市场调查报告书
商品编码
1210908
SLP(类基板 PCB)全球市场规模调查和预测:按应用(消费电子、汽车、通信)、区域分析,2022-2029 年Global Substrate-Like-PCB Market Size study & Forecast, by Application (Consumer Electronics, Automotive, Communication) and Regional Analysis, 2022-2029 |
Substrate-Like-PCB用作PCB板和器件主体之间的介质。
通过高效地将信号传输到连接的组件,您可以减少连接数量并最大限度地降低整体功耗。 由于对智能设备和电子设备的需求增加,以及对类基板PCB应用意识的增强,类基板PCB市场正在扩大。
根据 2021 年印度手机和电子协会 (ICER) 的数据,印度的电子产品出口增长迅速,在过去五年中翻了一番。 2019年,电子产品出口收入达到约150亿美元。 主要出口项目包括智能手机,在过去五年中增长了约 38 亿美元。 越来越多地进入汽车行业和市场参与者增加研发活动正在为市场创造有利可图的机会。 然而,高昂的设置成本阻碍了整个 2022-2029 年预测期内的市场增长。
全球类基板 PCB 市场研究中考虑的主要区域是亚太地区、北美、欧洲、拉丁美洲和世界其他地区。 由于智能手机的普及、对连接解决方案的采用和需求增加以及互联网用户普及率的提高,亚太地区在收入方面占据主导地位。 另一方面,由于市场参与者和用户在预测期内从 3G 迁移到 4G 和 5G 技术的增长活动增加等因素,预计亚太地区在预测期内将显着增长。
这项研究的目的是定义近年来各个细分市场和国家的市场规模,并预测未来几年的价值。 该报告旨在捕捉被调查国家工业的定性和定量方面的情况。
它还提供了关键方面的详细信息,例如决定市场未来增长的驱动因素和挑战。 此外,它还包含供利益相关者投资的微观市场潜在机会,以及对主要参与者的竞争格局和产品供应的深入分析。
Global Substrate-Like-PCB Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. Substrate-Like-PCB is used as a medium between the PCB board and the device body. It reduces the number of connections and minimizes overall power consumption by efficiently transferring signals to connected components. The Substrate-Like-PCB market is expanding because of factors such as the rising demand for smart devices & electronic devices and growing awareness towards the application of Substrate-like-PCB.
According to INDIA CELLULAR AND ELECTRONICS ASSOCIATION (ICER) in 2021, India's electronics exports are rising rapidly and get doubled in the past five years. In 2019 the revenue generation reached to approximately USD 15 billion from the export of electronic devices. The source also states that major export items include smartphones with increased growth of about USD 3.8 billion in the last five years. Whereas rising advancement towards the automobile sector and growing R&D activities by market players create lucrative opportunities for the market. However higher set-up cost hampers the market growth throughout the forecast period of 2022-2029.
The key regions considered for the Global Substrate-Like-PCB Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific dominated the market in terms of revenue, owing to the increasing adoption of smartphones, growing adoption and demand for connectivity solutions, and rising penetration of internet users. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing rising growth activities by market players, and the shift of users from 3G to 4G & 5G technologies in the forecast period
Major market players included in this report are:
Kinsus Interconnect Technology Corp.
Ibiden Co.Ltd.
Compeq Manufacturing Co. Ltd.
Daeduck Electronics Co. Ltd.
Unimicron Technology Corporation
Zhen Ding Technology
TTM Technologies
Meiko Electronics
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
Korea Circuit
Recent Developments in the Market:
Global Substrate-Like-PCB Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Application, Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Application:
Consumer Electronics,
Automotive,
Communication
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable