查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1137998

SLP（类基板 PCB）市场 - COVID-19 的增长、趋势、影响和预测（2022-2027 年）

Substrate-Like-PCB Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 110 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

SLP（类基板 PCB）市场预计在预测期间（2022-2027 年）将以 12% 的复合年增长率增长。

OEM、智能电器和可穿戴设备越来越多地采用 SLP（类基板 PCB），见证了 SLP（类基板 PCB）市场的增长。对小型化和高效互连解决方案的需求也促进了 SLP（类基板 PCB）市场的增长。目前，市场严重依赖高端智能手机的增长。

主要亮点

  • PCB 基板用作 PCB 板和设备主体其余部分之间的介质，不会导致设备断电或发生故障。两个单元之间的互连器用于有效地将信号传输到连接的组件，减少连接总数并导致整体功耗。
  • 随着智能手机 OEM 转向 5G，他们越来越多地采用这种 SLP 技术，这是市场增长的主要驱动力。 5G SoC 供应商联发科宣布，其 2020 年出货量翻了一番，占全球智能手机 SoC 的近 40%。这标誌着对 5G 设备的需求增加，预计这将推动预测期内 SLP 的增长。
  • 汽车生产和销售的增加以及高级安全功能（其中一些是政府机构强制要求的）安装的增加需要便利和舒适的系统。对混合动力电动汽车 (HEV) 和电池电动汽车的需求不断增长是可能在预测期内推动市场增长的主要因素。
  • 某些挑战将阻碍整个市场的发展。熟练劳动力短缺、缺乏标准和协议等因素正在限制市场增长。此外，与 SLP 相关的复杂集成系统和高成本设置预计将在预测期内放缓增长。
  • 随着物联网、5G 和智能汽车等技术趋势的兴起，PCB 尺寸正在缩小，并且需要更强大的基板。因此，SLP 将被大规模用于支持这些技术趋势。
  • 基板製造极大地限制了全球芯片供应链。由于该行业相对较新且利润率较低，因此该行业在市场上的投资不足。此外，大流行给现有运营带来了巨大压力，全球芯片短缺限制了 PC 销售，迫使工厂关闭，以及由于密封电子设备导致成本增加。

主要市场趋势

汽车行业推动市场增长

  • 目前，汽车越来越依赖电子元件。过去，电子电路仅用于前照灯开关和雨刮器，但如今的汽车广泛使用电子电路。
  • 通过将印刷电路板整合到新的应用中，现代汽车可以从不断发展的电子电路技术中受益。处理射频、微波和毫米波等高频信号的 PCB 经常用于已安装在汽车中的传感器应用中。事实上，曾经为军用车辆保留的雷达技术现在已广泛用于现代汽车中，用于在巡航控制期间进行防撞、盲点监控和自适应交通状况。
  • 刚柔结合基板目前是物联网设备设计中高耐用性的有力候选者。刚柔结合板不是单一的实心板，而是一系列用柔性走线连接在一起的小板。汽车振动很大，这给传统的刚性板带来了沉重的负担。因此，许多车载电子製造商正在用更抗振、更小和更轻的柔性基板代替刚性基板。
  • 汽车有很大的振动，这给传统的刚性板带来了很大的压力。因此，许多车载电子製造商都在采用柔性基板，这种基板具有出色的抗振性，可以做得更小、更轻，而不是刚性基板。
  • 随着汽车生产和销售数量的增加以及政府机构强制要求安装的高级安全功能的不断推进，人们需要具有高度便利性和舒适性的系统。对混合动力电动汽车 (HEV) 和电池电动汽车的需求不断增长是推动预测期内市场增长的主要因素。

预计亚太地区将成为增长最快的市场

  • 亚太地区已成为 SLP 的新兴市场，因为它作为大规模投资和业务扩张的机会而受到全球关注。在全球范围内，超过一半的手机用户位于亚太地区，包括中国和印度。此外，该地区正在见证用户从 3G 到 4G 和 5G 技术的范式转变。
  • 推动亚太地区 SLP 市场增长的主要因素是智能手机普及率的提高、对连接解决方案的需求不断增加、互联网用户数量的增加、带宽密集型应用程序的扩展以及扩大该地区的电信基础设施。大多数智能手机供应商都是亚太地区的公司。在预测期内，预计亚太地区对 SLP 的需求将很大。
  • 韩国、台湾和日本的 SLP 製造商主导着生产活动。例如，台湾的 ZD Tech 和日本的 Meiko 正在为多个智能手机客户在越南和中国扩展新的 SLP（类基板 PCB）生产线。台湾已成为 SLP 技术发展的主要地点之一。在中国，来自台湾的技术转移将逐渐积累SLP（基板类PCB）技术诀窍。
  • 截至 2021 年 4 月，已有 70 个国家和城市宣布了到 2050 年实现 100% 零排放汽车和逐步淘汰内燃机汽车的目标。例如，日本政府制定了到 2050 年在国内停止使用内燃机汽车的目标，并正在努力实现这一目标。该国已开始向电动汽车购买者提供临时补贴。
  • 2021 年 6 月，AT&S 宣布已选择马来西亚作为其在东南亚的首个生产基地，用于製造高端印刷电路板 (PCB) 和集成电路 (IC) 基板。
  • 按地区划分，台湾、日本和中国等亚太国家在全球 PCB 市场中占有很大份额。根据台湾2021年10月公布的全国统计数据，2020年PCB产量较2019年增加5740万平方尺或9.083%。中国和印度预计将在未来与台湾竞争，因为大规模的努力和投资将继续与中国和印度分别制定的环境和健康法规同时进行。

竞争格局

随着行业领导者主导市场份额，SLP（类基板 PCB）市场正在整合。主要参与者包括 Kinsus Interconnect Technology Corp.、Ibiden、Compeq Manufacturing、Daeduck Electronics、Unimicron Technology Corporation、臻鼎科技、Meiko Electronics、TTM Technologies、AT&S 等。

  • 2022 年 5 月- 总部位于美国的 TTM Technologies Inc (TTM) 宣布计划在马来西亚槟城新建一座高度自动化的印刷电路板 (PCB) 製造厂，到 2025 年产量将达到 1.3 亿美元。提出了美国的资本投资提案10,000 美元。马来西亚的扩张解决了人们对先进技术、PCB 供应链弹性和区域多样性日益增长的担忧。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 三个月的分析师支持

内容

第1章介绍

  • 研究假设和市场定义
  • 调查范围

第2章研究方法

第 3 章执行摘要

第 4 章市场洞察

  • 市场概览
  • 工业吸引力 - 波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 工业价值链分析

第五章市场动态

  • 市场驱动力
    • 对家用电器和智能设备的需求不断扩大
  • 市场製约因素
    • 与 SLP 相关的高昂设置成本

第 6 章市场细分

  • 应用
    • 消费品
    • 汽车
    • 通讯
    • 其他应用
  • 按地区
    • 北美
    • 欧洲
    • 亚太地区
    • 世界其他地区

第 7 章竞争格局

  • 公司简介
    • Kinsus Interconnect Technology Corp.
    • Ibiden Co.Ltd.
    • Compeq Manufacturing Co. Ltd.
    • Daeduck Electronics Co. Ltd.
    • Unimicron Technology Corporation
    • Zhen Ding Technology
    • TTM Technologies
    • Meiko Electronics
    • Austria Technologie & Systemtechnik Aktiengesellschaft

（AT&S社）

    • 韩国巡迴赛
    • LG Innotek Co., Ltd.
    • 三星电子 - 机械

第八章投资分析

第 9 章市场潜力

简介目录
Product Code: 66813

The Substrate-Like-PCB Market is expected to grow at a CAGR of 12% during the forecast period (2022 - 2027). Owing to the rising adoption of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices, there is a growth in the substrate-like PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth.

Key Highlights

  • A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
  • Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
  • Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
  • Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
  • With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
  • Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.

Key Market Trends

Automotive Industry to Drive the Market Growth

  • Currently, automobiles increasingly rely on electronic components. Unlike in the past, when electronic circuits were solely used for headlight switches and windshield wipers, current automobiles make extensive use of electronics.
  • By incorporating PCBs into certain novel applications, the latest autos take the benefit of ever-advancing electronic circuit technology. Sensor applications, which are already popular in autos, frequently require PCBs that work with high-frequency signals, such as RF, microwave, or millimeter-wave frequencies. In fact, radar technology, which was formerly only used in military vehicles, is also widely used in modern automobiles to help drivers avoid collisions, monitor blind spots, and adjust to traffic conditions when on cruise control.
  • Currently, rigid-flex PCBs have been witnessing significant traction candidates for achieving high durability in IoT device design. Instead of one solid board, they feature various smaller ones joined with flexible wiring. The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
  • The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
  • Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that will drive market growth during the forecast period.

Asia Pacific is Expected to be the Fastest Growing Market

  • Asia-Pacific is an emerging market for substrate-like PCBs as it has become a global focal point for significant investments and business expansion opportunities. Globally, more than half of the mobile subscribers are present in Asia-Pacific, such as in China and India. Moreover, there has been a paradigm shift of users from 3G to 4G and 5G technology in this region.
  • Key factors that are driving the substrate-like-PCB market growth in the Asia-Pacific region include the increasing adoption of smartphones, rising demand for connectivity solutions, a growing number of internet users, expanding bandwidth-intensive applications, and expansion of telecommunications infrastructure in the region. The majority of the smartphone providers are from the Asia-Pacific region; it is expected that there will be a significant demand for substrate-like-PCB in the Asia-Pacific region during the forecast period.
  • Substrate-like-PCB manufacturers from South Korea, Taiwan, and Japan are dominating production activities. For instance, players like Taiwan-headquartered ZD Tech and japan-headquartered Meiko are expanding new substrate-like-PCB production lines in Vietnam and China for more than one smartphone customer. Taiwan has become one of the major places for the development of substrate-like-PCB technology. Certainly, China will gain substrate-like-PCB technical know-how progressively with technology transfer from the major player.
  • As of April 2021, 70 subnational and city governments announced 100% zero-emission vehicle targets or the phaseout of internal combustion engine vehicles before 2050. For instance, Japan's government has set a goal of eliminating the use of internal combustion engine vehicles in the country by 2050 to help achieve this goal. The country has begun granting one-time subsidies to buyers of electric vehicles.
  • In June 2021, AT&S announced that it chose Malaysia as its first production plant in Southeast Asia for the manufacturing of high-end printed circuit boards (PCB) and integrated circuit (IC) substrates.
  • Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. According to Taiwan National Statistics published in October 2021, PCB production in 2020 increased by 57.4 million square feet, or 9.083%, as compared to 2019. China and India are expected to match Taiwan in the future, as massive efforts and investments have been ongoing in parallel with environmental and health-based regulations placed by China and India, respectively.

Competitive Landscape

The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.

  • May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Consumer Electronics and Smart Devices
  • 5.2 Market Restraints
    • 5.2.1 Higher Setup Cost Associated with Substrate-like-PCB

6 MARKET SEGMENTATION

  • 6.1 Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotives
    • 6.1.3 Communication
    • 6.1.4 Other Applications
  • 6.2 Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia Pacific
    • 6.2.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Kinsus Interconnect Technology Corp.
    • 7.1.2 Ibiden Co.Ltd.
    • 7.1.3 Compeq Manufacturing Co. Ltd.
    • 7.1.4 Daeduck Electronics Co. Ltd.
    • 7.1.5 Unimicron Technology Corporation
    • 7.1.6 Zhen Ding Technology
    • 7.1.7 TTM Technologies
    • 7.1.8 Meiko Electronics
    • 7.1.9 Austria Technologie & Systemtechnik Aktiengesellschaft

(AT&S)

    • 7.1.10 Korea Circuit
    • 7.1.11 LG Innotek Co.Ltd
    • 7.1.12 Samsung Electro - Mechanics

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET