国家在半导体设备支出方面贡献巨大。

本报告调查了全球3nM半导体製造技术市场,并提供了有关行业趋势、市场成长促进和限制因素、市场规模趋势和预测、各个细分市场/地区/主要国家的详细分析、竞争格局的信息,我们整理了以下几方面的概况:主要企业。

目录

第一章市场:产业展望

  • 趋势:当前和未来的影响评估
    • 新材料、新结构
    • 边缘AI晶片
  • 3nM半导体製造技术的演变
  • 2nm半导体製造技术的下一步
  • 供应链分析
  • 正在进行的计划
  • 采用3nM晶片的主要企业
  • 市场动态概览
    • 市场驱动因素
    • 市场限制因素
    • 市场机会

第二章 全球3nM半导体製造技术市场:依应用分类

  • 应用概述
  • 全球 3nM 半导体製造技术市场:依最终用途产业
    • CE产品
    • 通讯
    • 卫生保健
    • 航太/国防
    • 其他的

第三章 全球3nM半导体製造技术市场:依产品分类

  • 产品概要
  • 全球3nM半导体製造技术市场:依技术类型
    • FinFET
    • GAA
    • 极紫外光微影术

第四章全球3nM半导体製造技术市场:按地区

  • 区域概况
  • 全球3nM半导体製造技术市场:按地区
  • 北美洲
  • 欧洲
  • 亚太地区
  • 其他地区

第五章 公司简介

  • GlobalFoundries Inc.
  • Intel
  • Samsung
  • Taiwan Semiconductor Manufacturing Company Limited
  • United Microelectronics Corporation
  • 其他主要企业

第六章调查方法

简介目录
Product Code: ES02059SA

This report will be delivered in 7-10 working days.

Introduction to 3nM Semiconductor Manufacturing Technology Market

The global 3nm semiconductor manufacturing technology market is witnessing a paradigm shift in the semiconductor industry, offering enhanced performance, reduced power consumption, and increased transistor density compared to previous nodes. As demand for smaller, more powerful chips accelerates across various sectors, including consumer electronics, automotive, and healthcare, the adoption of 3nm technology is poised to revolutionize the semiconductor landscape.

Key drivers fueling the growth of the global 3nm semiconductor manufacturing technology market include the exponential rise in data-centric applications such as artificial intelligence, 5G connectivity, and Internet of Things (IoT) devices. Moreover, the escalating demand for high-performance computing solutions, coupled with advancements in nanotechnology and materials science, is propelling the development and adoption of 3nm technology. Additionally, the market is witnessing a trend towards vertical integration among semiconductor companies and strategic collaborations to overcome manufacturing complexities and achieve economies of scale.

Despite its promising prospects, the global 3nm semiconductor manufacturing technology market faces several challenges, including the escalating costs associated with R&D and manufacturing processes, as well as technical hurdles related to extreme ultraviolet (EUV) lithography and process node scaling. However, these challenges present opportunities for innovation and differentiation, encouraging players to invest in advanced manufacturing techniques, materials, and design methodologies to address performance, power efficiency, and reliability requirements.

North America and the Asia-Pacific region stand out as frontrunners in the global semiconductor industry, with significant contributions from countries such as China, Japan, South Korea, and Taiwan, particularly in semiconductor equipment spending. Prominent companies in the 3nm market, including Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung, Intel, United Microelectronics Corporation, and Globalfoundries, are pivotal players in this technological advancement. They provide state-of-the-art process capabilities to major clients, spearheading innovation within the sector and leading the charge in this transformative era of semiconductor technology.

Market Segmentation:

Segmentation 1: by End-use Industry

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Healthcare
  • Aerospace and Defense
  • Others

Segmentation 2: by Technology Type

  • FinFET
  • Gate-All-Around (GAA)
  • Extreme Ultraviolet (EUV) Lithography

Segmentation 3: by Region

  • North America
  • Europe
  • Asia-Pacific
  • Rest-of-the-World

Table of Contents

Executive Summary

Scope and Definition

Market/Product Definition

Key Questions Answered

Analysis and Forecast Note

1. Markets: Industry Outlook

  • 1.1 Trends: Current and Future Impact Assessment
    • 1.1.1 Introduction of New Materials and Structures
    • 1.1.2 Edge AI Chips
  • 1.2 Evolution of 3nM Semiconductor Manufacturing Technology
  • 1.3 2nM: The Next Step Semiconductor Manufacturing Technology
  • 1.4 Supply Chain Analysis
  • 1.5 Ongoing Programs
  • 1.6 Key Companies Adopting 3nM Chips
  • 1.7 Market Dynamics Overview
    • 1.7.1 Market Drivers
    • 1.7.2 Market Restraints
    • 1.7.3 Market Opportunities

2. Global 3nM Semiconductor Manufacturing Technology Market by Application

  • 2.1 Application Summary
  • 2.2 Global 3nM Semiconductor Manufacturing Technology Market by End Use Industry
    • 2.2.1 Consumer Electronics
    • 2.2.2 Automotive
    • 2.2.3 Telecommunications
    • 2.2.4 Healthcare
    • 2.2.5 Aerospace and Defense
    • 2.2.6 Others

3. Global 3nM Semiconductor Manufacturing Technology Market by Product

  • 3.1 Product Summary
  • 3.2 Global 3nM Semiconductor Manufacturing Technology Market by Technology Type
    • 3.2.1 FinFET
    • 3.2.2 Gate-All-Around (GAA)
    • 3.2.3 Extreme Ultraviolet (EUV) Lithography

4. Global 3nM Semiconductor Manufacturing Technology Market by Region

  • 4.1 Regional Summary
  • 4.2 Global 3nM Semiconductor Manufacturing Technology Market - by Region
  • 4.3 North America
    • 4.3.1 Markets
      • 4.3.1.1 Key Market Participants in North America
    • 4.3.2 Application
    • 4.3.3 Product
    • 4.3.4 North America by Country
      • 4.3.4.1 U.S.
        • 4.3.4.1.1 Market by Application
        • 4.3.4.1.2 Market by Product
      • 4.3.4.2 Canada
  • 4.4 Europe
    • 4.4.1 Markets
      • 4.4.1.1 Key Market Participants in Europe
    • 4.4.2 Application
    • 4.4.3 Product
    • 4.4.4 Europe By Country
      • 4.4.4.1 Germany
        • 4.4.4.1.1 Market by Application
        • 4.4.4.1.2 Market by Product
      • 4.4.4.2 France
      • 4.4.4.3 U.K.
      • 4.4.4.4 Others
  • 4.5 Asia-Pacific
    • 4.5.1 Markets
      • 4.5.1.1 Key Market Participants in Asia-Pacific
    • 4.5.2 Application
    • 4.5.3 Product
    • 4.5.4 Asia-Pacific by Country
      • 4.5.4.1 China
        • 4.5.4.1.1 Market by Application
        • 4.5.4.1.2 Market by Product
      • 4.5.4.2 Japan
      • 4.5.4.3 India
      • 4.5.4.4 Others
  • 4.6 Rest-of-the-World
    • 4.6.1 Markets
      • 4.6.1.1 Key Market Participants in Rest-of-the-World
    • 4.6.2 Application
    • 4.6.3 Product
    • 4.6.4 Rest-of-the-World by Region
      • 4.6.4.1 Middle East and Africa
      • 4.6.4.2 Latin America

5. Companies Profiled

  • 5.1 GlobalFoundries Inc.
  • 5.2 Intel
  • 5.3 Samsung
  • 5.4 Taiwan Semiconductor Manufacturing Company Limited
  • 5.5 United Microelectronics Corporation
  • 5.6 Other Key Players

6. Research Methodology