查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1517340

全球相机模组市场规模研究，按製程（板载相机模组、倒装晶片相机模组）、组件、介面、像素、应用和区域预测 2022-2032 年。

Global Camera Module Market Size study, by Process (Chip-On-Board Camera Module, Flip-Chip Camera Module), by Component, by Interface, by Pixel, by Application and Regional Forecasts 2022-2032.
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 200 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2023年全球相机模组市场价值约为363亿美元，预计在2024-2032年预测期内将以超过7.55%的健康成长率成长。全球相机模组市场满足了消费性电子和工业应用领域对卓越成像和感测解决方案不断增长的需求。这些模组包括影像感测器、镜头组件、音圈马达、红外线截止滤光片和印刷电路板，对于捕捉高解析度影像和视讯至关重要。智慧型手机技术的快速进步和日益增长的安全问题推动了对先进监控系统和更高品质摄影机的需求。此外，汽车产业中先进驾驶辅助系统（ADAS）的日益整合进一步增加了对高效能摄影机模组的需求，从而推动市场成长。然而，与相机模组相关的高生产成本和品质问题对市场成长构成了重大挑战。另一方面，智慧城市的出现需要视讯监控、3D 深度感测技术的进步以及可穿戴设备和物联网应用的摄影机模组的小型化，预计将在市场上创造利润丰厚的机会。

板载晶片 (COB) 和倒装晶片技术的普及为相机模组产业的特定应用提供了独特的优势。板载晶片 (COB) 模组提供紧凑、轻巧的解决方案，非常适合受空间限制的便携式设备，确保高速资料传输、卓越的热性能，并因减少讯号干扰而增强影像品质。相反，倒装晶片相机模组采用一种称为倒装晶片接合的先进封装技术，无需引线接合即可将影像感测器晶片直接连接到印刷电路板(PCB)，从而实现更纤薄的外形和更快的资料传输。 COB 和倒装晶片相机模组之间的选择取决于装置尺寸限制、所需的影像品质、资料传输速度、功耗要求和成本考虑。

相机模组市场中的高品质影像和视讯製作取决于几个关键组件，包括数位讯号处理 (DSP)、影像感测器、红外线滤光片、镜头、软板或印刷电路板 (PCB)。数位讯号处理 (DSP) 精炼原始影像资料，以确保清晰的影像和准确的色彩再现，支援降噪和镜头畸变校正等基本功能。影像感测器将光转换为电子讯号，在确定相机模组产生的影像品质方面发挥关键作用。红外线滤光片消除了不必要的红外光，这些红外线可能会导致户外应用中的颜色失真。非球面镜片以减少球面像差同时保持紧凑设计而闻名，越来越受欢迎。软板或 PCB 行业对高密度互连 (HDI) 板的需求日益增长，以支援相机模组市场的小型化趋势。

相机并行介面 (CPI) 和相机串列介面 (CSI) 代表了将相机模组连接到主机设备的两种不同方法。相机并行介面（CPI）是一种传统方法，采用多条资料线进行高速并行通信，使其适合高频宽和低延迟应用，例如工业视觉系统和高速视讯处理。相机串列介面 (CSI) 使用差分讯号方案透过更少的讯号线串列传输影像资料，从而减少电磁干扰 (EMI)、提高抗杂讯并延长电缆长度。 CSI 对于智慧型手机、平板电脑、无人机和物联网设备等应用特别有利，在这些应用中，更小的外形尺寸和更低的功耗至关重要。

相机模组在汽车、消费性电子、国防、工业、医疗和个人运算设备等各个领域都是不可或缺的。在汽车行业，先进驾驶辅助系统(ADAS)、后视摄影机和自动驾驶汽车依靠摄影机模组来实现车道偏离警告和停车辅助等功能。消费性电子市场需要用于数位相机、运动相机、无人机和 VR 耳机的高品质相机模组。国防和太空应用将摄影机模组用于监视系统、侦察无人机/UAV（无人驾驶飞行器）和卫星成像系统。工业领域在机器视觉系统和自动化机器人中使用相机模组。医疗应用需要用于内视镜检查、显微镜、眼科设备以及其他诊断设备的专用相机模组。相机模组也是智慧型手机、平板电脑和个人电脑中用于拍摄照片和促进视讯通话的重要组件。

在美洲，对摄影机模组的需求受到智慧型手机、整合 ADAS 的汽车应用、安全和监控系统以及消费性电子产品等关键产业的推动。在美国和加拿大，消费者优先考虑高品质的影像捕捉和录影功能。由于智慧型手机采用率上升和汽车产业不断扩大，欧洲、中东和非洲地区呈现稳定成长。欧洲尤其註重强制车辆配备 ADAS 功能的严格法规，推动了对先进摄影机模组的需求。中东和非洲的安全问题日益严重，并且需要有效的监控系统。由于快速的城市化、可支配收入的增加以及推动汽车生产的强劲工业成长，亚太地区占据了全球最大的市场份额。

目录

第 1 章：全球相机模组市场执行摘要

  • 全球相机模组市场规模及预测（2022-2032）
  • 区域概要
  • 分部摘要
    • 按流程
    • 按组件
    • 透过介面
    • 按像素
    • 按申请
  • 主要趋势
  • 经济衰退的影响
  • 分析师推荐与结论

第 2 章：全球相机模组市场定义与研究假设

  • 研究目的
  • 市场定义
  • 研究假设
    • 包含与排除
    • 限制
    • 供给侧分析
      • 可用性
      • 基础设施
      • 监管环境
      • 市场竞争
      • 经济可行性（消费者的角度）
    • 需求面分析
      • 监理框架
      • 技术进步
      • 环境考虑
      • 消费者意识和接受度
  • 估算方法
  • 研究考虑的年份
  • 货币兑换率

第三章：全球相机模组市场动态

  • 市场驱动因素
    • 对高品质成像的需求不断增长
    • 智慧型手机技术的快速进步
    • ADAS 在汽车领域的采用率不断提高
  • 市场挑战
    • 生产成本高
    • 相机模组相关品质问题
  • 市场机会
    • 智慧城市介绍
    • 3D 深度感测技术的进步
    • 相机模组的小型化

第 4 章：全球相机模组市场产业分析

  • 波特的五力模型
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争竞争
    • 波特五力模型的未来方法
    • 波特的五力影响分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社会的
    • 技术性
    • 环境的
    • 合法的
  • 顶级投资机会
  • 最佳制胜策略
  • 颠覆性趋势
  • 产业专家视角
  • 分析师推荐与结论

第 5 章：2022-2032 年全球相机模组市场规模及流程预测

  • 细分仪表板
  • 全球相机模组市场：2022年及2032年製程收入趋势分析
    • 板载晶片 (COB) 摄影机模组
    • 倒装晶片相机模组

第 6 章：2022-2032 年全球相机模组市场规模及按组件预测

  • 细分仪表板
  • 全球相机模组市场：2022年及2032年组件收入趋势分析
    • 数位讯号处理
    • 影像感测器
      • CCD影像感测器
      • CMOS影像感测器
    • 红外线滤光片
    • 镜片
    • 软板或PCB

第 7 章：2022-2032 年全球相机模组市场规模及介面预测

  • 细分仪表板
  • 全球相机模组市场：2022年及2032年介面收入趋势分析
    • 相机并行介面
    • 相机串行接口

第 8 章：2022-2032 年全球相机模组市场规模及像素预测

  • 细分仪表板
  • 全球相机模组市场：2022年及2032年像素收入趋势分析
    • 8 至 13 议员
    • 13 MP 以上
    • 高达 7 MP

第 9 章：2022-2032 年全球相机模组市场规模及应用预测

  • 细分仪表板
  • 全球相机模组市场：2022年和2032年应用收入趋势分析
    • 汽车与运输
    • 消费性电子产品
    • 国防与航太
    • 工业与安全
    • 医疗的
    • 智慧型手机、平板电脑和 PC

第 10 章：2022-2032 年全球相机模组市场规模及地区预测

  • 北美相机模组市场
    • 美国相机模组市场
      • 2022-2032 年流程分解规模与预测
      • 2022-2032 年组件细分尺寸与预测
    • 加拿大相机模组市场
  • 欧洲相机模组市场
    • 英国相机模组市场
    • 德国相机模组市场
    • 法国相机模组市场
    • 西班牙相机模组市场
    • 义大利相机模组市场
    • 欧洲其他地区相机模组市场
  • 亚太相机模组市场
    • 中国相机模组市场
    • 印度相机模组市场
    • 日本相机模组市场
    • 澳洲相机模组市场
    • 韩国相机模组市场
    • 亚太地区其他相机模组市场
  • 拉丁美洲相机模组市场
    • 巴西相机模组市场
    • 墨西哥相机模组市场
    • 拉丁美洲其他地区相机模组市场
  • 中东和非洲相机模组市场
    • 沙乌地阿拉伯相机模组市场
    • 南非相机模组市场
    • 中东和非洲其他地区相机模组市场

第 11 章：竞争情报

  • 重点企业SWOT分析
    • 三星马达有限公司
    • 索尼集团公司
    • 豪威科技公司
  • 顶级市场策略
  • 公司简介
    • LG Electronics Inc.
    • Fujifilm Holdings Corporation
    • STMicroelectronics NV
    • Toshiba Corporation
    • Panasonic Corporation
    • Canon Inc.
    • Sharp Corporation
    • LITE-ON Technology Corp.
    • Chicony Electronics Co., Ltd.
    • Cowell e Holdings Inc.
    • JENOPTIK AG
    • KYOCERA Corporation

第 12 章：研究过程

  • 研究过程
    • 资料探勘
    • 分析
    • 市场预测
    • 验证
    • 出版
  • 研究属性
简介目录

Global Camera Module Market is valued approximately at USD 36.30 billion in 2023 and is anticipated to grow with a healthy growth rate of more than 7.55% over the forecast period 2024-2032. The global camera module market serves the escalating demand for superior imaging and sensing solutions across both consumer electronics and industrial applications. These modules, comprising image sensors, lens assemblies, voice coil motors, infrared cut filters, and printed circuit boards, are essential in capturing high-resolution images and videos. The rapid technological advancements in smartphones and the growing security concerns drive the necessity for advanced surveillance systems and higher-quality cameras. Additionally, the increasing integration of advanced driver-assistance systems (ADAS) in the automotive industry further boosts the demand for efficient camera modules, thus propelling market growth. However, high production costs and quality issues related to camera modules pose significant challenges to market growth. On the flip side, the advent of smart cities necessitating video surveillance, advancements in 3D depth-sensing technologies, and the miniaturization of camera modules for wearables and IoT applications are expected to create lucrative opportunities in the market.

The proliferation of chip-on-board (COB) and flip-chip technologies offers distinct advantages for specific applications within the camera module industry. Chip-on-board (COB) modules provide compact and lightweight solutions ideal for portable devices constrained by space, ensuring high-speed data transfer, superior thermal performance, and enhanced image quality due to reduced signal interference. Conversely, flip-chip camera modules utilize an advanced packaging technique known as flip-chip bonding, which connects the image sensor die directly to the printed circuit board (PCB) without wire bonds, resulting in slimmer profiles and faster data transmission. The choice between COB and flip-chip camera modules depends on device size constraints, desired image quality, data transfer speeds, power consumption requirements, and cost considerations.

High-quality image and video production within the camera module market is contingent upon several key components, including digital signal processing (DSP), image sensors, infrared filters, lenses, soft boards or printed circuit boards (PCB). Digital signal processing (DSP) refines raw image data to ensure clear images with accurate color reproduction, supporting essential features such as noise reduction and lens distortion correction. Image sensors convert light into electronic signals, playing a critical role in determining the image quality produced by a camera module. Infrared filters eliminate unwanted infrared light that can cause color distortion in outdoor applications. Aspheric lenses, known for reducing spherical aberrations while maintaining a compact design, are gaining popularity. High-density interconnect (HDI) boards are increasingly demanded within the soft board or PCB industry to support miniaturization trends in the camera module market.

The camera parallel interface (CPI) and camera serial interface (CSI) represent two distinct methods for connecting camera modules to host devices. The camera parallel interface (CPI), a traditional approach, employs multiple data lines for high-speed parallel communication, making it suitable for high-bandwidth and low-latency applications, such as industrial vision systems and high-speed video processing. Camera serial interface (CSI) transmits image data serially over fewer signal lines using a differential signaling scheme, resulting in reduced electromagnetic interference (EMI), improved noise immunity, and longer cable lengths. CSI is particularly beneficial for applications like smartphones, tablets, drones, and IoT devices, where smaller form factors and reduced power consumption are crucial.

Camera modules are indispensable across various sectors, including automotive, consumer electronics, defense, industrial, medical, and personal computing devices. In the automotive industry, advanced driver assistance systems (ADAS), rearview cameras, and autonomous vehicles rely on camera modules for functions such as lane departure warnings and parking assistance. The consumer electronics market demands high-quality camera modules for digital cameras, action cameras, drones, and VR headsets. Defense and space applications utilize camera modules for surveillance systems, reconnaissance drones/UAVs (Unmanned Aerial Vehicles), and satellite imaging systems. The industrial sector employs camera modules in machine vision systems and automation robotics. Medical applications require specialized camera modules for endoscopy, microscopy, and ophthalmology devices, among other diagnostic equipment. Camera modules are also vital components in smartphones, tablets, and PCs for capturing photographs and facilitating video calls.

In the Americas, the demand for camera modules is driven by key industries such as smartphones, automotive applications integrating ADAS, security and surveillance systems, and consumer electronics. In the United States and Canada, consumers prioritize high-quality image capture and video recording capabilities. The EMEA region shows steady growth due to rising smartphone adoption rates and an expanding automotive sector. Europe, in particular, focuses on stringent regulations mandating ADAS features in vehicles, driving demand for advanced camera modules. The Middle East and Africa have seen increased security concerns and the need for effective surveillance systems. The APAC region holds the largest market share globally due to rapid urbanization, increasing disposable incomes, and strong industrial growth propelling automotive production.

Major market players included in this report are:

  • Samsung Electro-Mechanics Co., Ltd.
  • Sony Group Corporation
  • OmniVision Technologies, Inc.
  • LG Electronics Inc.
  • Fujifilm Holdings Corporation
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Panasonic Corporation
  • Canon Inc.
  • Sharp Corporation
  • LITE-ON Technology Corp.
  • Chicony Electronics Co., Ltd.
  • Cowell e Holdings Inc.
  • JENOPTIK AG
  • KYOCERA Corporation

The detailed segments and sub-segment of the market are explained below:

By Process:

  • Chip-On-Board (COB) Camera Module
  • Flip-Chip Camera Module

By Component:

  • Digital Signal Processing
  • Image Sensor
    • CCD Image Sensors
    • CMOS Image Sensors
  • Infrared Filter
  • Lens
  • Soft Board or PCB

By Interface:

  • Camera Parallel Interface
  • Camera Serial Interface

By Pixel:

  • 8 to 13 MP
  • Above 13 MP
  • Up to 7 MP

By Application:

  • Automotive & Transportation
  • Consumer Electronics
  • Defence & Space
  • Industrial & Security
  • Medical
  • Smartphone, Tablet, and PC

By Region:

  • North America
    • U.S.
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Spain
    • Italy
    • ROE
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
    • RoAPAC
  • Latin America
    • Brazil
    • Mexico
  • Middle East & Africa
    • Saudi Arabia
    • South Africa
    • RoMEA

Years considered for the study are as follows:

  • Historical year - 2022
  • Base year - 2023
  • Forecast period - 2024 to 2032

Key Takeaways:

  • Market Estimates & Forecast for 10 years from 2022 to 2032.
  • Annualized revenues and regional level analysis for each market segment.
  • Detailed analysis of geographical landscape with Country level analysis of major regions.
  • Competitive landscape with information on major players in the market.
  • Analysis of key business strategies and recommendations on future market approach.
  • Analysis of competitive structure of the market.
  • Demand side and supply side analysis of the market.

Table of Contents

Chapter 1. Global Camera Module Market Executive Summary

  • 1.1. Global Camera Module Market Size & Forecast (2022-2032)
  • 1.2. Regional Summary
  • 1.3. Segmental Summary
    • 1.3.1. By Process
    • 1.3.2. By Component
    • 1.3.3. By Interface
    • 1.3.4. By Pixel
    • 1.3.5. By Application
  • 1.4. Key Trends
  • 1.5. Recession Impact
  • 1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Camera Module Market Definition and Research Assumptions

  • 2.1. Research Objective
  • 2.2. Market Definition
  • 2.3. Research Assumptions
    • 2.3.1. Inclusion & Exclusion
    • 2.3.2. Limitations
    • 2.3.3. Supply Side Analysis
      • 2.3.3.1. Availability
      • 2.3.3.2. Infrastructure
      • 2.3.3.3. Regulatory Environment
      • 2.3.3.4. Market Competition
      • 2.3.3.5. Economic Viability (Consumer's Perspective)
    • 2.3.4. Demand Side Analysis
      • 2.3.4.1. Regulatory frameworks
      • 2.3.4.2. Technological Advancements
      • 2.3.4.3. Environmental Considerations
      • 2.3.4.4. Consumer Awareness & Acceptance
  • 2.4. Estimation Methodology
  • 2.5. Years Considered for the Study
  • 2.6. Currency Conversion Rates

Chapter 3. Global Camera Module Market Dynamics

  • 3.1. Market Drivers
    • 3.1.1. Growing Demand for High-Quality Imaging
    • 3.1.2. Rapid Smartphone Technology Advancements
    • 3.1.3. Increasing Adoption of ADAS in Automotive
  • 3.2. Market Challenges
    • 3.2.1. High Production Costs
    • 3.2.2. Quality Issues Related to Camera Modules
  • 3.3. Market Opportunities
    • 3.3.1. Introduction of Smart Cities
    • 3.3.2. Advancement in 3D Depth-Sensing Technologies
    • 3.3.3. Miniaturization of Camera Modules

Chapter 4. Global Camera Module Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
    • 4.1.6. Futuristic Approach to Porter's 5 Force Model
    • 4.1.7. Porter's 5 Force Impact Analysis
  • 4.2. PESTEL Analysis
    • 4.2.1. Political
    • 4.2.2. Economical
    • 4.2.3. Social
    • 4.2.4. Technological
    • 4.2.5. Environmental
    • 4.2.6. Legal
  • 4.3. Top investment opportunity
  • 4.4. Top winning strategies
  • 4.5. Disruptive Trends
  • 4.6. Industry Expert Perspective
  • 4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Camera Module Market Size & Forecasts by Process 2022-2032

  • 5.1. Segment Dashboard
  • 5.2. Global Camera Module Market: Process Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 5.2.1. Chip-On-Board (COB) Camera Module
    • 5.2.2. Flip-Chip Camera Module

Chapter 6. Global Camera Module Market Size & Forecasts by Component 2022-2032

  • 6.1. Segment Dashboard
  • 6.2. Global Camera Module Market: Component Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 6.2.1. Digital Signal Processing
    • 6.2.2. Image Sensor
      • 6.2.2.1. CCD Image Sensors
      • 6.2.2.2. CMOS Image Sensors
    • 6.2.3. Infrared Filter
    • 6.2.4. Lens
    • 6.2.5. Soft Board or PCB

Chapter 7. Global Camera Module Market Size & Forecasts by Interface 2022-2032

  • 7.1. Segment Dashboard
  • 7.2. Global Camera Module Market: Interface Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 7.2.1. Camera Parallel Interface
    • 7.2.2. Camera Serial Interface

Chapter 8. Global Camera Module Market Size & Forecasts by Pixel 2022-2032

  • 8.1. Segment Dashboard
  • 8.2. Global Camera Module Market: Pixel Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 8.2.1. 8 to 13 MP
    • 8.2.2. Above 13 MP
    • 8.2.3. Up to 7 MP

Chapter 9. Global Camera Module Market Size & Forecasts by Application 2022-2032

  • 9.1. Segment Dashboard
  • 9.2. Global Camera Module Market: Application Revenue Trend Analysis, 2022 & 2032 (USD Billion)
    • 9.2.1. Automotive & Transportation
    • 9.2.2. Consumer Electronics
    • 9.2.3. Defence & Space
    • 9.2.4. Industrial & Security
    • 9.2.5. Medical
    • 9.2.6. Smartphone, Tablet, and PC

Chapter 10. Global Camera Module Market Size & Forecasts by Region 2022-2032

  • 10.1. North America Camera Module Market
    • 10.1.1. U.S. Camera Module Market
      • 10.1.1.1. Process breakdown size & forecasts, 2022-2032
      • 10.1.1.2. Component breakdown size & forecasts, 2022-2032
    • 10.1.2. Canada Camera Module Market
  • 10.2. Europe Camera Module Market
    • 10.2.1. UK Camera Module Market
    • 10.2.2. Germany Camera Module Market
    • 10.2.3. France Camera Module Market
    • 10.2.4. Spain Camera Module Market
    • 10.2.5. Italy Camera Module Market
    • 10.2.6. Rest of Europe Camera Module Market
  • 10.3. Asia-Pacific Camera Module Market
    • 10.3.1. China Camera Module Market
    • 10.3.2. India Camera Module Market
    • 10.3.3. Japan Camera Module Market
    • 10.3.4. Australia Camera Module Market
    • 10.3.5. South Korea Camera Module Market
    • 10.3.6. Rest of Asia Pacific Camera Module Market
  • 10.4. Latin America Camera Module Market
    • 10.4.1. Brazil Camera Module Market
    • 10.4.2. Mexico Camera Module Market
    • 10.4.3. Rest of Latin America Camera Module Market
  • 10.5. Middle East & Africa Camera Module Market
    • 10.5.1. Saudi Arabia Camera Module Market
    • 10.5.2. South Africa Camera Module Market
    • 10.5.3. Rest of Middle East & Africa Camera Module Market

Chapter 11. Competitive Intelligence

  • 11.1. Key Company SWOT Analysis
    • 11.1.1. Samsung Electro-Mechanics Co., Ltd.
    • 11.1.2. Sony Group Corporation
    • 11.1.3. OmniVision Technologies, Inc.
  • 11.2. Top Market Strategies
  • 11.3. Company Profiles
    • 11.3.1. LG Electronics Inc.
    • 11.3.2. Fujifilm Holdings Corporation
    • 11.3.3. STMicroelectronics N.V.
    • 11.3.4. Toshiba Corporation
    • 11.3.5. Panasonic Corporation
    • 11.3.6. Canon Inc.
    • 11.3.7. Sharp Corporation
    • 11.3.8. LITE-ON Technology Corp.
    • 11.3.9. Chicony Electronics Co., Ltd.
    • 11.3.10. Cowell e Holdings Inc.
    • 11.3.11. JENOPTIK AG
    • 11.3.12. KYOCERA Corporation

Chapter 12. Research Process

  • 12.1. Research Process
    • 12.1.1. Data Mining
    • 12.1.2. Analysis
    • 12.1.3. Market Estimation
    • 12.1.4. Validation
    • 12.1.5. Publishing
  • 12.2. Research Attributes