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市场调查报告书
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1865397

全球专用积体电路 (ASIC) 市场：预测至 2032 年 - 按类型、设计方法、技术、封装与测试、经营模式、最终用户和地区进行分析

Application-Specific Integrated Circuits Market Forecasts to 2032 - Global Analysis By Type, Design Methodology, Technology, Packaging & Test, Business Model, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，预计到 2025 年，全球 ASIC（专用积体电路）市场规模将达到 186 亿美元，到 2032 年将达到 282 亿美元，预测期内复合年增长率为 6.1%。

专用积体电路 (ASIC) 是一种为特定功能或应用而设计的客製化半导体晶片，具有优化的性能、能源效率和紧凑的外形规格。与通用处理器不同，ASIC 旨在以高精度和高速度执行预先定义的任务，因此非常适合通讯、汽车和家用电子电器等行业。其固定的架构提高了可靠性和吞吐量，但限制了灵活性。 ASIC 通常用于对特定功能要求极高的大量生产环境。

节能、高性能晶片的需求日益增长

随着各行业向智慧基础设施和物联网生态系统转型，对客製化、低延迟的晶片解决方案的需求日益增长。这些晶片旨在针对特定任务提供最佳化的效能，在提高处理速度的同时降低功耗。此外，由于专用积体电路 (ASIC) 在特定应用中优于通用处理器，因此在资料中心和人工智慧工作负载中越来越受欢迎。预计这一趋势将持续推动对高性能专用晶片设计的长期需求。

设计复杂性与检验挑战

与通用晶片不同，专用积体电路（ASIC）需要针对特定功能进行精确的架构设计，这增加了设计缺陷和延迟的风险。检验工具必须模拟各种场景以确保可靠性，从而增加了开发时间和成本。此外，缺乏跨行业的标准设计框架也使整合和扩充性变得更加复杂。满足严格的性能标准和监管合规性要求进一步加剧了这些挑战，这可能会限制中小企业进入市场。

量子运算、边缘人工智慧和神经形态晶片的新兴应用

量子运算领域正在探索利用专用积体电路（ASIC）来管理控制系统和纠错通讯协定，从而最大限度地降低延迟。自动驾驶汽车和智慧监控系统等边缘人工智慧应用需要低功耗的即时处理能力，这使得它们成为ASIC的理想应用场景。此外，模拟类脑架构的神经形态运算也依赖于客製化硅晶片来高效率地复製突触行为。这些新兴领域正在推动对高度专业化晶片的需求，并促进学术界和产业界之间的研发投资和策略合作。

地缘政治紧张局势与出口限制

贸易限制、出口管制和外交衝突，尤其是在主要半导体生产国之间，可能会阻碍企业取得关键製造技术和原料。这些限制不仅会延误生产进度，还会增加成本，进而影响盈利。此外，对智慧财产权和国家安全问题的监管力度加大，可能会限制跨国伙伴关係和技术转移。这些风险正促使企业重新评估筹资策略，并投资于区域製造能力，以降低风险敞口。

新冠疫情的感染疾病：

新冠疫情扰乱了半导体供应链，导致多个产业出现晶片短缺和产品发布延迟。然而，这场危机也加速了数位转型，提振了通讯、医疗诊断和云端运算领域对专用积体电路（ASIC）的需求。封锁措施和远端办公的普及增加了对资料中心和智慧型设备的依赖，而ASIC在优化效能方面发挥了关键作用。儘管初期生产瓶颈影响了收入，但随着企业优先考虑弹性设计策略和供应商网路多元化，长期前景已有所改善。

预计在预测期内，可程式ASIC细分市场将占据最大的市场份额。

由于可程式专用积体电路 (ASIC) 在原型製作和中等批量生产方面具有灵活性和成本效益，预计在预测期内，ASIC 细分市场将占据最大的市场份额。其适应性使其适用于家用电子电器、工业自动化和无线通讯等领域不断发展的应用。随着可配置硬体（尤其是在边缘运算和嵌入式系统领域）的需求不断增长，可程式 ASIC 正成为寻求效能和扩充性之间平衡的製造商的首选。

预计在预测期内，软硬体协同设计领域将呈现最高的复合年增长率。

由于系统级性能的提升、调试週期的缩短以及在人工智慧推理引擎和自主系统等复杂应用中加速部署等因素，预计硬体-软体协同设计领域在预测期内将实现最高的成长率。整合系统日益增长的复杂性正在推动采用由先进模拟工具和协同开发平台支援的协同设计框架。随着行业寻求缩短创新周期和提高功能效率，预计该领域将快速扩张。

占比最大的地区：

亚太地区预计将在预测期内占据最大的市场份额，这主要得益于其强大的半导体製造基础设施和庞大的电子产品产量。中国、韩国、台湾和日本等国家和地区拥有许多大型晶圆代工厂和设计公司，从而实现了成本效益高的製造和创新。该地区在消费性电子、汽车和通讯领域的强大影响力进一步推动了对客製化晶片的需求。政府支持数位转型和工业自动化的措施也促进了市场成长，使亚太地区成为全球ASIC晶片应用中心。

复合年增长率最高的地区：

预计亚太地区在预测期内将实现最高的复合年增长率，这主要得益于研发投入的增加和先进技术的日益普及。印度和越南等新兴经济体对智慧型设备、物联网解决方案和人工智慧平台的需求激增，而这些都需要专用积体电路（ASIC）来实现高效处理。当地企业与全球半导体巨头之间的策略合作正在推动创新和能力建设。

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目录

第一章执行摘要

第二章 引言

  • 概述
  • 相关利益者
  • 分析范围
  • 分析方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 分析方法
  • 分析材料
    • 原始研究资料
    • 二手研究资讯来源
    • 先决条件

第三章 市场趋势分析

  • 介绍
  • 司机
  • 抑制因素
  • 市场机会
  • 威胁
  • 终端用户分析
  • 新兴市场
  • 新冠疫情的感染疾病

第四章 波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代产品的威胁
  • 新参与企业的威胁
  • 公司间的竞争

第五章 全球专用积体电路 (ASIC) 市场（按类型划分）

  • 介绍
  • 完全客製化的ASIC晶片
  • 半客製化ASIC
  • 可程式专用积体电路
  • 基于闸阵列的专用积体电路
  • 标准单元型专用积体电路
  • 其他类型

6. 全球ASIC市场依设计方法划分

  • 介绍
  • RTL 到 GDSII 流
  • 以IP为中心的设计
  • 基于平台的设计
  • 硬体和软体协同设计
  • 测试导向的设计（DFT）
  • 专为产量比率和可製造性而设计

7. 按技术节点分類的全球专用积体电路 (ASIC) 市场

  • 介绍
  • 先进製程（7nm及以下）
  • 主要製程（8-14nm）
  • 成熟节点（16-28nm）
  • 传统製程节点（28-65nm）
  • 较旧的製程（65nm以上）

8. 全球专用积体电路 (ASIC) 市场（依封装和测试划分）

  • 介绍
  • 传统打线接合封装
  • 先进封装（2.5D、3D-IC、SiP）
  • 覆晶和BGA
  • 测试服务（晶圆探针测试、最终测试）
  • 老化测试和可靠性测试
  • 其他软体包测试

9. 全球ASIC市场依经营模式

  • 介绍
  • 无晶圆厂ASIC公司
  • 整合装置製造商（IDM）
  • 晶圆代工厂服务/客製化製造
  • 承包设计和智慧财产权授权模式
  • 设计服务和ASIC即服务
  • 其他经营模式

第十章：全球ASIC（专用积体电路）市场（依最终用户划分）

  • 介绍
  • 通讯与网路
  • 资料中心和云端基础设施
  • 家用电器
  • 车
  • 工业自动化和物联网
  • 医疗设备和药品
  • 航太/国防
  • 安全与监控
  • 其他最终用户

第十一章：全球ASIC（专用积体电路）市场（按地区划分）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 亚太其他地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十二章：主要趋势

  • 合约、商业伙伴关係和合资企业
  • 企业合併（M&A）
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十三章：企业概况

  • Broadcom Inc.
  • Qualcomm Incorporated
  • NVIDIA Corporation
  • Intel Corporation
  • Advanced Micro Devices（AMD）
  • Samsung Electronics
  • MediaTek Inc.
  • Marvell Technology Group
  • Xilinx（AMD）
  • Lattice Semiconductor
  • NXP Semiconductors
  • STMicroelectronics
  • Renesas Electronics
  • Infineon Technologies
  • Analog Devices
  • ON Semiconductor
  • Microchip Technology
  • Texas Instruments
  • Taiwan Semiconductor Manufacturing Company
Product Code: SMRC32095

According to Stratistics MRC, the Global Application-Specific Integrated Circuits Market is accounted for $18.6 billion in 2025 and is expected to reach $28.2 billion by 2032 growing at a CAGR of 6.1% during the forecast period. Application-Specific Integrated Circuits (ASICs) are custom-designed semiconductor chips tailored for a specific function or application, offering optimized performance, power efficiency, and compact form factor. Unlike general-purpose processors, ASICs are engineered to execute predefined tasks with high precision and speed, making them ideal for industries such as telecommunications, automotive, and consumer electronics. Their fixed architecture enhances reliability and throughput, though it limits flexibility. ASICs are commonly used in high-volume production environments where specialized functionality is critical.

Market Dynamics:

Driver:

Rising demand for energy-efficient and high-performance chips

As industries transition toward smart infrastructure and IoT ecosystems, the need for customized, low-latency silicon solutions is intensifying. These chips are engineered to deliver optimized performance for specific tasks, reducing power consumption while enhancing processing speed. Moreover, ASICs are increasingly preferred in data centers and AI workloads due to their ability to outperform general-purpose processors in targeted applications. This trend is expected to sustain long-term demand for high-performance, application-specific designs.

Restraint:

Design complexity and verification challenges

Unlike general-purpose chips, ASICs require precise architectural planning tailored to specific functions, which increases the risk of design flaws and delays. Verification tools must simulate a wide range of scenarios to ensure reliability, adding to development time and cost. Additionally, the lack of standardized design frameworks across industries complicates integration and scalability. These challenges are further amplified by the need to meet stringent performance benchmarks and regulatory compliance, which can deter smaller players from entering the market.

Opportunity:

Emerging applications in quantum computing, edge AI, and neuromorphic chips

In quantum computing, ASICs are being explored to manage control systems and error correction protocols with minimal latency. Edge AI applications, such as autonomous vehicles and smart surveillance, demand real-time processing with low power footprints-an ideal use case for ASICs. Furthermore, neuromorphic computing, which mimics brain-like architectures, relies on custom silicon to replicate synaptic behavior efficiently. These emerging domains are fostering demand for highly specialized chips, encouraging R&D investments and strategic collaborations across academia and industry.

Threat:

Geopolitical tensions and export restrictions

Trade restrictions, export controls, and diplomatic conflicts particularly between major chip-producing nations can hinder access to critical fabrication technologies and raw materials. Such constraints not only delay production timelines but also inflate costs, affecting profitability. Additionally, regulatory scrutiny over intellectual property and national security concerns may limit cross-border partnerships and technology transfers. These risks are prompting companies to reassess sourcing strategies and invest in regional manufacturing capabilities to mitigate exposure.

Covid-19 Impact:

The COVID-19 pandemic disrupted semiconductor supply chains, leading to chip shortages and delayed product launches across multiple industries. However, the crisis also accelerated digital transformation, boosting demand for ASICs in remote communication, healthcare diagnostics, and cloud computing. Lockdowns and remote work environments intensified reliance on data centers and smart devices, where ASICs play a pivotal role in optimizing performance. While initial production bottlenecks affected revenue streams, the long-term outlook improved as companies prioritized resilient design strategies and diversified supplier networks.

The programmable ASIC segment is expected to be the largest during the forecast period

The programmable ASIC segment is expected to account for the largest market share during the forecast period propelled by, their flexibility and cost-effectiveness in prototyping and mid-volume production. Their adaptability makes them suitable for evolving applications in consumer electronics, industrial automation, and wireless communication. As demand for configurable hardware grows, especially in edge computing and embedded systems, programmable ASICs are emerging as the preferred choice for manufacturers seeking balance between performance and scalability.

The hardware-software co-design segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the hardware-software co-design segment is predicted to witness the highest growth rate, influenced by, enhanced system-level performance, reduces debugging cycles, and accelerates deployment in complex applications such as AI inference engines and autonomous systems. The rising complexity of integrated systems is driving adoption of co-design frameworks, supported by advanced simulation tools and collaborative development platforms. As industries seek to shorten innovation cycles and improve functional efficiency, this segment is poised for rapid expansion.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, driven by robust semiconductor manufacturing infrastructure and high-volume electronics production. Countries like China, South Korea, Taiwan, and Japan are home to leading foundries and design houses, enabling cost-effective fabrication and innovation. The region's strong presence in consumer electronics, automotive, and telecom sectors further amplifies demand for customized chips. Government initiatives supporting digital transformation and industrial automation are also contributing to market growth, positioning Asia Pacific as the global hub for ASIC deployment.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, attributed to, expanding R&D investments and increasing adoption of advanced technologies. Emerging economies such as India and Vietnam are witnessing a surge in demand for smart devices, IoT solutions, and AI-powered platforms, all of which rely on ASICs for efficient processing. Strategic partnerships between local firms and global semiconductor leaders are fostering innovation and capacity building.

Key players in the market

Some of the key players in Application-Specific Integrated Circuits Market include Broadcom Inc., Qualcomm Incorporated, NVIDIA Corporation, Intel Corporation, Advanced Micro Devices (AMD), Samsung Electronics, MediaTek Inc., Marvell Technology Group, Xilinx (AMD), Lattice Semiconductor, NXP Semiconductors, STMicroelectronics, Renesas Electronics, Infineon Technologies, Analog Devices, ON Semiconductor, Microchip Technology, Texas Instruments, and Taiwan Semiconductor Manufacturing Company.

Key Developments:

In October 2025, Qualcomm unveiled its AI200 and AI250 chips to compete with AMD and NVIDIA in server-grade AI workloads. These chips support liquid-cooled rack-scale systems for enterprise AI.

In October 2025, Intel unveiled Panther Lake, its first AI PC platform built on 18A process, targeting hybrid AI workloads. This marks a leap in consumer AI computing.

In January 2025, Qualcomm partnered with Samsung to launch the Galaxy S25 series powered by Snapdragon 8 Elite, optimized for Gemini AI experiences. This marks a strategic alignment in mobile AI performance.

Types Covered:

  • Full Custom ASIC
  • Semi-Custom ASIC
  • Programmable ASIC
  • Gate Array-Based ASIC
  • Standard Cell-Based ASIC
  • Other Types

Design Methodologies Covered:

  • RTL-to-GDSII Flow
  • IP-Centric Design
  • Platform-Based Design
  • Hardware-Software Co-Design
  • Design for Testability (DFT)
  • Design for Yield and Manufacturability

Technology Nodes Covered:

  • Advanced Nodes (<=7nm)
  • Leading Nodes (8-14nm)
  • Mature Nodes (16-28nm)
  • Legacy Nodes (28-65nm)
  • Older Nodes (>65nm)

Packaging & Tests Covered:

  • Traditional Wire-Bond Packaging
  • Advanced Packaging (2.5D, 3D-IC, SiP)
  • Flip-Chip & BGA
  • Test Services (Wafer Probe, Final Test)
  • Burn-in & Reliability Testing
  • Other Packaging & Tests

Business Models Covered:

  • Fabless ASIC Companies
  • Integrated Device Manufacturers (IDMs)
  • Foundry Services / Custom Manufactures
  • Turnkey Design & IP Licensing Models
  • Design Services & ASIC-as-a-Service
  • Other Business Models

End Users Covered:

  • Telecom & Networking
  • Data Center & Cloud Infrastructure
  • Consumer Electronics
  • Automotive
  • Industrial Automation & IoT
  • Medical Devices & Healthcare
  • Aerospace & Defense
  • Security & Surveillance
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 End User Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Application-Specific Integrated Circuits Market, By Type

  • 5.1 Introduction
  • 5.2 Full Custom ASIC
  • 5.3 Semi-Custom ASIC
  • 5.4 Programmable ASIC
  • 5.5 Gate Array-Based ASIC
  • 5.6 Standard Cell-Based ASIC
  • 5.7 Other Types

6 Global Application-Specific Integrated Circuits Market, By Design Methodology

  • 6.1 Introduction
  • 6.2 RTL-to-GDSII Flow
  • 6.3 IP-Centric Design
  • 6.4 Platform-Based Design
  • 6.5 Hardware-Software Co-Design
  • 6.6 Design for Testability (DFT)
  • 6.7 Design for Yield and Manufacturability

7 Global Application-Specific Integrated Circuits Market, By Technology Node

  • 7.1 Introduction
  • 7.2 Advanced Nodes (<=7nm)
  • 7.3 Leading Nodes (8-14nm)
  • 7.4 Mature Nodes (16-28nm)
  • 7.5 Legacy Nodes (28-65nm)
  • 7.6 Older Nodes (>65nm)

8 Global Application-Specific Integrated Circuits Market, By Packaging & Test

  • 8.1 Introduction
  • 8.2 Traditional Wire-Bond Packaging
  • 8.3 Advanced Packaging (2.5D, 3D-IC, SiP)
  • 8.4 Flip-Chip & BGA
  • 8.5 Test Services (Wafer Probe, Final Test)
  • 8.6 Burn-in & Reliability Testing
  • 8.7 Other Packaging & Tests

9 Global Application-Specific Integrated Circuits Market, By Business Model

  • 9.1 Introduction
  • 9.2 Fabless ASIC Companies
  • 9.3 Integrated Device Manufacturers (IDMs)
  • 9.4 Foundry Services / Custom Manufactures
  • 9.5 Turnkey Design & IP Licensing Models
  • 9.6 Design Services & ASIC-as-a-Service
  • 9.7 Other Business Models

10 Global Application-Specific Integrated Circuits Market, By End User

  • 10.1 Introduction
  • 10.2 Telecom & Networking
  • 10.3 Data Center & Cloud Infrastructure
  • 10.4 Consumer Electronics
  • 10.5 Automotive
  • 10.6 Industrial Automation & IoT
  • 10.7 Medical Devices & Healthcare
  • 10.8 Aerospace & Defense
  • 10.9 Security & Surveillance
  • 10.10 Other End Users

11 Global Application-Specific Integrated Circuits Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Broadcom Inc.
  • 13.2 Qualcomm Incorporated
  • 13.3 NVIDIA Corporation
  • 13.4 Intel Corporation
  • 13.5 Advanced Micro Devices (AMD)
  • 13.6 Samsung Electronics
  • 13.7 MediaTek Inc.
  • 13.8 Marvell Technology Group
  • 13.9 Xilinx (AMD)
  • 13.10 Lattice Semiconductor
  • 13.11 NXP Semiconductors
  • 13.12 STMicroelectronics
  • 13.13 Renesas Electronics
  • 13.14 Infineon Technologies
  • 13.15 Analog Devices
  • 13.16 ON Semiconductor
  • 13.17 Microchip Technology
  • 13.18 Texas Instruments
  • 13.19 Taiwan Semiconductor Manufacturing Company

List of Tables

  • Table 1 Global Application-Specific Integrated Circuits Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Application-Specific Integrated Circuits Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global Application-Specific Integrated Circuits Market Outlook, By Full Custom ASIC (2024-2032) ($MN)
  • Table 4 Global Application-Specific Integrated Circuits Market Outlook, By Semi-Custom ASIC (2024-2032) ($MN)
  • Table 5 Global Application-Specific Integrated Circuits Market Outlook, By Programmable ASIC (2024-2032) ($MN)
  • Table 6 Global Application-Specific Integrated Circuits Market Outlook, By Gate Array-Based ASIC (2024-2032) ($MN)
  • Table 7 Global Application-Specific Integrated Circuits Market Outlook, By Standard Cell-Based ASIC (2024-2032) ($MN)
  • Table 8 Global Application-Specific Integrated Circuits Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 9 Global Application-Specific Integrated Circuits Market Outlook, By Design Methodology (2024-2032) ($MN)
  • Table 10 Global Application-Specific Integrated Circuits Market Outlook, By RTL-to-GDSII Flow (2024-2032) ($MN)
  • Table 11 Global Application-Specific Integrated Circuits Market Outlook, By IP-Centric Design (2024-2032) ($MN)
  • Table 12 Global Application-Specific Integrated Circuits Market Outlook, By Platform-Based Design (2024-2032) ($MN)
  • Table 13 Global Application-Specific Integrated Circuits Market Outlook, By Hardware-Software Co-Design (2024-2032) ($MN)
  • Table 14 Global Application-Specific Integrated Circuits Market Outlook, By Design for Testability (DFT) (2024-2032) ($MN)
  • Table 15 Global Application-Specific Integrated Circuits Market Outlook, By Design for Yield and Manufacturability (2024-2032) ($MN)
  • Table 16 Global Application-Specific Integrated Circuits Market Outlook, By Technology Node (2024-2032) ($MN)
  • Table 17 Global Application-Specific Integrated Circuits Market Outlook, By Advanced Nodes (<=7nm) (2024-2032) ($MN)
  • Table 18 Global Application-Specific Integrated Circuits Market Outlook, By Leading Nodes (8-14nm) (2024-2032) ($MN)
  • Table 19 Global Application-Specific Integrated Circuits Market Outlook, By Mature Nodes (16-28nm) (2024-2032) ($MN)
  • Table 20 Global Application-Specific Integrated Circuits Market Outlook, By Legacy Nodes (28-65nm) (2024-2032) ($MN)
  • Table 21 Global Application-Specific Integrated Circuits Market Outlook, By Older Nodes (>65nm) (2024-2032) ($MN)
  • Table 22 Global Application-Specific Integrated Circuits Market Outlook, By Packaging & Test (2024-2032) ($MN)
  • Table 23 Global Application-Specific Integrated Circuits Market Outlook, By Traditional Wire-Bond Packaging (2024-2032) ($MN)
  • Table 24 Global Application-Specific Integrated Circuits Market Outlook, By Advanced Packaging (2.5D, 3D-IC, SiP) (2024-2032) ($MN)
  • Table 25 Global Application-Specific Integrated Circuits Market Outlook, By Flip-Chip & BGA (2024-2032) ($MN)
  • Table 26 Global Application-Specific Integrated Circuits Market Outlook, By Test Services (Wafer Probe, Final Test) (2024-2032) ($MN)
  • Table 27 Global Application-Specific Integrated Circuits Market Outlook, By Burn-in & Reliability Testing (2024-2032) ($MN)
  • Table 28 Global Application-Specific Integrated Circuits Market Outlook, By Other Packaging & Tests (2024-2032) ($MN)
  • Table 29 Global Application-Specific Integrated Circuits Market Outlook, By Business Model (2024-2032) ($MN)
  • Table 30 Global Application-Specific Integrated Circuits Market Outlook, By Fabless ASIC Companies (2024-2032) ($MN)
  • Table 31 Global Application-Specific Integrated Circuits Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
  • Table 32 Global Application-Specific Integrated Circuits Market Outlook, By Foundry Services / Custom Manufactures (2024-2032) ($MN)
  • Table 33 Global Application-Specific Integrated Circuits Market Outlook, By Turnkey Design & IP Licensing Models (2024-2032) ($MN)
  • Table 34 Global Application-Specific Integrated Circuits Market Outlook, By Design Services & ASIC-as-a-Service (2024-2032) ($MN)
  • Table 35 Global Application-Specific Integrated Circuits Market Outlook, By Other Business Models (2024-2032) ($MN)
  • Table 36 Global Application-Specific Integrated Circuits Market Outlook, By End User (2024-2032) ($MN)
  • Table 37 Global Application-Specific Integrated Circuits Market Outlook, By Telecom & Networking (2024-2032) ($MN)
  • Table 38 Global Application-Specific Integrated Circuits Market Outlook, By Data Center & Cloud Infrastructure (2024-2032) ($MN)
  • Table 39 Global Application-Specific Integrated Circuits Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 40 Global Application-Specific Integrated Circuits Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 41 Global Application-Specific Integrated Circuits Market Outlook, By Industrial Automation & IoT (2024-2032) ($MN)
  • Table 42 Global Application-Specific Integrated Circuits Market Outlook, By Medical Devices & Healthcare (2024-2032) ($MN)
  • Table 43 Global Application-Specific Integrated Circuits Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 44 Global Application-Specific Integrated Circuits Market Outlook, By Security & Surveillance (2024-2032) ($MN)
  • Table 45 Global Application-Specific Integrated Circuits Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.