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AI ASIC 市场展望：全球产业与技术分析 (2025)
市场调查报告书
商品编码
1774040

AI ASIC 市场展望：全球产业与技术分析 (2025)

AI ASIC Market Outlook: 2025 Global Industry and Technology Analysis
出版日期: | 出版商: TrendForce | 英文 8 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

概述

AI ASIC 市场正在快速扩张，TPU 因其节能和可自订性，正从内部使用转向外部产品化。各大云端运算和高科技公司正积极开发自有 ASIC，以降低成本和供应风险，推动 AI 硬体朝向高效能、低功耗和多样化应用方向发展，成为继 GPU 之后第二大加速器。

主要亮点

  • 随着云端服务需求的不断成长以及 AI 模式规模的扩大，AI ASIC 市场正在快速成长。
  • TPU 在节能和垂直整合方面具有优势，并且比高阶 GPU 具有更优的成本结构和可自订性。
  • 美国主要云端服务供应商和主要高科技公司（特斯拉、OpenAI、苹果）正在积极开发针对特定 AI 应用的自有 ASIC。
  • 自主研发 ASIC 可降低长期运算成本与供应链风险，进而提升竞争力。
  • AI ASIC 应用领域正从训练和推理扩展到语音生成、即时翻译、推荐系统和边缘 AI，从而实现更广泛的商业化和垂直市场渗透。
  • 晶片设计服务供应商正在支援产业发展，将 AI ASIC 定位为继 GPU 之后的主要 AI 加速硬体。

目录

第一章：云端服务供应商 (CSP) 自研 ASIC 将推动 2026 年 AI 伺服器市场成长，博通等晶片製造商对 CoWoS 的需求不断增长

  • 基于 ASIC 的 AI 伺服器占比不断上升

第二章：AI ASIC 架构正采用高功率设计，并逐步转向液冷

  • 各大云端服务供应商加速自研 AI ASIC 的开发

第三章：ASIC 应用从内部扩展到外部，TPU 成为多家公司首选解决方案

第四章：市场快速扩张，AI ASIC 将转型成为 AI 第二大成长引擎硬体

  • 预计人工智慧 ASIC 市场的复合年增长率将逐年成长
简介目录
Product Code: TRi-0077

Overview

The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively develop in-house ASICs to reduce costs and supply risks, driving AI hardware toward high performance, low power, and diverse applications, becoming the main accelerator after GPUs.

Key Highlights:

  • The AI ASIC market is experiencing rapid growth, driven by increasing cloud service demand and AI model scale.
  • TPUs have advantages in energy efficiency and vertical integration, offering better cost structure and customization than high-end GPUs.
  • Major US cloud providers and leading tech firms (Tesla, OpenAI, Apple) actively develop in-house ASICs tailored to specific AI applications.
  • In-house ASIC development reduces long-term compute costs and supply chain risks, enhancing competitiveness.
  • AI ASIC applications are expanding from training and inference to voice generation, real-time translation, recommendation systems, and edge AI, enabling wider commercialization and vertical market penetration.
  • Chip design service providers support industry growth, positioning AI ASICs as the second major AI acceleration hardware after GPUs.

Table of Contents

1. CSPs' In-House Designed ASICs Will Drive Growth in AI Server Market in 2026, and CoWoS Demand from Broadcom and Other Chip Makers Will Also Rise

  • Proportion of ASIC-Based AI Servers Will Climb Nearly

2. Architectures of AI ASICs Adopt High-Power Design and Gradually Shift to Liquid Cooling

  • Major CSPs Are Accelerating Development of In-House Designed AI ASICs

3. ASIC Applications Branching Out from Internal to External Sectors; TPU Became the Solution Opted by Multiple Players

4. AI ASICs to Transform into Second Key Growth Engine of AI Hardware amidst Expeditious Market Expansions

  • AI ASIC Market Projected for CAGR under Annual Growths