市场调查报告书
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1370530
微控制器插座市场:2023-2028 年全球产业趋势、份额、规模、成长、机会与预测Microcontroller Socket Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028 |
2022年全球微控制器插座市场规模达到11亿美元。展望未来,IMARC Group预计到2028年市场规模将达到16亿美元,2023-2028年的复合年增长率(CAGR)为5.5%。
微控制器插座也称为积体电路 (IC) 插座,是专为低功耗设备设计的静态连接器。四方扁平封装 (QFP)、小外形封装 (SOP)、双列直插式封装 (DIP)、球栅阵列 (BGA) 和小外形 IC (SOIC) 是一些标准产品变体。这些插座用于安全地插入和取出可能因焊接而损坏的 IC 晶片。微控制器插座具有许多优点,例如低功耗、最佳资料频宽、灵活性、敏感度、高阶使用者介面支援和低系统成本。因此,它们在汽车、消费性电子、工业、医疗、军事和国防工业中得到了广泛的应用。
该市场主要是由汽车行业广泛采用的产品所推动的。微控制器插座用于支援车身电子、驾驶安全和资讯设备的小型设计和高整合度。与此一致的是,智慧能源对高精度计量和电力线通讯的需求不断增长,进一步有助于提高电錶的性能,有利于市场成长。此外,对有助于小型化和数位化并促进技术领域动态发展的自动化的需求不断增长,也是另一个成长诱导因素。除此之外,支援高性能、高密度需求并提供快速解决方案的小型化微控制器插座的推出也为市场成长提供了动力。此外,BGA 的广泛采用通常是永久安装设备(例如微处理器)的首选,并且用于 IC 和表面贴装封装的面积类型,正在推动市场成长。此外,主要参与者专注于开发 IC 封装技术,以低成本、外形和功率设计提供高应用,这对市场成长产生了积极影响。这些因素,包括军事和国防工业中广泛采用产品以增强安全性以及广泛的研发(R&D)活动,正在支持市场成长。
The global microcontroller socket market size reached US$ 1.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 1.6 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Microcontroller sockets, also known as integrated circuit (IC) sockets, are static connectors designed for low-power devices. Quad-flat package (QFP), small outline package (SOP), dual-in-line package (DIP), ball grid array (BGA), and small outline IC (SOIC) are some standard product variants. These sockets are used to safely insert and remove IC chips that may get damaged from soldering. Microcontroller sockets offer numerous advantages, such as low power consumption, optimal data bandwidth, flexibility, susceptibility, high-end user interface support, and low system cost. As a result, they find extensive applications across the automotive, consumer electronics, industrial, medical, military, and defense industries.
The market is primarily being driven by the widespread product adoption in the automotive industry. Microcontroller sockets are used to support the small design and high level of integration in body electronics, driving safety, and information devices. In line with this, the escalating demand for smart energy for metering and power line communications with high accuracy, further helping in improving the performance of meters, is favoring the market growth. Additionally, the increasing need for automation that assists in miniaturization and digitization and facilitates dynamics in the field of technology is acting as another growth-inducing factor. Apart from this, the introduction of miniaturized microcontroller sockets that supports high-performance, high-density demands and deliver fast solutions is providing an impetus to the market growth. Moreover, the widespread adoption of BGAs that are usually preferred for permanently mounted devices, such as microprocessors, and are used for ICs and area type of surface-mount packaging is propelling the market growth. Furthermore, key players are focusing on developing IC packaging techniques delivering a high application in a low-cost, -profile, and -power design is positively influencing the market growth. The factors, including the widespread product adoption in the military and defense industry for enhanced security and extensive research and development (R&D) activities, are supporting the market growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global microcontroller socket market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product and application.
DIP
BGA
QFP
SOP
SOIC
Automotive
Consumer Electronics
Industrial
Medical Devices
Military and Defense
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Interconnections, Andon Electronics, Aries Electronics Inc., Johnstech International Corporation, Loranger International Corporation, Microchip Technology, Mill-Max Mfg. Corp., PRECI-DIP SA, TE Connectivity and Texas Instruments Inc.