市场调查报告书
商品编码
1131999
焊锡材料全球市场规模调查,按产品类型(焊锡丝、焊膏、焊条、助焊剂)、按工艺(丝网印刷、机器人、激光、波峰/回流焊)、区域预测 2022-2028Global Solder Materials Market Size study, By Product Type (Solder Wire, Solder Paste, Solder Bar, Solder Flux), By Process (Screen-printing, Robotic, Laser, Wave/Reflow), and Regional Forecasts 2022-2028 |
焊料是通常用于将金属工件连接在一起的易熔金属合金。
该工艺中使用的金属填料的熔点低于其他相邻金属。汽车行业使用量增加、电子行业需求增长以及无铅焊料研发投资增加等因素正在推动全球市场需求。例如,根据 Statista 的数据,2017 年汽车行业的价值估计约为 5.315 万亿美元,预计到 2030 年该行业将逐渐增长至 8.931 万亿美元。因此,汽车行业的增长刺激了对焊锡材料的需求,这将有利于在不久的将来全球市场的增长。然而,无铅焊料的高成本以及与焊接相关的若干健康风险正在阻碍 2022-2028 年预测期内的市场增长。此外,在预测期内,基于纳米粒子的焊料材料的兴起和半导体行业焊料材料的日益普及预计将成为市场需求的催化剂。
考虑进行全球焊接材料市场研究的主要地区包括亚太地区、北美、欧洲、拉丁美洲和世界其他地区。由于先进半导体设备产量的增加和翻新行业的增长,北美是全球市场份额的主要地区。另一方面,预计亚太地区将在 2022-2028 年的预测期内表现出最高的复合年增长率。电子设备需求激增和政府加大经济发展力度等因素将为亚太地区焊料市场提供良好的增长前景。
本报告中包括的主要市场进入者是:
本研究的目的是确定近年来各个细分市场和国家的市场规模,并预测未来八年的价值。本报告旨在捕捉所研究的每个地区和国家的行业的定性和定量方面。此外,它还提供了有关关键方面的详细信息,例如定义市场未来增长的驱动因素和挑战。此外,报告还应详细分析主要参与者的竞争格局和产品供应,以及微观市场中可供利益相关者投资的机会。市场的详细细分和子细分如下所述。
按产品类型。
焊锡丝
锡膏
焊锡条
助焊剂
按流程
丝网印刷
机器人
激光
波/回流
按地区
北美
美国
加拿大
欧洲
英国
德国
法国
西班牙
意大利
欧洲其他地区
亚太地区
中国
印度
日本
澳大利亚
韩国
其他亚太地区
拉丁美洲
巴西
墨西哥
世界其他地区
此外,本研究考虑的年份是:
实际年份 - 2018 年、2019 年、2020 年
2021 年基准年
预测期 - 2022-2028
本报告的目标受众是全球焊接材料市场
主要咨询公司和顾问
大公司、中型公司、中小企业
风险投资
增值经销商 (VAR)
第三方知识提供者
投资银行家
投资者
Global Solder Materials Market is valued at approximately USD XX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2028. Solder is a fusible metal alloy that is generally used to form a bond between metal workpieces. The filler metal used during the process consists of a lower melting point compared to the other adjoining metal. Factors such as the rising usage in the automotive industry, growing demand from the electronics industry, coupled with the increasing R&D investments for lead-free solder materials are propelling the market demand across the globe. For instance, according to Statista, in 2017, the automotive industry was estimated to be worth around USD 5,315 billion, and the industry progressively grows and is anticipated to reach USD 8,931 billion by the year 2030. Consequentially, the growth of the automotive industry is stimulating the demand for Solder Materials, which, in turn, excels the global market growth in the near future. However, the high cost of lead-free solder and several health risks associated with soldering impede the growth of the market over the forecast period of 2022-2028. Also, the rising emergence of nanoparticle-based solder materials and the growing adoption of solder materials from the semiconductor industry are anticipated to act as catalyzing factors for the market demand during the forecast period.
The key regions considered for the global Solder Materials Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America is the leading region across the world in terms of market share owing to the increasing production of advanced semiconductor devices and growth of the refurbishing industry. Whereas, Asia-Pacific is anticipated to exhibit the highest CAGR over the forecast period 2022-2028. Factors such as the surging demand for electronic devices, as well as rising government initiatives toward economic development, would create lucrative growth prospects for the Solder Materials Market across the Asia-Pacific region.
Major market players included in this report are:
Element Solutions, Inc.
Lucas Milhaupt Inc.
Henkel AG & Co. KGaA
Senju Metal Industries Co. Ltd.
Koki Company Limited
Indium Corporation
The Dow Chemical Company (DowDuPont)
Tamura Corporation
Stannol GmbH & Co. KG
Nihon Genma
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Product Type:
Solder Wire
Solder Paste
Solder Bar
Solder Flux
By Process:
Screen-printing
Robotic
Laser
Wave/Reflow
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year - 2018, 2019, 2020
Base year - 2021
Forecast period - 2022 to 2028
Target Audience of the Global Solder Materials Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors
List of figures