市场调查报告书
商品编码
1134983
IC Socket 全球市场研究与预测:按产品(双列直插封装、球栅阵列、四方扁平封装、小外形封装、S 小外形 IC 封装)、按应用、按地区分析,2022-2029Global Microcontroller Socket Market Size study & Forecast, by Product (Dual In-line Package, Ball Grid Array, Quad Flat Package, Small Outline Package, Small Outline IC Package ), by Application, and Regional Analysis, 2022-2029 |
在预测期内,汽车、工业和电信行业越来越多地使用微控制器,推动了 IC 插座市场。
配备微控制器的电子设备可以通过多种方式进行操作。此外,易于管理电气设备。此外,智能手机的普及也推动了市场的增长。微控制器的使用非常广泛,因为该控制器增强了智能手机的功能。
据 Statista 称,全球智能手机普及率正在上升,这推动了预测期内市场的增长。 2018年,全球67.06%的人口使用智能手机,2020年将上升至78.05%。与此同时,联网汽车行业的收入正在增加,这推动了预测期内市场的增长。例如,根据 Statista 的数据,2022 年的市场预计将从 2020 年的 2.71 万亿美元增长到 2.95 万亿美元。此外,智能电錶的普及在预测期内为市场创造了有利可图的增长机会。然而,提供类似产品的主要市场参与者的数量可能会影响预测期内的市场增长。
全球 IC 插座市场研究考虑的主要地区是亚太地区、北美、欧洲、拉丁美洲和世界其他地区。由于该行业在无线通信和智能能源方面的持续进步,预计北美 IC 插座市场在预测期内将稳步扩大。由于中国和日本等国家的需求增加,预计亚太地区 IC 插座市场将在预测期内显着扩大。微电子行业对各种应用中的插座的需求不断增长,这有助于增长。
本报告中包含的主要市场参与者是:
该研究的目的是确定近年来各个细分市场和国家/地区的市场规模,并预测它们在未来几年的价值。该报告旨在捕捉被调查国家工业的定性和定量方面。
它还提供了关键方面的详细信息,例如定义市场未来增长的驱动因素和挑战。此外,它还结合了利益相关者投资的微观市场潜在机会,以及对主要参与者的竞争格局和产品供应的深入分析。市场的详细细分和子细分如下所述。
按产品
双列直插式封装 (DIP)
球栅阵列 (BGA)
四方扁平封装 (QFP)
小外形封装 (SOP)
小外形 IC 封装 (SOIC)
按应用程序
汽车
消费类电子产品
工业设备
医疗器械
军事/国防
按地区
北美
美国
加拿大
欧洲
英国
德国
法国
西班牙
意大利
其他欧洲
亚太地区
中国
印度
日本
澳大利亚
韩国
其他亚太地区
拉丁美洲
巴西
墨西哥
世界其他地区
Global Microcontroller Socket Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2029. Microcontroller sockets, often referred to as IC sockets, serve as stand-ins for IC chips in devices having integrated circuits. The growing use of microcontrollers in the automotive, industrial, and communications industries has fueled the market's expansion over the anticipated period. Electronic devices with microcontrollers installed can be operated in a variety of ways. The management of electrical gadgets is made easier by technology. Along with this, rising use of smartphones is also driving the growth of the market over the forecasted period. As the application of microcontrollers is immense, as this controller improves the functionality of smartphones.
According to Statista, the global smartphone penetration rate is increasing which is driving the growth of the market over the forecasted period. In 2018, the percentage of people using smartphones globally was 67.06% which has increased to 78.05% in 2020. Along with this, the revenue of the connected car industry is increasing which is driving the growth of the market over the forecasted period. For instance, according to Statista, in 2022 the market would lift up to USD 2.95 trillion from USD 2.71 trillion in 2020. Moreover, the adoption of smart meters is creating lucrative growth opportunities for the market over the forecasted period. However, number of key market players offering similar products may affect the market growth during the forecast period.
The key regions considered for the Global Microcontroller Socket Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. The market for microcontroller sockets in North America is anticipated to expand steadily over the course of the forecast period as a result of the industry's continued advancement in wireless communications and smart energy. The Asia Pacific microcontroller socket market is anticipated to expand significantly over the course of the projected period as a result of the rising demand in nations like China and Japan. The microelectronics industry's expanding need for sockets in a variety of applications has contributed to the growth.
Major market players included in this report are:
Samtec, Inc.
CNC Tech LLC
Molex Inc.
Foxconn Technology Group
Sensata Technologies B.V.
Plastronics Socket Company Inc.
Tyco Electronics Ltd.
Chupond Precision Co. Ltd.
Win Way Technology Co. Ltd.
3M Company
Recent Developments in the Market:
Global Microcontroller Socket Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Product, Application, Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Product:
Dual In-line Package (DIP)
Ball Grid Array (BGA)
Quad Flat Package (QFP)
Small Outline Package (SOP)
Small Outline IC Package (SOIC)
By Application:
Automotive
Consumer Electronics
Industrial
Medical Device
Military & Defense
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable