全球专用集成电路 (ASIC) 市场 - 2023-2030 年
市场调查报告书
商品编码
1316220

全球专用集成电路 (ASIC) 市场 - 2023-2030 年

Global Application-Specific Integrated Circuit (ASIC) Market - 2023-2030

出版日期: | 出版商: DataM Intelligence | 英文 205 Pages | 商品交期: 约2个工作天内

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简介目录

市场概述

2022 年,全球专用集成电路 (ASIC) 市场规模达到 157 亿美元,预计到 2030 年将达到 345 亿美元,2023-2030 年的复合年增长率为 8.3%。制造商的大规模生产能力对特定应用集成电路行业的发展至关重要。尽管具有潜在用途,但由于最终用户部门继续寻求大批量生产,因此成本仍然是小型企业发展的重要障碍。市场参与者正通过缩短产品开发周期来应对这种发展,以减少特殊性。

亚太地区增长显著,人气旺盛,2022 年将占全球专用集成电路(ASIC)市场的 1/3 以上。汽车行业的发展促进了对集成电路的需求,鼓励集成电路制造商扩大生产设施。例如,2022 年 8 月,模拟集成电路代工厂 GTA Semiconductor 开始在上海自由贸易试验区临港特区进行产能扩张项目。

市场动态

5G 普及率不断提高

5G 技术的日益普及推动了对支持 5G 技术的智能手机的需求,并为全球专用集成电路市场的增长提供了支持。5G 支持的高速数据通信有望促进工业自动化以及人工智能、物联网等新技术的采用。随着越来越多的电子设备被用于构建此类基础设施,对模拟电路的需求可能会上升。

中国也是最大的消费电子产品生产国和使用国之一。据中国海关统计,2021 年中国出口额约为 3.36 万亿美元,比上年增长 30%。由于消费电子和其他电气产品在出口额中占很大比重,预计全球 ASIC 市场将呈现持续增长态势。

通信设备需求不断增长

通信设备需求的增长推动了专用集成电路(ASIC)市场的扩大。近年来,智能手机和智能家居小工具的快速增长推动了印度和韩国对集成电路的需求。第五代(5G)无线技术在数字设备上的快速应用,也是互联设备和智能产品需求增长的重要组成部分,从而推动了对专用集成电路(ASIC)需求的增长。

根据韩国信息社会发展研究院(KISDI)的数据,韩国智能手机的拥有率从 2020 年的 91.2% 和 2019 年的 89.6% 大幅增至 2021 年的 92.7%。该地区智能手机采用率的上升可能会增加市场对特定应用集成电路的需求。

生产周期长,复用性有限

专用集成电路的开发通常包括设计、验证、制造和测试等多个步骤,因此开发周期较长。与 FPGA 或通用集成电路等其他半导体器件相比,将 ASIC 推向市场所需的时间往往更长。公司对市场需求或技术改进做出快速反应的能力可能会因开发周期的延长而受到影响,从而降低其竞争力。

专用集成电路往往是为专门用途而开发的,可能不容易在不同产品或行业中重复使用。与通用集成电路不同,专用集成电路是为一种特定功能而设计的,因此很难将其转用于多种用途。对于需要为不同产品或变体生产许多 ASIC 的组织来说,缺乏可重复使用性可能会限制成本节约和设计效率。

COVID-19 影响分析

COVID-19 大流行对集成电路行业造成了严重影响,导致供应链中断和全球生产停顿。然而,在疫情期间,医疗保健、远程就业和在线通信等几个行业的需求却不断增加。医疗设备、电信基础设施、数据中心和其他关键技术中使用的专用集成电路变得越来越重要。因此,这些领域对专用集成电路制造的需求增加,以满足日益增长的需求,而其他行业的需求则有所下降。

大流行病加速了各种企业的数字化转型。随着组织和个人对数字服务和技术的依赖程度越来越高,为先进计算、人工智能(AI)和其他开发中应用提供动力的 ASIC 需求也随之增长。这种需求模式的转变可能会改变 ASIC 制造商的战略重点和产品开发路线图。

俄罗斯-乌克兰战争的影响

俄乌冲突加剧了地缘政治紧张局势,可能对 ASIC 行业产生间接影响。各国政府可能会因此实施贸易限制、制裁或进出口法律。这些措施有可能扰乱包括专用集成电路在内的商品和技术的流通,并给全球市场带来不确定性。

乌克兰的半导体级氖气产量占全球总量的 90%。氖气被制造商用于辅助制造内存芯片和逻辑集成电路所需的光刻和芯片蚀刻活动。由于战争,乌克兰的两家天然气生产供应商 Ingas 和 Cryoin 已经暂停了在马里乌波尔和莫斯科的业务。

此外,乌克兰还是钯和六氟丁二烯(C4F6)等半导体生产材料的重要供应国。此外,在入侵乌克兰之前,俄罗斯是镍、钯、铂和铝等生产矿物的主要供应国。

目 录

第 1 章:研究方法与范围

  • 研究方法
  • 报告的研究目标和范围

第2章:定义和概述

第 3 章:执行摘要

  • 按类型分類的片段
  • 按应用分類的片段
  • 按最终用户分類的片段
  • 按地区分類的片段

第四章:动态

  • 影响因素
    • 驱动因素
      • 5G 普及率不断提高
      • 通信设备需求增长
    • 限制因素
      • 生产周期长,可重复使用性有限
    • 机会
    • 影响分析

第 5 章:行业分析

  • 波特五力分析法
  • 供应链分析
  • 定价分析
  • 监管分析

第 6 章:COVID-19 分析

  • COVID-19 分析
    • COVID 之前的情况
    • COVID 期间的情景
    • COVID 后的情景
  • COVID-19 期间的定价动态
  • 供求关系
  • 大流行期间与市场相关的政府倡议
  • 制造商的战略倡议
  • 结论

第 7 章:按类型划分

  • 全定制 ASIC
  • 半定制 ASIC
  • 可编程 ASIC

第 8 章:按应用划分

  • 无线通信
  • 推理应用
  • 加速和存储
  • 过程和质量控制
  • 安全与监控
  • 其他

第 9 章:按最终用户分类

  • 信息技术和电信
  • 汽车
  • 工业
  • 消费电子
  • 其他

第 10 章:按地区划分

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 法国
    • 意大利
    • 俄罗斯
    • 欧洲其他地区
  • 南美洲
    • 巴西
    • 阿根廷
    • 南美洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 澳大利亚
    • 亚太其他地区
  • 中东和非洲

第 11 章 :竞争格局

  • 竞争格局
  • 市场定位/份额分析
  • 合併与收购分析

第十二章 :公司简介

  • Seiko Epson Corporation
    • 公司概况
    • 产品组合和说明
    • 财务概况
    • 近期发展
  • Honeywell International Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Marvell
  • Maxim Integrated
  • Omnivision
  • Qualcomm Technologies, Inc.
  • Renesas Electronics Corporation
  • STMicroelectronics

第 13 章 :附录

  • 关于我们和最终用户
简介目录
Product Code: ICT6526

Market Overview

Global Application-Specific Integrated Circuit (ASIC) Market reached US$ 15.7 billion in 2022 and is expected to reach US$ 34.5 billion by 2030, growing with a CAGR of 8.3% during the forecast period 2023-2030. Manufacturers' mass-production capabilities are critical to the development of the application-specific integrated circuit the sector. Despite its potential uses, costs continue to be an important barrier to small-business growth, since end-user sectors continue to seek high-volume manufacturing. Market participants are reacting to such developments by shortening product development cycles for reduced specialties.

Asia-Pacific has had significant growth and popularity, accounting for more than 1/3rd of the global application-specific integrated circuit (ASIC) market in 2022. The growth of the automotive industry contributes to the need for integrated circuits, encouraging IC manufacturers to expand their production facilities. For example, in August 2022, analogue IC foundry GTA Semiconductor began its capacity expansion project in the Shanghai Pilot Free Trade Zone's Lingang Special Area.

Market Dynamics

Increasing 5G Penetration

The increasing adoption of 5G technology is driving demand for 5G-enabled smartphones and supporting the growth of the global application-specific integrated circuit market. High-speed data communication enabled by 5G is expected to promote industrial automation and the adoption of new technologies such as AI, IoT and so on. As more electronic devices are used to construct such infrastructure, demand for analogue circuits is likely to rise.

China is also one of the largest producers and users of consumer electronics. According to China Customs, the country exported around US$ 3.36 trillion in 2021, representing a 30% increase in export value over the previous year. Since consumer electronics and other electrical products account for a significant portion of export value, the global ASIC market is anticipated to show sustained growth.

Rising Demand for Communication Devices

The increased need for communication devices is driving the expansion of the application-specific integrated circuit (ASIC) market. The rapid growth of smartphones and smart home gadgets in recent years has boosted demand for integrated circuits in India and South Korea. The rapid adoption of fifth-generation (5G) wireless technology for digital devices is also an essential component in the increasing demand for linked devices and smart products, driving up the demand for ASICs.

According to the Korea Information Society Development Institute (KISDI), smartphone ownership in South Korea grew dramatically to 92.7% in 2021 from 91.2% in 2020 and 89.6% in 2019. Such a rise in smartphone adoption in the region is likely to increase the demand for application-specific ICs in the market.

Long Production Cycle and Limited Reusability

ASIC development often consists of numerous steps, including design, verification, fabrication and testing, resulting in lengthy development cycles. When compared to other semiconductor devices, such as FPGAs or general-purpose ICs, the time required to bring an ASIC to market tends to be higher. Companies' capacity to respond rapidly to market needs or technical improvements may be hampered by the increased development period, reducing their competitiveness.

ASICs tend to be developed for specialised purposes and may not be easily repurposed across products or industries. ASICs, unlike general-purpose ICs are designed for one particular function, making it difficult to repurpose them for multiple purposes. For organisations that need to produce many ASICs for different products or variations, this lack of reusability might limit cost savings and design efficiencies.

COVID-19 Impact Analysis

The COVID-19 pandemic had a severe impact on the integrated circuits industry, causing supply chain disruptions and a global manufacturing halt. However, several industries, such as healthcare, remote employment and online communication, saw increasing demand during the epidemic. ASICs utilised in medical equipment, telecommunication infrastructure, data centres and other key technologies have become increasingly important. As a result, there was a greater need for ASIC manufacture in these areas to match the increasing demand, while demand in other industries fell.

The pandemic accelerated digital transformation in a variety of businesses. As organisations and individuals became more reliant on digital services and technology, the need for ASICs to power advanced computing, artificial intelligence (AI) and other developing applications grew. This shift in demand patterns may have changed ASIC makers' strategic focus and product development roadmaps.

Russia- Ukraine War Impact

The Russian-Ukrainian conflict has heightened geopolitical tensions, which may have an indirect influence on the ASIC sector. Various governments may implement trade restrictions, sanctions or export/import laws as a result. Such measures have the potential to disrupt the flow of commodities and technologies, including ASICs, as well as cause uncertainty in the worldwide market.

Ukraine is responsible for 90% of the world's semiconductor-grade neon gas production. Neon is used by manufacturers to aid in the lithography and chip etching activities required to build memory chips and logic ICs. Because of the war, Ingas and Cryoin, two Ukrainian producing gas suppliers, have suspended operations in Mariupol and Moscow.

Furthermore, Ukraine is a significant supplier of semiconductor production materials such as palladium and hexafluorobutadiene (C4F6). Furthermore, prior to its invasion of Ukraine, Russia was a major supplier of production minerals such as nickel, palladium, platinum and aluminium.

Segment Analysis

The global application-specific integrated circuit (ASIC) market is segmented based on type, application, end-user and region.

Next-Generation Phones drives Consumer Electronis Growth

The consumer electronics is expected to grow with the highest CAGR in the global application-specific integrated circuit market during the forecast period 2023-2030. Users may develop next-generation smartphone designs using analogue integrated circuits and reference designs. Customers will benefit from industry power management and battery management technologies, as well as new smart amp technology that provides optimal sound quality, analogue and embedded goods.

For example, Motorola announced a collaboration with Guru Wireless in May 2021 to deliver remote wireless charging technology for smartphones, reducing the need for users to utilise cable chargers and charging pads. Furthermore, the wrist Smartphone is projected to gain popularity because users will no longer need to utilise another linked device such as a smartwatch to conduct various functions such as quick class and navigation, among others.

Geographical Analysis

Growing Demand for Smart Devices in Asia-Pacific

With growing digitalization and a surge in demand for smart devices, Asia-Pacific is expected to have the highest rate of growth in the application-specific integrated circuit (ASIC) market during the forecast period. The presence of many high-performance smart TV vendors in the region, such as Samsung Electronics and Sony Corporation, has accelerated their adoption. The companies are introducing new smart TVs in Asia-Pacific in response to increased demand in the region.

For example, in August 2021, Huawei released its largest smart TV in China. The 98-inch LCD Ultra HD 4K (3840 x 2160 pixels) display has a refresh rate of 120Hz, AiMaxCinema compatibility and a DCI-P3 colour gamut. It supports DTS and Dolby dual decoding in terms of audio. The developments offer opportunities for the growth of the global application-specific integrated circuit market.

Competitive Landscape

The major global players include: Seiko Epson Corporation, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Marvell, Maxim Integrated, Omnivision, Qualcomm Technologies, Inc., Renesas Electronics Corporation and STMicroelectronics.

Why Purchase the Report?

  • To visualize the global application-specific integrated circuit (ASIC) market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of application-specific integrated circuit (ASIC) market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as Excel consisting of key products of all the major players.

The global application-specific integrated circuit (ASIC) market report would provide approximately 61 tables, 62 figures and 205 Pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet by Type
  • 3.2. Snippet by Application
  • 3.3. Snippet by End-User
  • 3.4. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Increasing 5G Penetration
      • 4.1.1.2. Rising Demand for Communication Devices
    • 4.1.2. Restraints
      • 4.1.2.1. Long Production Cycle and Limited Reusability
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Type

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 7.1.2. Market Attractiveness Index, By Type
  • 7.2. Full-Custom ASIC*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Semi-Custom ASIC
  • 7.4. Programmable ASIC

8. By Application

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 8.1.2. Market Attractiveness Index, By Application
  • 8.2. Wireless Communication*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Inferencing Application
  • 8.4. Acceleration and Storage
  • 8.5. Process and Quality Control
  • 8.6. Security and Surveillance
  • 8.7. Others

9. By End-User

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 9.1.2. Market Attractiveness Index, By End-User
  • 9.2. IT and Telecommunication*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Automotive
  • 9.4. Industrial
  • 9.5. Consumer Electronics
  • 9.6. Others

10. By Region

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 10.1.2. Market Attractiveness Index, By Region
  • 10.2. North America
    • 10.2.1. Introduction
    • 10.2.2. Key Region-Specific Dynamics
    • 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.2.6.1. U.S.
      • 10.2.6.2. Canada
      • 10.2.6.3. Mexico
  • 10.3. Europe
    • 10.3.1. Introduction
    • 10.3.2. Key Region-Specific Dynamics
    • 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.3.6.1. Germany
      • 10.3.6.2. UK
      • 10.3.6.3. France
      • 10.3.6.4. Italy
      • 10.3.6.5. Russia
      • 10.3.6.6. Rest of Europe
  • 10.4. South America
    • 10.4.1. Introduction
    • 10.4.2. Key Region-Specific Dynamics
    • 10.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.4.6.1. Brazil
      • 10.4.6.2. Argentina
      • 10.4.6.3. Rest of South America
  • 10.5. Asia-Pacific
    • 10.5.1. Introduction
    • 10.5.2. Key Region-Specific Dynamics
    • 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 10.5.6.1. China
      • 10.5.6.2. India
      • 10.5.6.3. Japan
      • 10.5.6.4. Australia
      • 10.5.6.5. Rest of Asia-Pacific
  • 10.6. Middle East and Africa
    • 10.6.1. Introduction
    • 10.6.2. Key Region-Specific Dynamics
    • 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
    • 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11. Competitive Landscape

  • 11.1. Competitive Scenario
  • 11.2. Market Positioning/Share Analysis
  • 11.3. Mergers and Acquisitions Analysis

12. Company Profiles

  • 12.1. Seiko Epson Corporation*
    • 12.1.1. Company Overview
    • 12.1.2. Product Portfolio and Description
    • 12.1.3. Financial Overview
    • 12.1.4. Recent Developments
  • 12.2. Honeywell International Inc.
  • 12.3. Infineon Technologies AG
  • 12.4. Intel Corporation
  • 12.5. Marvell
  • 12.6. Maxim Integrated
  • 12.7. Omnivision
  • 12.8. Qualcomm Technologies, Inc.
  • 12.9. Renesas Electronics Corporation
  • 12.10. STMicroelectronics

LIST NOT EXHAUSTIVE

13. Appendix

  • 13.1. About Us and End-User
  • 13.2. Contact Us