首页 > 市场调查报告书 > 电子零件/半导体

印刷电子产品

市场调查报告书

商品编码

1477298

在模具电子市场中，按产品、按组件、按应用、按地理位置

In Mold Electronics Market, By Product, By Component, By Application, By Geography

出版日期: 2024年04月23日 | 出版商:

Coherent Market Insights | 英文 165 Pages | 商品交期: 2-3个工作天内

价格

简介目录

模内电子市场预计到2024年价值为2.2873亿美元，预计到2031年将达到12.4847亿美元，2024年至2031年的年复合成长率（CAGR）为27.4%。

报告范围		报告详情
基准年：	2023年	2024 年市场规模：	2.2873亿美元
历史数据：	2019年至2023年	预测期：	2024年至2031年
预测 2024 年至 2031 年复合年增长率：	27.40%	2031 年价值预测：	12.4847 亿美元

数字。模具电子市占率 (%)，依地区划分 2024 年

模内电子市场预计在未来几年将显着成长。模内电子技术是一种在成型过程中将电子电路整合到注塑塑胶零件中的技术。这种新技术有助于将感测、照明等电子功能直接嵌入模製塑胶零件中。减少组装步骤、紧凑设计、耐用性和大规模客製化等优点正在推动各行业对模内电子产品的需求。电子製造商越来越多地采用这种技术来生产创新产品并满足不断变化的客户偏好。由于汽车、楼宇自动化、消费品和医疗领域的应用不断增长，预计未来十年全球模具电子市场将出现两位数成长。

市场动态：

全球模具电子市场的成长主要是由各个垂直行业不断增长的自动化需求所推动的。製造商正在积极寻求将电子元件整合到他们的产品中，以添加感测、显示等功能。这有助于使产品变得更聪明。此外，以经济高效的方式生产具有嵌入式电子产品的客製化零件的能力正在推动采用。然而，模具的高初始投资和小规模生产的挑战正在限制更快的市场成长。此外，电子装置与塑胶零件的整合可能会导致需要解决的过热问题。从积极的一面来看，印刷技术、积体电路小型化和新型导电材料的不断进步为市场参与者带来了巨大的机会。一旦规模化，模内电子技术就可以实现物联网产品的大规模生产。

研究的主要特点：

该报告对全球模具电子市场进行了深入分析，并提供了以2023年为基准年的预测期（2024-2031年）的市场规模和年复合成长率（CAGR%）。

它阐明了不同细分市场的潜在收入机会，并解释了该市场有吸引力的投资主张矩阵。

这项研究还提供了有关市场驱动因素、限制因素、机会、新产品发布或批准、市场趋势、区域前景以及主要参与者采取的竞争策略的重要见解。

它根据以下参数描述了全球模具电子市场的主要参与者——公司亮点、产品组合、主要亮点、财务表现和策略。

本研究涵盖的主要公司包括 DuPont de Numours、TactoTek Oy、Golden Valley Products、Butler Technologies、GenesInk、YOMURA、InMold Solutions、Eastprint Incorporated、DuraTech Technologies Industries、BotFactory、Canatu、CEagaROP、Lite-On Technology、MesoScribe Technologies Industries 、Nagase America Corporation、nScrypt Inc.、Optomec、Pulse Electronics、Tangio Printed Electronics 和Nissha Co. Ltd.

该报告的见解将使行销人员和公司管理当局能够就未来的产品发布、类型升级、市场扩张和行销策略做出明智的决策。

全球模具电子市场报告迎合了该行业的各个利益相关者，包括投资者、供应商、产品製造商、分销商、新进业者和财务分析师。

利害关係人可以透过用于分析全球模具电子市场的各种策略矩阵轻鬆做出决策。

公司简介
- DuPont de Numours
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd

第 9 章：分析师建议

命运之轮
分析师观点
连贯的机会图

第 10 章：研究方法

参考
研究方法论

简介目录

Product Code: CMI6919

The In Mold Electronics Market is estimated to be valued at US$ 228.73 Mn in 2024 and is expected to reach US$ 1,248.47 Mn by 2031, exhibiting a compound annual growth rate (CAGR) of 27.4% from 2024 to 2031.

Report Coverage		Report Details
Base Year:	2023	Market Size in 2024:	US$ 228.73 Mn
Historical Data for:	2019 To 2023	Forecast Period:	2024 To 2031
Forecast Period 2024 to 2031 CAGR:	27.40%	2031 Value Projection:	US$ 1,248.47 Mn

Figure. In Mold Electronics Market Share (%), By Region 2024

The in mold electronics market is projected to grow significantly in the coming years. In mold electronics is a technology that involves the integration of electronic circuits into injection molded plastic parts during the molding process. This novel technique helps embed electronic functionality like sensing, lighting and others directly into molded plastic components. Several advantages such as decreased assembly steps, compact design, durability and mass customization is driving the demand for in mold electronics across various industries. Electronic manufacturers are increasingly adopting this technology to produce innovative products and cater to evolving customer preferences. The global in mold electronics market is expected to witness double digit growth over the next decade attributed to growing applications in automotive, building automation, consumer goods and medical sectors.

Market Dynamics:

The global in mold electronics market growth is primarily driven by growing automation needs across various industry verticals. Manufacturers are actively looking to integrate electronic components into their products to add functions like sensing, displays and more. This helps make products smarter. Additionally, the ability to produce customized parts with embedded electronics in a cost-effective manner is boosting adoption. However, high initial investment for tooling and small scale production challenges are restraining faster market growth. Moreover, the integration of electronics close to plastic parts can cause overheating issues which needs to be addressed. On the positive side, ongoing advancements in printing technologies, miniaturization of ICs and new conductive materials are presenting significant opportunities for market participants. Once scaled, in mold electronics can enable mass production of IoT products.

Key features of the study:

This report provides in-depth analysis of the global in mold electronics market, and provides market size (US$ Million) and compound annual growth rate (CAGR%) for the forecast period (2024-2031), considering 2023 as the base year

It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market

This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players

It profiles key players in the global in mold electronics market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies

Key companies covered as a part of this study include DuPont de Numours, TactoTek Oy, Golden Valley Products, Butler Technologies, GenesInk, YOMURA, InMold Solutions, Eastprint Incorporated, DuraTech Industries, BotFactory, Canatu, CERADROP, Lite-On Technology, MesoScribe Technologies, Nagase America Corporation, nScrypt Inc., Optomec, Pulse Electronics, Tangio Printed Electronics, and Nissha Co. Ltd

Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics

The global in mold electronics market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global in mold electronics market.

Market Segmentation

By Product
- Silver Conductive Ink
- Carbon Conductive Ink
- Others
By Component
- Sensors
- Antennas
- Connectors
- Others
By Application
- Consumer Electronics
- Automobile
- Home Appliance
- Industrial
- Others
By Regional
- North America
- Latin America
- Europe
- Asia Pacific
- Middle East & Africa
Key Players
- DuPont de Numours
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries
- BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd

1. Research Objectives and Assumptions

Research Objectives
Assumptions
Abbreviations

2. Market Purview

Report Description
- Market Definition and Scope
Executive Summary
- Market Snippet, By Product
- Market Snippet, By Component
- Market Snippet, By Application
- Market Snippet, By Region
Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

Market Dynamics
- Drivers
- Restraints
- Opportunities
Regulatory Scenario
Industry Trend
Merger and Acquisitions
New system Launch/Approvals
Impact of the COVID-19 Pandemic

4. Global In Mold Electronics Market, By Product, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Silver Conductive Ink
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Carbon Conductive Ink
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

5. Global In Mold Electronics Market, By Component, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Sensors
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Antennas
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Connectors
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

6. Global In Mold Electronics Market, By Application, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
- Segment Trends
Consumer Electronics
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Automobile
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Home Appliance
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Industrial
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)
Others
- Introduction
- Market Size and Forecast, 2019-2031, (US$ Million)

7. Global In Mold Electronics Market, By Region, 2019-2031 (US$ Million)

Introduction
- Market Share Analysis, By Region, 2024 and 2031 (%)
- Y-o-Y Growth Analysis, 2020-2031
North America
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
U.S.
Canada
Europe
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
U.K.
Germany
Italy
France
Russia
Rest of Europe
Asia Pacific
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
China
India
ASEAN
Australia
South Korea
Japan
Rest of Asia Pacific
Latin America
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
Brazil
Argentina
Mexico
Rest of Latin America
Middle East and Africa
- Regional Trends
- Market Size and Forecast, By Product, 2019-2031 (US$ Million)
- Market Size and Forecast, By Component, 2019-2031 (US$ Million)
- Market Size and Forecast, By Application, 2019-2031 (US$ Million)
- Market Share Analysis, By Country, 2019 and 2031 (%)
GCC Countries
South Africa
Rest of the Middle East and Africa

8. Competitive Landscape

Company Profiles
- DuPont de Numours
Company Overview
Product Portfolio
Financial Performance
Key Strategies
Recent Developments/Updates
- TactoTek Oy
- Golden Valley Products
- Butler Technologies
- GenesInk
- YOMURA
- InMold Solutions
- Eastprint Incorporated
- DuraTech Industries BotFactory
- Canatu
- CERADROP
- Lite-On Technology
- MesoScribe Technologies
- Nagase America Corporation
- nScrypt Inc.
- Optomec
- Pulse Electronics
- Tangio Printed Electronics
- Nissha Co. Ltd