家用电子电器包装市场：依材料类型、依产品类型、按地区

家用电子电器封装市场预计2024年为226.3亿美元，预计2031年将达到687.1亿美元， 年复合成长率（CAGR）预计将增长17.2%。

家用电子电器封装市场占有率(%)，依地区划分，2024 年

家用电子电器包装市场是指用于智慧型手机、笔记型电脑、穿戴式装置和家用电器等家用电子电器运输和分销的包装解决方案。有效的包装在保护电子设备在运输过程中免受损​​坏、同时改善整体产品体验方面发挥着重要作用。製造商依赖耐用、可持续、永续的自订型态，使用纸板、塑胶和瓦楞纸箱等材料。对优质电子产品的需求不断增长、智慧包装和互动包装等创新包装型态的引入、电子商务销售的成长以及对永续性的关注正在推动家用电子电器包装市场的成长。

市场动态：

全球家用电子电器包装市场受到对优质智慧型手机、穿戴式装置和其他智慧型装置不断增长的需求的推动。科技的快速进步、5G网路的引入以及消费者频繁升级设备的趋势正在促进电子设备的销售。此外，电子零售业线上线下的扩张也推动了市场的成长。然而，供应链中断导致的原物料价格波动已成为一个主要问题。此外，有关非生物分解塑胶的严格环境法规在一定程度上限制了市场成长。同时，对永续和智慧包装的关注正在创造利润丰厚的机会。製造商正在投资可回收和环保的材料，同时实施二维码等智慧互动功能，以实现无缝的购物体验。注重运输安全的电子设备海外出货量的增加预计将在未来几年进一步刺激市场需求。

本研究的主要特点

本报告对全球家用电子电器封装市场进行了详细分析，并提供了以2023年为基准年的预测期（2024-2031年）的市场规模和年复合成长率（CAGR%）。

它还强调了各个细分市场的潜在收益成长机会，并说明了该市场有吸引力的投资提案矩阵。

它还提供了有关市场驱动因素、限制因素、机会、新产品发布和核准、市场趋势、区域前景、主要企业采取的竞争策略等的重要见解。

它根据公司亮点、产品系列、主要亮点、财务表现和策略等参数，介绍了全球家用电子电器封装市场的主要企业。

本研究报告中介绍的一些主要企业包括杭州迅达包装有限公司、Smurfit Kappa Group PLC、DS Smith Plc、Pregis Corporation、Dunapack Packaging Group、Sonoco Products Company、Stora Enso Oyi、WestRock Company、Mondi Group、JJX Packaging LLC 、Huhtamaki Oyj、Dordan Manufacturing Company、深圳Hoicow Packing Manufacturing Ltd.、UFP Technologies, Inc.、International Paper Company 和Sealed Air Corporation。

该报告的见解将帮助负责人和公司经营团队就未来的产品发布、类型升级、市场扩张和行销策略做出明智的决策。

本研究报告针对该产业的各个相关人员，如投资者、供应商、产品製造商、经销商、新进业者和财务分析师。

相关人员可以透过用于分析全球家用电子电器封装市场的各种策略矩阵来促进他们的决策。

第一章 研究目的与前提

• 研究目标
• 先决条件

第二章 市场概况

• 报告说明
  • 市场定义和范围
• 执行摘要
• 市场机会蓝图

第三章市场动态与趋势分析

• 市场动态
  • 促进因素
  • 抑制因素
  • 机会
• 影响分析
• PEST分析
• 波特分析
• COVID-19 影响分析
• 新产品核准
• 促销和行销工作
• 不同国家的市场吸引力
• 按细分市场分類的市场吸引力
• 主要进展及交易
• 趋势分析—过去与未来的趋势评估
• 主要进展

第四章全球家用电子电器封装市场，材料类型，2019-2031

• 2024 年及 2031 年市场占有率(%) 分析
• 市场与前一年同期比较增速对比（%）
• 细分市场趋势
• 塑胶
  • 市场规模及预测
• 金属
  • 市场规模及预测
• 纸和纸板
  • 市场规模及预测
• 发泡聚苯乙烯包装
  • 市场规模及预测

第五章全球家用电子电器封装市场，产品类型，2019-2031

• 2024 年及 2031 年市场占有率(%) 分析
• 市场与前一年同期比较增速对比（%）
• 细分市场趋势
• 瓦楞纸箱
  • 市场规模及预测
• 瓦楞纸箱
  • 市场规模及预测
• 热成型托盘
  • 市场规模及预测
• 泡壳包装与翻盖
  • 市场规模及预测
• 其他的
  • 市场规模及预测

第六章2019-2031年全球家用电子电器封装市场（按地区）

• 北美洲
• 美国
• 加拿大
• 欧洲
• 英国
• 德国
• 义大利
• 法国
• 西班牙
• 俄罗斯
• 欧洲其他地区
• 亚太地区
• 中国
• 印度
• 日本
• 澳洲
• 韩国
• ASEAN
• 其他亚太地区
• 中东/非洲
• 波湾合作理事会
• 南非
• 以色列
• 其他中东地区
• 拉丁美洲
• 巴西
• 墨西哥
• 阿根廷
• 其他拉丁美洲

第七章 竞争格局

• Competitive Snapshot
• What Market Participants are Saying?
• Competitive Dashboard
• Company Market Share Analysis, 2024-Global

第八章公司简介-全球消费性电子封装市场

• Hangzhou Xunda Packaging Co.
  • 公司简介
  • 产品/服务组合
  • 财务绩效
  • 最新动态/更新
  • 策略概览
• Smurfit Kappa Group PLC
• DS Smith Plc
• Pregis Corporation
• Dunapack Packaging Group
• Sonoco Products Company
• Stora Enso Oyi
• WestRock Company
• Mondi Group
• JJX Packaging LLC
• Huhtamaki Oyj
• Dordan Manufacturing Company
• Shenzhen Hoichow Packing Manufacturing Ltd.
• UFP Technologies, Inc.
• International Paper Company
• Sealed Air Corporation

第9章 命运之轮

• 命运之轮
• 分析师观点
• 一致的机会图

第10章 参考文献与调查方法

• 参考
• 调查方法

The consumer electronics packaging market is estimated to be valued at USD 22.63 Bn in 2024 and is expected to reach USD 68.71 Bn by 2031, growing at a compound annual growth rate (CAGR) of 17.2% from 2024 to 2031.

Consumer Electronics Packaging Market Share (%), By Region, 2024

The consumer electronics packaging market refers to the packaging solutions used for shipping and distributing consumer electronic products such as smartphones, laptops, wearables, and home appliances. Effective packaging plays a crucial role in protecting electronics from damage during transportation while also enhancing the overall product experience. Manufacturers rely on sturdy, sustainable, and custom-fit packaging formats made using materials such as paperboards, plastics, and corrugated boxes. The rising demand for premium electronics, implementation of innovative packaging formats like smart and interactive packaging, growing e-commerce sales, and focus on sustainability are some key factors fueling growth in the consumer electronics packaging Market.

Market Dynamics:

The global consumer electronics packaging market is driven by the growing demand for premium smartphones, wearables, and other smart devices. Rapid technological advancements, introduction of 5G networks, and consumers' tendency to frequently upgrade devices contribute to the sale of electronic devices. Furthermore, the expanding electronics retail industry, both online and offline, bolsters the market growth. However, volatility in raw material prices due to supply chain disruptions poses a major challenge. Also, stringent environmental regulations regarding non-biodegradable plastics curb the market progression to some extent. Meanwhile, focus towards sustainable and smart packaging creates lucrative opportunities. Manufacturers invest in recyclable and eco-friendly materials while implementing smart interactive features like QR codes for seamless shopping experience. Rising overseas shipments of electronics with emphasis on security and safety during transportation will further stimulate the market demand over the coming years.

Key Features of the Study:

This report provides an in-depth analysis of the global consumer electronics packaging market, and provides market size (US$ Billion) and compound annual growth rate (CAGR %) for the forecast period (2024-2031), considering 2023 as the base year

It elucidates potential revenue growth opportunities across different segments and explains attractive investment proposition matrices for this market

This study also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, market trends, regional outlook, and competitive strategies adopted by key players

It profiles key players in the global consumer electronics packaging market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies

Key companies covered as a part of this study include Hangzhou Xunda Packaging Co., Smurfit Kappa Group PLC, DS Smith Plc, Pregis Corporation, Dunapack Packaging Group, Sonoco Products Company, Stora Enso Oyi, WestRock Company, Mondi Group, JJX Packaging LLC, Huhtamaki Oyj, Dordan Manufacturing Company, Shenzhen Hoichow Packing Manufacturing Ltd., UFP Technologies, Inc., International Paper Company, and Sealed Air Corporation are the major players operating in the market.

Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics

The global consumer electronics packaging market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global consumer electronics packaging market

Market Segmentation:

• By Material Type
  • Plastic
  • Metal
  • Paper and Paperboard
  • Foam Packaging
• By Vehicle Type
  • Corrugated Boxes
  • Paperboard Boxes
  • Thermoformed Trays
  • Blister Packs and Clamshells
  • Others
• By Regional
  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East
• Key Players Insights
  • Hangzhou Xunda Packaging Co.
  • Smurfit Kappa Group PLC
  • DS Smith Plc
  • Pregis Corporation
  • Dunapack Packaging Group
  • Sonoco Products Company
  • Stora Enso Oyi
  • WestRock Company
  • Mondi Group
  • JJX Packaging LLC
  • Huhtamaki Oyj
  • Dordan Manufacturing Company
  • Shenzhen Hoichow Packing Manufacturing Ltd.
  • UFP Technologies, Inc.
  • International Paper Company
  • Sealed Air Corporation

Table of Content

1. Research Objectives and Assumptions

• Research Objectives
• Assumptions

2. Market Overview

• Report Description
  • Market Definition and Scope
• Executive Summary
  • Market Snapshot, By Material Type
  • Market Snapshot, By Product Type
  • Market Snapshot, By Region
  • Market Scenario - Conservative, Likely, Opportunistic
• Market Opportunity Map

3. Market Dynamics and Trend Analysis

• Market Dynamics
  • Drivers
  • Restraints
  • Opportunities
• Impact Analysis
• Pest Analysis
• Porters Analysis
• COVID-19 Impact Analysis
• New Product Approvals
• Promotion and Marketing Initiatives
• Market Attractiveness, By Country
• Market Attractiveness, By Market Segment
• Key Developments & Deals
• Trend Analysis - Historic and Future Trend Assessment
• Key Developments

4. Global Consumer Electronics Packaging Market, Material Type, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031
  • Market Y-o-Y Growth Comparison (%), 2020 - 2031
  • Segment Trends
• Plastic, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Metal, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Paper and Paperboard, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Foam Packaging, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)

5. Global Consumer Electronics Packaging Market, Product Type, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031
  • Market Y-o-Y Growth Comparison (%), 2020 - 2031
  • Segment Trends
• Corrugated Boxes, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Paperboard Boxes, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Thermoformed Trays, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Blister Packs and Clamshells, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)
• Others, 2019 - 2031(US$ Billion)
  • Introduction
  • Market Size and Forecast, 2019 - 2031, (US$ Billion)

6. Global Consumer Electronics Packaging Market, By Region, 2019 - 2031 (US$ Billion)

• Introduction
  • Market Share (%) Analysis, 2024 and 2031, (US$ Billion)
  • Market Y-o-Y Growth Comparison (%), 2024 - 2031, (US$ Billion)
  • Regional Trends
• North America
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• U.S.
• Canada
• Europe
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• U.K.
• Germany
• Italy
• France
• Spain
• Russia
• Rest Of Europe
• Asia Pacific
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• China
• India
• Japan
• Australia
• South Korea
• Asean
• Rest Of Asia Pacific
• Middle East & Africa
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country/Sub-region, 2019 - 2031, (US$ Billion)
• GCC
• South Africa
• Israel
• Rest Of Middle East
• Latin America
  • Introduction
  • Market Size and Forecast, Material Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, Product Type, 2019 - 2031, (US$ Billion)
  • Market Size and Forecast, By Country, 2019 - 2031, (US$ Billion)
• Brazil
• Mexico
• Argentina
• Rest of Latin America

7. Competitive Landscape

• Competitive Snapshot
• What Market Participants are Saying?
• Competitive Dashboard
• Company Market Share Analysis, 2024 - Global

8. Company Profiles - Global Consumer Electronics Packaging Market

• Hangzhou Xunda Packaging Co.*
  • Company Overview
  • Product/Service Portfolio
  • Financial Performance
  • Recent Developments/Updates
  • Strategic Overview
• Smurfit Kappa Group PLC
• DS Smith Plc
• Pregis Corporation
• Dunapack Packaging Group
• Sonoco Products Company
• Stora Enso Oyi
• WestRock Company
• Mondi Group
• JJX Packaging LLC
• Huhtamaki Oyj
• Dordan Manufacturing Company
• Shenzhen Hoichow Packing Manufacturing Ltd.
• UFP Technologies, Inc.
• International Paper Company
• Sealed Air Corporation

9. Wheel of Fortune

• Wheel of Fortune
• Analyst View
• Coherent Opportunity Map

10. References and Research Methodology

• References
• Research Methodology
• About us and Sales Contact