封面
市场调查报告书
商品编码
1610847

ASIC(专用积体电路)市场规模、份额、成长分析、按产品、数量、最终用途、地区 - 产业预测,2024-2031 年

Application Specific Integrated Circuit Market Size, Share, Growth Analysis, By Product, By Volume, By End Use, By Region - Industry Forecast 2024-2031

出版日期: | 出版商: SkyQuest | 英文 191 Pages | 商品交期: 3-5个工作天内

价格
简介目录

2022年全球ASIC(专用积体电路)市场规模为157亿美元,从2023年的168亿美元成长到2031年的282亿美元,预计将从2023年的168亿美元成长到2031年的282亿美元。 2031 年预测期间(2024-2031 年)预估2019 年复合年增长率为6.7%。

在整合到智慧型手机、平板电脑和智慧型手錶等各种消费性电子产品的推动下,专用积体电路(ASIC)(ASIC)市场预计将显着成长。 ASIC 专为特定功能而设计,允许将多个电子元件紧凑地整合在单一晶片上,以满足精确的系统规格。这种多功能性导致了 ASIC 在各个领域的应用,包括汽车、通讯、电子和医疗保健。特别是,对高频宽和长电池寿命的下一代智慧型手机的需求正在迅速增长,预计到 2025 年 75% 的行动电话用户将拥有智慧型手机。此外,游戏机和穿戴式装置等先进电子设备的普及反映了智慧技术的不断增长趋势,进一步推动了对 ASIC 的需求。

目录

介绍

  • 研究目的
  • 调查范围
  • 定义

调查方法

  • 资讯采购
  • 二手资料和主要资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 按细分市场的机会分析

市场动态及展望

  • 市场概况
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 抑制因素和挑战
  • 波特分析与影响
    • 竞争公司之间的敌对关係
    • 替代品的威胁
    • 买方议价能力
    • 新进入者的威胁
    • 供应商的议价能力

主要市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 市场吸引力指数(2023)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 价格分析
  • 技术进步
  • 监管环境
  • 案例研究
  • 专利分析

ASIC(专用积体电路)市场规模:依产品及复合年增长率(2024-2031)

  • 市场概况
  • 全客自订ASIC
  • 半客自订ASIC
  • 细胞基础
  • 基于数组

ASIC(专用积体电路)市场规模:依销量及复合年增长率(2024-2031)

  • 市场概况
  • 低音量
  • 高容量

ASIC(专用积体电路)市场规模:依最终用途及复合年增长率(2024-2031)

  • 市场概况
  • 资讯科技和通讯
  • 家电
  • 卫生保健
  • 产业

ASIC(专用积体电路)市场规模:按地区和复合年增长率(2024-2031)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 西班牙
    • 法国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东/非洲

竞争资讯

  • 前5名企业对比
  • 主要企业市场定位(2023年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2023)
  • 主要企业简介
    • 公司简介
    • 产品系列分析
    • 按细分市场分類的份额分析
    • 收益与前一年同期比较(2021-2023)

主要企业简介

  • Broadcom Inc.(United States)
  • STMicroelectronics(Switzerland)
  • Faraday Technology Corporation(Taiwan)
  • FUJITSU(Japan)
  • Infineon Technologies AG(Germany)
  • Comport Data(United States)
  • Intel Corporation(United States)
  • ASIX Electronics(Taiwan)
  • OmniVision Technologies, Inc.(United States)
  • Semiconductor Components Industries, LLC(United States)
  • Seiko Epson Corporation(Japan)
  • DWIN Technology(China)
  • Socionext America Inc.(United States)
  • Tekmos Inc.(United States)

结论和建议

简介目录
Product Code: SQMIG45N2106

Global Application Specific Integrated Circuit Market size was valued at USD 15.7 billion in 2022 and is poised to grow from USD 16.8 billion in 2023 to USD 28.2 billion by 2031, growing at a CAGR of 6.7% during the forecast period (2024-2031).

The market for application-specific integrated circuits (ASICs) is poised for significant growth, driven by their integration into a variety of consumer electronics including smartphones, tablets, and smartwatches. ASICs, designed for specific functions, allow for the compact assembly of multiple electrical components on a single chip, ensuring they meet precise system specifications. This versatility has led to their application across diverse sectors such as automotive, communications, electronics, and healthcare. Notably, demand is surging for next-gen smartphones equipped with high bandwidth and extended battery life, with predictions indicating that 75% of mobile phone users will own smartphones by 2025. Additionally, the popularity of advanced electronic devices like gaming consoles and wearables further fuels the demand for ASICs, reflecting the growing trend towards smart technologies.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Application Specific Integrated Circuit market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Application Specific Integrated Circuit Market Segmental Analysis

Global Application Specific Integrated Circuit Market is segmented by Product, Volume, End Use and Region. Based on Product, the market is segmented into Full Custom ASIC, Semi-Custom ASIC, Cell Based, Array Based. Based on Volume, the market is segmented into Low Volume, High Volume. Based on End Use, the market is segmented into Telecom, Consumer Electronics, Automotive, Healthcare, Industrial. Based on Region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Application Specific Integrated Circuit Market

The Global Application Specific Integrated Circuit (ASIC) market is primarily driven by the increasing demand for customized solutions across various sectors, such as automotive, telecommunications, and consumer electronics. Businesses seek tailored integrated circuits that align with their specific size, power, and performance needs to enhance their competitive advantage. This surge in interest for bespoke ASICs stems from the ongoing evolution in technology, necessitating solutions that optimize efficiency and performance. Consequently, the market experiences significant growth as companies strive to harness the benefits of personalized ASICs to adapt to rapidly changing industry requirements.

Restraints in the Global Application Specific Integrated Circuit Market

One of the key restraints affecting the global Application Specific Integrated Circuit (ASIC) market is the significant cost associated with design and development. For small and medium-sized enterprises (SMEs), the high expenses involved in ASIC manufacturing can present a formidable barrier to entry. The costs related to design tools, prototyping, and extensive testing can create financial strain, discouraging many companies from pursuing ASIC solutions. As a result, this financial hurdle may lead to a decrease in competition and innovation within the ASIC industry, ultimately hindering growth and technological advancements in the market.

Market Trends of the Global Application Specific Integrated Circuit Market

The Global Application Specific Integrated Circuit (ASIC) market is witnessing a significant trend towards enhanced energy efficiency, driven by the growing emphasis on sustainability across various sectors. Manufacturers are prioritizing power-saving features in their ASIC designs to meet stringent environmental standards and reduce operational costs. This shift not only aligns with corporate sustainability objectives but also appeals to a more environmentally conscious customer base eager for advanced, energy-efficient ASIC solutions. As concerns over energy consumption and climate impact rise, the demand for innovative, eco-friendly ASICs is expected to surge, positioning energy-efficient design as a critical focus in the evolving market landscape.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2023
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technological Advancement
  • Regulatory Landscape
  • Case Studies
  • Patent Analysis

Application Specific Integrated Circuit Market Size by Product & CAGR (2024-2031)

  • Market Overview
  • Full Custom ASIC
  • Semi-Custom ASIC
  • Cell Based
  • Array Based

Application Specific Integrated Circuit Market Size by Volume & CAGR (2024-2031)

  • Market Overview
  • Low Volume
  • High Volume

Application Specific Integrated Circuit Market Size by End Use & CAGR (2024-2031)

  • Market Overview
  • IT and Telecom
  • Automotive
  • Consumer Electronics
  • Healthcare
  • Industrial

Application Specific Integrated Circuit Market Size & CAGR (2024-2031)

  • North America, (Product, Volume, End Use)
    • US
    • Canada
  • Europe, (Product, Volume, End Use)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Product, Volume, End Use)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Product, Volume, End Use)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Product, Volume, End Use)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Broadcom Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • STMicroelectronics (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Faraday Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • FUJITSU (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infineon Technologies AG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Comport Data (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASIX Electronics (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • OmniVision Technologies, Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Semiconductor Components Industries, LLC (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Seiko Epson Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • DWIN Technology (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Socionext America Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tekmos Inc. (United States)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation