嵌入式温度传感器市场:按类型(非接触式、接触式)、最终用途行业、地区 - 规模、份额、展望、机会分析,2022-2030 年
市场调查报告书
商品编码
1213903

嵌入式温度传感器市场:按类型(非接触式、接触式)、最终用途行业、地区 - 规模、份额、展望、机会分析,2022-2030 年

Embedded Temperature Sensor Market, By Type (Non-contact and Contact ), End-use Industry, and By Region - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030

出版日期: | 出版商: Coherent Market Insights | 英文 150 Pages | 商品交期: 2-3个工作天内

价格
简介目录

温度传感器用于检测热量或温度。 这些传感器检测物理温度并以模拟和数字格式提供结果。 这些传感器用于汽车、医疗保健、金属製造、航空航天和国防等各个行业。 工业化和先进技术正在推动嵌入式温度传感器市场的增长。 自动驾驶汽车和机器人技术等新兴技术将为嵌入式温度传感器市场提供有利可图的机会。

此外,需要确认发烧以检测冠状病毒大流行的症状。 公司正专注于推出便携式温度传感器设备。 HUAWEI于2020年6月发布的新智能手机 "Honor Play 4 Pro" 内置了温度传感器。 红外传感器支持 -20°C 至 100°C。

按价值计算,到 2030 年底,嵌入式温度传感器市场估计将达到 134.011 亿美元。

市场动态

由于医疗保健行业越来越多地采用温度传感器,预计嵌入式温度传感器的全球市场在预测期内将显着增长。 温度传感器以更低的功率运行,并提供更准确的结果。 政府强制要求使用温度传感器来检测医疗行业中与热相关的问题。 世界各地的各种物联网项目都在使用温度传感器来收集高效准确的数据,并提供更好的患者护理。 例如,根据 Coherent Market Insights 的分析,由于疾病的增加,2017 年医疗器械市场预计将达到 3980 亿美元。

例如,根据美国心臟协会 (AHA) 的数据,心臟病每年导致约 1730 万人死亡,预计到 2030 年将增加到 2360 万人。 创新的温度传感器用于降低热死亡率。 此外,预计在化学工业中越来越多地采用温度传感器也将在预测期内推动市场增长。 温度传感器用于控制和监测各种过程中的温度,例如精炼、裂解和焚烧。

此外,不同地区的许多全球公司都致力于开发具有先进功能和技术的新产品,以提高其在市场上的竞争力。 业界正在开发具有新功能的高科技嵌入式温度传感器,以满足最终用户的需求。 例如,2017 年,TE Con​​nectivity 推出了一款重量轻、体积小、效率高、成本低的 NTC 热敏电阻。 新推出的产品可应用于汽车行业,以监测电池温度并防止电动汽车过热。

这项研究的主要特点

  • 本报告以 2021 年为基准年,深入分析了预测期内(2022 年至 2030 年)的全球嵌入式温度传感器市场规模和復合年增长率 (CAGR%)。
  • 它揭示了不同细分市场的潜在收入机会,并为该市场概述了一个有吸引力的投资建议矩阵。
  • 它还提供了有关市场驱动因素、制约因素、机会、新产品发布和批准、区域前景以及主要市场参与者采用的竞争策略的重要见解。
  • 根据公司概况、业绩、产品组合、地域分布、市场资本、关键发展、战略和未来计划等参数,全球嵌入式温度传感器市场主要参与者的概况。
  • 本研究涵盖的公司包括Honeywell International Inc., NXP Semiconductors, Panasonic Corporation, Delphi Technologies, Siemens, ABB, STMicroelectronics, Emerson Electric Co., Microchip Technology Inc., Fluke Process Instruments, Mouser Electronics, Inc., Robert Bosch GmbH, TE Connectivity, DENSO CORPORATION, OMRON Corporation, FLIR Systems, Inc., Amphenol Advanced Sensors, Maxim Integrated, KONGSBERG, Yokogawa India Ltd., Infineon Technologies AG, TDK-Micronas GmbH, Amphenol Corporation, OMEGA Engineering inc., ON Semiconductor, CODICO GmbH, Sensata Technologies, Inc., VINCI, and Digi-Key Electronics
  • 这份报告中的见解应该能让企业营销人员和管理人员就未来的产品发布、产品升级、市场扩张和营销策略做出明智的决策。看起来。
  • 本研究报告面向该行业的各种利益相关者,包括投资者、供应商、託管服务提供商、第三方服务提供商、分销商、新进入者和增值经销商。
  • 利益相关者可以通过用于分析全球嵌入式温度传感器市场的各种战略矩阵来促进他们的决策。

内容

第 1 章目的和先决条件

  • 调查目的
  • 先决条件
  • 缩写说明

第二章市场展望

  • 报告内容
    • 市场定义和范围
  • 执行摘要
    • 市场细分:按类型
    • 按最终用途行业细分的市场
    • 按地区划分的市场细分
  • 连贯机会图 (COM)

第3章市场动态、规律及趋势分析

  • 市场动态
    • 司机
    • 约束因素
    • 市场机会
  • 监管场景
  • 行业趋势
  • 併购
  • 新系统启动/批准
  • 大流行对 COVID-19 的影响

第 4 章嵌入式温度传感器的全球市场,按类型,2017-2030

  • 非接触式
  • 红外线
  • 光纤类型
  • 联繫人类型
  • 双金属
  • 温度传感器 IC
  • 热敏电阻
  • 电阻式温度传感器
  • 热电偶

第 5 章按最终用途行业划分的嵌入式温度传感器全球市场,2017-2030

  • 化学品
  • 石油和天然气
  • 能源/电力
  • 医疗保健
  • 食物和饮料
  • 消费类电子产品
  • 航空航天与国防
  • 金属与矿业

第 6 章按地区分列的嵌入式温度传感器全球市场,2017-2030

  • 北美
  • 美国
  • 加拿大
  • 欧洲
  • 英国
  • 德国
  • 法国
  • 意大利
  • 俄罗斯
  • 其他欧洲地区
  • 亚太地区
  • 中国
  • 印度
  • 日本
  • 东盟
  • 澳大利亚
  • 韩国
  • 其他亚太地区
  • 拉丁美洲
  • 巴西
  • 阿根廷
  • 墨西哥
  • 其他拉丁美洲地区
  • 中东和非洲
  • 南非
  • 海湾合作委员会国家
  • 其他中东和非洲地区

第七章竞争格局

  • 公司简介
    • Honeywell International Inc.
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering Inc.
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics

第 8 章

  • 参考文献
  • 调查方法
简介目录
Product Code: CMI4015

Temperature sensors are used to detect heat or temperature. These sensors detect physical temperature and provide results in analog and digital form. These sensors are used in various industries such as automotive, healthcare, metal manufacturing, aerospace and defense, and others. Industrialization and advanced technologies are driving growth of the embedded temperature sensor market. Advanced technologies such as autonomous vehicles and robotics will provide lucrative opportunities for embedded temperature sensor market.

Further, to detect symptoms of coronavirus pandemic, checking fever is necessary. Companies are focusing on launching portable temperature sensing devices. Huawei's new smartphone, Honor Play 4 Pro, launched in June 2020, has a temperature sensor built-in. The infrared sensor supports temperatures from -20°C to 100°C.

The Embedded Temperature Sensor Market is estimated to account for US$ 13,401.1 Mn in terms of value by the end of 2030.

Market Dynamics

The global embedded temperature sensor market is expected to grow significantly during the forecast period, owing to increasing adoption of temperature sensors in the healthcare industry. Temperature sensor needs less power for functioning and provide results with high accuracy. Government are mandating people to use temperature sensors to detect heat-related issues in the medical industry. Various IoT projects across the globe are using temperature sensors for collecting efficient and accurate data, and also, to provide better care to the patients. For instance, according to Coherent Market Insights' analysis, the medical device market is expected to reach an estimated US$ 398,000 million in 2017 due to the increasing number of diseases.

For instance, according to the American Heart Association (AHA), heart diseases kill around 17.3 million people annually, which is expected to rise to 23.6 million by 2030. Innovative temperature sensors are used to mitigate heat-related mortality rates. Moreover, increasing adoption of temperature sensors in chemical industries is expected to propel the market growth over the forecast period. Temperature sensors are used in various processes such as refining, cracking, and incineration to control and monitor the temperature.

Furthermore, many global players across different regions are focusing on developing new products with advanced features and technologies to gain competitive edge in the market. Industries are developing high tech embedded temperature sensors with new features to cater to the demand from the end users. For instance, in 2017, TE Connectivity launched lightweight and small in size NTC Thermistor with high efficiency and less cost. The newly launched product finds its application in the automotive industry to monitor the temperature of batteries in electric cars and prevent overheating.

Key features of the study:

  • This report provides in-depth analysis of global embedded temperature sensor market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2022- 2030), considering 2021 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, regional outlook, and competitive strategies adopted by the leading market players
  • It profiles leading players in the global embedded temperature sensor market based on the following parameters - company overview, financial performance, product portfolio, geographical presence, market capital, key developments, strategies, and future plans
  • Companies covered as a part of this study include Honeywell International Inc., NXP Semiconductors, Panasonic Corporation, Delphi Technologies, Siemens, ABB, STMicroelectronics, Emerson Electric Co., Microchip Technology Inc., Fluke Process Instruments, Mouser Electronics, Inc., Robert Bosch GmbH, TE Connectivity, DENSO CORPORATION, OMRON Corporation, FLIR Systems, Inc., Amphenol Advanced Sensors, Maxim Integrated, KONGSBERG, Yokogawa India Ltd., Infineon Technologies AG, TDK-Micronas GmbH, Amphenol Corporation, OMEGA Engineering inc., ON Semiconductor, CODICO GmbH, Sensata Technologies, Inc., VINCI, and Digi-Key Electronics
  • Insights from this report would allow marketers and management authorities of companies to make informed decisions regarding future product launches, product upgrades, market expansion, and marketing tactics
  • The global embedded temperature sensor market report caters to various stakeholders in this industry including investors, suppliers, managed service providers, third-party service providers, distributors, new entrants, and value-added resellers
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global embedded temperature sensor market

Detailed Segmentation

  • Global Embedded Temperature Sensor Market, By Type:
    • Non-contact
      • Infrared
      • Fiber Optic
    • Contact
      • Bimetallic
      • Temperature Sensor IC
      • Thermistor
      • Resistive Temperature Detector
      • Thermocouple
  • Global Embedded Temperature Sensor Market, End-use Industry:
    • Chemicals
    • Oil & Gas
    • Energy & Power
    • Healthcare
    • Food & Beverages
    • Consumer Electronics
    • Aerospace & Defense
    • Metals & Mining
  • Global Embedded Temperature Sensor Market, By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa
  • Company Profiles
    • Honeywell International Inc.*
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering inc
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics

"*" marked represents similar segmentation in other categories in the respective section.

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By Type
    • Market Snippet, By End-use Industry
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New system Launch/Approvals
  • Impact of COVID-19 Pandemic

4. Global Embedded Temperature Sensor Market, By Type, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, 2022 and 2030 (%)
    • Segment Trends
  • Non-contact
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Infrared
  • Fiber Optic
  • Contact
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Bimetallic
  • Temperature Sensor IC
  • Thermistor
  • Resistive Temperature Detector
  • Thermocouple

5. Global Embedded Temperature Sensor Market, By End-use Industry, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, 2022 and 2030 (%)
    • Segment Trends
  • Chemicals
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Oil & Gas
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Energy & Power
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Healthcare
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Food & Beverages
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Consumer Electronics
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Aerospace & Defense
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)
  • Metals & Mining
    • Introduction
    • Market Size and Forecast, 2017-2030, (US$ Million)

6. Global Embedded Temperature Sensor Market, By Region, 2017-2030 (US$ Million)

  • Introduction
    • Market Share Analysis, By Region, 2022 and 2030 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • U.S.
  • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • U.K.
  • Germany
  • France
  • Italy
  • Russia
  • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • China
  • India
  • Japan
  • ASEAN
  • Australia
  • South Korea
  • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • Brazil
  • Argentina
  • Mexico
  • Rest of Latin America
  • Middle East and Africa
    • Market Size and Forecast, By Type, 2017-2030 (US$ Million)
    • Market Size and Forecast, By End-use Industry, 2017-2030 (US$ Million)
    • Market Share Analysis, By Country, 2022 and 2030 (%)
  • South Africa
  • GCC Countries
  • Rest of the Middle East and Africa

7. Competitive Landscape

  • Company Profiles
    • Honeywell International Inc.*
  • Company Overview
  • Product Portfolio
  • Financial Performance
  • Key Strategies
  • Recent Developments/Updates
    • NXP Semiconductors
    • Panasonic Corporation
    • Delphi Technologies
    • Siemens
    • ABB
    • STMicroelectronics
    • Emerson Electric Co.
    • Microchip Technology Inc.
    • Fluke Process Instruments
    • Mouser Electronics, Inc.
    • Robert Bosch GmbH
    • TE Connectivity
    • DENSO CORPORATION
    • OMRON Corporation
    • FLIR Systems, Inc.
    • Amphenol Advanced Sensors
    • Maxim Integrated
    • KONGSBERG
    • Yokogawa India Ltd.
    • Infineon Technologies AG
    • TDK-Micronas GmbH
    • Amphenol Corporation
    • OMEGA Engineering Inc.
    • ON Semiconductor
    • CODICO GmbH
    • Sensata Technologies, Inc.
    • VINCI
    • Digi-Key Electronics
  • Analyst Views

8. Section

  • References
  • Research Methodology
  • About us and Sales Contact