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市场调查报告书
商品编码
1584609

全球 IC 封装焊球市场：按类型、应用、地区、趋势分析、竞争格局、预测，2019-2030 年

Solder Ball in Integrated Circuit Packaging Market, By Type; By Application; By Region (North America, Europe, Asia Pacific, Latin America, Middle East and Africa ), Global Trend Analysis, Competitive Landscape & Forecast, 2019-2030
出版日期: | 出版商: Blueweave Consulting | 英文 470 Pages | 商品交期: 2-3个工作天内

价格
简介目录

至2030年，全球IC封装用焊球市场将超过1,570亿美元

由于微型电子设备中积体电路的需求增加、半导体製造的扩张、先进封装、物联网的快速采用和汽车电子应用，全球 IC 封装焊球市场正在蓬勃发展。

领先的策略咨询和市场研究公司 BlueWeave Consulting 在最近的一项研究中估计，2023 年全球 IC 封装焊球市场规模将达到 753 亿美元。 BlueWeave预测，在2024-2030年的预测期内，全球IC封装用焊球市场规模将以11.20%的复合年增长率成长，到2030年将达到1572亿美元。由于电子设备的小型化、半导体技术的进步、5G、物联网和人工智慧的采用、温度控管的增强以及汽车和消费电子领域不断扩大的趋势，需求不断增长，推动了全球 IC 封装焊球市场的发展。这些因素有助于实现可靠的电气连接，并增加对 IC 封装焊球的需求。

机会 - 对高性能电子设备的需求增加

由于 5G、AI（人工智慧）和 IoT（物联网）的进步推动了对高性能电子设备的需求不断增长，全球 IC 封装焊球市场正在经历快速成长。焊球对于将半导体装置连接到印刷电路基板（PCB）以提高导热性、电气连接性和装置效率至关重要，并且正在推动通讯、消费性电子和汽车行业的市场扩张。

地缘政治紧张局势加剧对全球 IC 封装焊球市场的影响

地缘政治紧张局势的加剧可能会对全球焊球市场产生重大影响，导致供应链中断、原材料短缺以及晶片製造商的成本增加。主要枢纽之间的紧张局势、不可预测的法规环境以及经济放缓导致的需求波动可能会进一步限制市场成长和製造商的盈利。

BGA 应用领域引领全球 IC 封装焊球市场

按应用划分，BGA（球栅阵列）领域在全球 IC 封装焊球市场中占有最大份额。 BGA因其高密度封装和提供高效散热的能力而被广泛应用，使其适合先进的封装电子产品。 BGA 在註重小型化和性能的消费性电子、IT、通讯和汽车产业的普及，增强了 BGA 的优势。其他封装技术，如晶片级封装（CSP）和晶圆级晶片级封装（WLCSP）也在成长，但仍无法与BGA的广泛使用和市场占有率相符。

竞争格局

全球IC封装焊球市场竞争非常激烈，许多公司都在争取更大的市场占有率。这些公司正在利用各种策略，例如增加研发活动投资、併购、合资、联盟、许可协议以及新产品和服务发布，以进一步巩固其在全球IC封装焊球市场的地位。

该报告的详细分析提供了有关全球IC封装焊球市场的成长潜力、未来趋势和统计数据的资讯。它还涵盖了推动市场总规模预测的因素。该报告致力于提供全球IC封装焊球市场的最新技术趋势以及产业见解，以帮助决策者做出策略决策。此外，我们也分析了市场的成长动力、挑战和竞争力。

目录

第一章 研究框架

第 2 章执行摘要

第三章 IC 封装用焊球的全球市场洞察

  • 产业价值链分析
  • DROC分析
    • 生长促进因子
      • 电子设备的小型化
      • 半导体产业的成长
      • 电子设备在各行业的使用增加
    • 抑制因素
      • 环境问题
      • 成本压力
    • 机会
      • 对高性能电子设备的需求不断增长
      • 焊球製造的技术进步
    • 任务
      • 来自替代互连技术的竞争
      • 供应链中断
  • 科技进步/最新趋势
  • 法律规范
  • 波特五力分析

第四章全球IC封装焊球市场：行销策略

第五章全球IC封装焊球市场：价格分析

第六章全球 IC 封装焊球市场：区域分析

  • 全球 IC 封装焊球市场，区域分析，2023 年
  • 全球IC封装焊球市场、市场吸引力分析，2024-2030年

第七章 全球IC封装用焊球市场概况

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
      • 铅焊球
      • 无铅焊球
    • 按申请
      • BGA
      • CSP・WLCSP
      • 其他的
    • 按地区
      • 北美洲
      • 欧洲
      • 亚太地区 (APAC)
      • 拉丁美洲 (LATAM)
      • 中东和非洲 (MEA)

第八章 北美IC封装焊球市场

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
    • 按申请
    • 按国家/地区
      • 美国
      • 加拿大

第九章欧洲IC封装焊球市场

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
    • 按申请
    • 按国家/地区
      • 德国
      • 英国
      • 义大利
      • 法国
      • 西班牙
      • 比利时
      • 俄罗斯
      • 荷兰
      • 其他欧洲国家

第十章亚太IC封装焊球市场

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
    • 按申请
    • 按国家/地区
      • 中国
      • 印度
      • 日本
      • 韩国
      • 澳洲和纽西兰
      • 印尼
      • 马来西亚
      • 新加坡
      • 越南
      • 亚太地区其他地区

第十一章拉丁美洲IC封装焊球市场

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
    • 按申请
    • 按国家/地区
      • 巴西
      • 墨西哥
      • 阿根廷
      • 秘鲁
      • 其他拉丁美洲

第十二章 中东及非洲IC封装焊球市场

  • 2019-2030年市场规模及预测
    • 按金额
  • 市场占有率及预测
    • 按类型
    • 按申请
    • 按国家/地区
      • 沙乌地阿拉伯
      • 阿拉伯聯合大公国
      • 卡达
      • 科威特
      • 南非
      • 奈及利亚
      • 阿尔及利亚
      • 其他中东/非洲

第十三章竞争格局

  • 主要参与者及其产品列表
  • 2023年全球IC封装焊球企业市场占有率分析
  • 透过管理参数进行竞争基准基准化分析
  • 重大策略发展（合併、收购、联盟等）

第14章 地缘政治紧张局势加剧对全球IC封装焊球市场的影响

第十五章 公司简介（公司简介、财务矩阵、竞争格局、关键人员、主要竞争对手、联络方式、策略展望、SWOT分析）

  • Amtech
  • Alpha Assembly Solutions
  • Kester Solder
  • Senju Metal
  • Taiyo Nippon Sanso
  • Kucera Corporation
  • Nippon Electric Glass
  • Showa Denko
  • Alent Technologies
  • Umicore
  • Indium Corporation
  • 其他主要企业

第十六章 主要策略建议

第十七章调查方法

简介目录
Product Code: BWC24766

Global Solder Ball in Integrated Circuit Packaging Market Set to Surpass USD 157 Billion by 2030

Global Solder Ball in Integrated Circuit Packaging Market is thriving due to a rising demand for integrated circuits in miniaturized electronic devices, expansion in semiconductor manufacturing, advancements in packaging, rapid adoption of IoT, and automotive electronics applications.

BlueWeave Consulting, a leading strategic consulting and market research firm, in its recent study, estimated Global Solder Ball in Integrated Circuit Packaging Market size by value at USD 75.30 billion in 2023. During the forecast period between 2024 and 2030, BlueWeave expects Global Solder Ball in Integrated Circuit Packaging Market size to expand at a CAGR of 11.20% reaching a value of USD 157.20 billion by 2030. Global Solder Ball in Integrated Circuit (IC) Packaging Market is expanding due to an increasing demand for miniaturized electronic devices, adoption of advancements in semiconductor technology, 5G, IoT, AI, enhanced thermal management, and growing trends in the automotive electronics and consumer electronics sector. These factors contribute to reliable electrical connections and increased demand for solder balls in IC packaging.

Opportunity - Rising Demand for High-Performance Electronic Devices

Global Solder Ball in Integrated Circuit (IC) Packaging Market is experiencing a surge in growth, due to an increasing demand for high-performance electronic devices, driven by advancements in 5G, AI (artificial intelligence), and IoT (Internet of Things). Solder balls are crucial for connecting semiconductor devices to PCBs (printed circuit boards), enhancing thermal conductivity, electrical connectivity, and device efficiency, driving market expansion in telecommunications, consumer electronics, and automotive industries.

Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

Escalating geopolitical tensions could significantly impact Global Solder Ball in Integrated Circuit Packaging Market, leading to supply chain disruptions, shortages of raw materials, and increased costs for chipmakers. Strained relations between major hubs, unpredictable regulatory environments, and fluctuating demand due to economic slowdowns could further limit market growth and profitability for manufacturers.

BGA Application Segment Leads Global Solder Ball in IC Packaging Market

Ball Grid Array (BGA) segment holds the largest share of Global Solder Ball in Integrated Circuit Packaging Market by application. BGA is widely used due to its ability to provide high-density packaging and efficient heat dissipation, making it suitable for advanced electronic devices. Its popularity in consumer electronics, telecommunications, and automotive industries, where miniaturization and performance are critical, drives its dominance. Other packaging technologies like Chip Scale Package (CSP) and Wafer Level Chip Scale Package (WLCSP) are growing but do not yet match BGA's widespread application and market share.

Competitive Landscape

Global Solder Ball in Integrated Circuit Packaging Market is fiercely competitive, with numerous companies vying for a larger market share. Major companies in the market include Amtech, Alpha Assembly Solutions, Kester Solder, Senju Metal, Taiyo Nippon Sanso, Kucera Corporation, Nippon Electric Glass, Showa Denko, Alent Technologies, Umicore, and Indium Corporation. These companies use various strategies, including increasing investments in their R&D activities, mergers and acquisitions, joint ventures, collaborations, licensing agreements, and new product and service releases to further strengthen their position in Global Solder Ball in Integrated Circuit Packaging Market.

The in-depth analysis of the report provides information about growth potential, upcoming trends, and statistics of Global Solder Ball in Integrated Circuit Packaging Market. It also highlights the factors driving forecasts of total market size. The report promises to provide recent technological trends in Global Solder Ball in Integrated Circuit Packaging Market and industry insights to help decision-makers make sound strategic decisions. Further, the report also analyzes the growth drivers, challenges, and competitive dynamics of the market.

Table of Contents

1. Research Framework

  • 1.1. Research Objective
  • 1.2. Product Overview
  • 1.3. Market Segmentation

2. Executive Summary

3. Global Solder Ball in Integrated Circuit Packaging Market Insights

  • 3.1. Industry Value Chain Analysis
  • 3.2. DROC Analysis
    • 3.2.1. Growth Drivers
      • 3.2.1.1. Miniaturization of Electronic Devices
      • 3.2.1.2. Growth in Semiconductor Industry
      • 3.2.1.3. Increasing Use of Electronic Devices in Various Industries
    • 3.2.2. Restraints
      • 3.2.2.1. Environmental Concerns
      • 3.2.2.2. Cost Pressures
    • 3.2.3. Opportunities
      • 3.2.3.1. Rising Demand for High-Performance Electronic Devices
      • 3.2.3.2. Technological Advancements in Solder Ball Production
    • 3.2.4. Challenges
      • 3.2.4.1. Competition from Alternative Interconnect Technologies
      • 3.2.4.2. Supply Chain Disruptions
  • 3.3. Technological Advancements/Recent Developments
  • 3.4. Regulatory Framework
  • 3.5. Porter's Five Forces Analysis
    • 3.5.1. Bargaining Power of Suppliers
    • 3.5.2. Bargaining Power of Buyers
    • 3.5.3. Threat of New Entrants
    • 3.5.4. Threat of Substitutes
    • 3.5.5. Intensity of Rivalry

4. Global Solder Ball in Integrated Circuit Packaging Market: Marketing Strategies

5. Global Solder Ball in Integrated Circuit Packaging Market: Pricing Analysis

6. Global Solder Ball in Integrated Circuit Packaging Market: Geographical Analysis

  • 6.1. Global Solder Ball in Integrated Circuit Packaging Market, Geographical Analysis, 2023
  • 6.2. Global Solder Ball in Integrated Circuit Packaging Market, Market Attractiveness Analysis, 2024-2030

7. Global Solder Ball in Integrated Circuit Packaging Market Overview

  • 7.1. Market Size & Forecast, 2019-2030
    • 7.1.1. By Value (USD Million)
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
      • 7.2.1.1. Lead Solder Balls
      • 7.2.1.2. Lead Free Solder Balls
    • 7.2.2. By Application
      • 7.2.2.1. BGA
      • 7.2.2.2. CSP & WLCSP
      • 7.2.2.3. Others
    • 7.2.3. By Region
      • 7.2.3.1. North America
      • 7.2.3.2. Europe
      • 7.2.3.3. Asia Pacific (APAC)
      • 7.2.3.4. Latin America (LATAM)
      • 7.2.3.5. Middle East and Africa (MEA)

8. North America Solder Ball in Integrated Circuit Packaging Market

  • 8.1. Market Size & Forecast, 2019-2030
    • 8.1.1. By Value (USD Million)
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
      • 8.2.3.1. United States
      • 8.2.3.1.1. By Type
      • 8.2.3.1.2. By Application
      • 8.2.3.2. Canada
      • 8.2.3.2.1. By Type
      • 8.2.3.2.2. By Application

9. Europe Solder Ball in Integrated Circuit Packaging Market

  • 9.1. Market Size & Forecast, 2019-2030
    • 9.1.1. By Value (USD Million)
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
      • 9.2.3.1. Germany
      • 9.2.3.1.1. By Type
      • 9.2.3.1.2. By Application
      • 9.2.3.2. United Kingdom
      • 9.2.3.2.1. By Type
      • 9.2.3.2.2. By Application
      • 9.2.3.3. Italy
      • 9.2.3.3.1. By Type
      • 9.2.3.3.2. By Application
      • 9.2.3.4. France
      • 9.2.3.4.1. By Type
      • 9.2.3.4.2. By Application
      • 9.2.3.5. Spain
      • 9.2.3.5.1. By Type
      • 9.2.3.5.2. By Application
      • 9.2.3.6. Belgium
      • 9.2.3.6.1. By Type
      • 9.2.3.6.2. By Application
      • 9.2.3.7. Russia
      • 9.2.3.7.1. By Type
      • 9.2.3.7.2. By Application
      • 9.2.3.8. The Netherlands
      • 9.2.3.8.1. By Type
      • 9.2.3.8.2. By Application
      • 9.2.3.9. Rest of Europe
      • 9.2.3.9.1. By Type
      • 9.2.3.9.2. By Application

10. Asia Pacific Solder Ball in Integrated Circuit Packaging Market

  • 10.1. Market Size & Forecast, 2019-2030
    • 10.1.1. By Value (USD Million)
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
      • 10.2.3.1. China
      • 10.2.3.1.1. By Type
      • 10.2.3.1.2. By Application
      • 10.2.3.2. India
      • 10.2.3.2.1. By Type
      • 10.2.3.2.2. By Application
      • 10.2.3.3. Japan
      • 10.2.3.3.1. By Type
      • 10.2.3.3.2. By Application
      • 10.2.3.4. South Korea
      • 10.2.3.4.1. By Type
      • 10.2.3.4.2. By Application
      • 10.2.3.5. Australia & New Zealand
      • 10.2.3.5.1. By Type
      • 10.2.3.5.2. By Application
      • 10.2.3.6. Indonesia
      • 10.2.3.6.1. By Type
      • 10.2.3.6.2. By Application
      • 10.2.3.7. Malaysia
      • 10.2.3.7.1. By Type
      • 10.2.3.7.2. By Application
      • 10.2.3.8. Singapore
      • 10.2.3.8.1. By Type
      • 10.2.3.8.2. By Application
      • 10.2.3.9. Vietnam
      • 10.2.3.9.1. By Type
      • 10.2.3.9.2. By Application
      • 10.2.3.10. Rest of APAC
      • 10.2.3.10.1. By Type
      • 10.2.3.10.2. By Application

11. Latin America Solder Ball in Integrated Circuit Packaging Market

  • 11.1. Market Size & Forecast, 2019-2030
    • 11.1.1. By Value (USD Million)
  • 11.2. Market Share & Forecast
    • 11.2.1. By Type
    • 11.2.2. By Application
    • 11.2.3. By Country
      • 11.2.3.1. Brazil
      • 11.2.3.1.1. By Type
      • 11.2.3.1.2. By Application
      • 11.2.3.2. Mexico
      • 11.2.3.2.1. By Type
      • 11.2.3.2.2. By Application
      • 11.2.3.3. Argentina
      • 11.2.3.3.1. By Type
      • 11.2.3.3.2. By Application
      • 11.2.3.4. Peru
      • 11.2.3.4.1. By Type
      • 11.2.3.4.2. By Application
      • 11.2.3.5. Rest of LATAM
      • 11.2.3.5.1. By Type
      • 11.2.3.5.2. By Application

12. Middle East & Africa Solder Ball in Integrated Circuit Packaging Market

  • 12.1. Market Size & Forecast, 2019-2030
    • 12.1.1. By Value (USD Million)
  • 12.2. Market Share & Forecast
    • 12.2.1. By Type
    • 12.2.2. By Application
    • 12.2.3. By Country
      • 12.2.3.1. Saudi Arabia
      • 12.2.3.1.1. By Type
      • 12.2.3.1.2. By Application
      • 12.2.3.2. UAE
      • 12.2.3.2.1. By Type
      • 12.2.3.2.2. By Application
      • 12.2.3.3. Qatar
      • 12.2.3.3.1. By Type
      • 12.2.3.3.2. By Application
      • 12.2.3.4. Kuwait
      • 12.2.3.4.1. By Type
      • 12.2.3.4.2. By Application
      • 12.2.3.5. South Africa
      • 12.2.3.5.1. By Type
      • 12.2.3.5.2. By Application
      • 12.2.3.6. Nigeria
      • 12.2.3.6.1. By Type
      • 12.2.3.6.2. By Application
      • 12.2.3.7. Algeria
      • 12.2.3.7.1. By Type
      • 12.2.3.7.2. By Application
      • 12.2.3.8. Rest of MEA
      • 12.2.3.8.1. By Type
      • 12.2.3.8.2. By Application

13. Competitive Landscape

  • 13.1. List of Key Players and Their Offerings
  • 13.2. Global Solder Ball in Integrated Circuit Packaging Company Market Share Analysis, 2023
  • 13.3. Competitive Benchmarking, By Operating Parameters
  • 13.4. Key Strategic Developments (Mergers, Acquisitions, Partnerships, etc.)

14. Impact of Escalating Geopolitical Tensions on Global Solder Ball in Integrated Circuit Packaging Market

15. Company Profiles (Company Overview, Financial Matrix, Competitive Landscape, Key Personnel, Key Competitors, Contact Address, Strategic Outlook, and SWOT Analysis)

  • 15.1. Amtech
  • 15.2. Alpha Assembly Solutions
  • 15.3. Kester Solder
  • 15.4. Senju Metal
  • 15.5. Taiyo Nippon Sanso
  • 15.6. Kucera Corporation
  • 15.7. Nippon Electric Glass
  • 15.8. Showa Denko
  • 15.9. Alent Technologies
  • 15.10. Umicore
  • 15.11. Indium Corporation
  • 15.12. Other Prominent Players

16. Key Strategic Recommendations

17. Research Methodology

  • 17.1. Qualitative Research
    • 17.1.1. Primary & Secondary Research
  • 17.2. Quantitative Research
  • 17.3. Market Breakdown & Data Triangulation
    • 17.3.1. Secondary Research
    • 17.3.2. Primary Research
  • 17.4. Breakdown of Primary Research Respondents, By Region
  • 17.5. Assumptions & Limitations

*Financial information of non-listed companies can be provided as per availability.

**The segmentation and the companies are subject to modifications based on in-depth secondary research for the final deliverable.