首页 > 市场调查报告书 > 电子零件/半导体

半导体生产设备

市场调查报告书

商品编码

1360039

全球积体电路市场 - 2023-2030

Global Integrated Circuits Market - 2023-2030

出版日期: 2023年10月11日 | 出版商:

DataM Intelligence | 英文 201 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

概述：

全球积体电路市场2022年达到4,743亿美元，预估至2030年将达1,1035亿美元，2023-2030年预测期间复合年增长率为12.6%。

半导体产业不断开发快速且有效率的积体电路。智慧型手机和其他消费性电子产品的采用一直是市场成长的主要动力。电子製造的全球化扩大了积体电路的应用范围，使其进入全球市场。

2020年，中国成为全球积体电路领域规模最大、成长最快的市场，市场规模达8,800亿元。五年计画期间，市场成长约20%，达到8,848亿元人民币，是全球扩张速度的4倍。进一步正在进行的研究和开发正在进行中，结果突破推动了市场。

在预测期内，北美约占全球积体电路市场的1/4，预计呈现健康成长。由于各行业对电子产品的需求不断增加，需要更先进和专业的积体电路。例如，2023 年 9 月 20 日，美国着名印刷电路板製造商和电子製造服务提供商 Amitron 公司推出了一个新的行业专栏，旨在推广美国製造技术。

动态：

晶圆厂产能不断增加，市场需求增加

由于智慧型手机、平板电脑、笔记型电脑、物联网设备、汽车电子等电子产品的需求不断增加，因此需要更高的IC产能。先进且专业的 IC 是 5G、人工智慧、机器学习和物联网等新兴技术所必需的，随着这些技术得到认可，晶圆厂需要开发能够支援这些应用的 IC。

根据 SemiFab 2023 年 9 月的报告，晶圆厂设备支出达到 995 亿美元，创下历史新高。到 2023 年，预计将年减 15%，至 840 亿美元，这一下降归因于晶片需求疲软以及消费者和行动装置库存增加。 2024 年晶圆厂设备支出的復苏预计将受到多种因素的推动。关键因素之一是2023年半导体库存调整结束。

对超低成本柔性积体电路的需求不断增长

物联网的显着成长得益于新兴产业和对低成本 IC 的需求增加，这些 IC 被整合到感测器、穿戴式装置和智慧型手机等各种设备中。超低成本柔性 IC 在生产方面具有成本优势，使其成为旨在降低成本的製造业的有吸引力的选择。

例如，2021年10月18日，柔性电子领域的领导者PragmatIC Semiconductor获得了8,000万美元的C轮融资。该投资将用于在英格兰东北部建立第二座 FlexLogIC 工厂，以满足万物互联 (IoE) 对超低成本柔性集成电路 (FlexIC) 不断增长的需求，这一倡议旨在加强英国的地位作为下一代半导体的领先设计者和製造商。

公司间的合作推动市场发展

全球政府、研究机构和半导体企业之间的合作鼓励创新并加速新技术的发展。标准对于半导体业务至关重要，因为它们确保相容性和互通性。这些标准的创建和采用需要协作。为了为最终用户提供全面的解决方案，半导体公司经常与软体开发商、设备製造商和其他生态系统合作伙伴合作。

例如，2023 年 9 月 19 日，本田马达宣布与台积电达成策略合作协议。此次合作旨在提升本田在电动车市场的地位并推进汽车半导体技术。本田将与顶级半导体代工厂台积电密切合作，打造专为电动车製造的专用晶片。该交易涉及製造积体电路。

设备的兼容性和过热情况

IC 的物理尺寸有限，随着电子设备变得更小、更紧凑，单晶片上可以整合的组件数量受到限制。 IC 在运作时会产生热量，高功率 IC 可能需要额外的冷却机制。功耗过高会限製便携式设备的电池寿命。 IC 可以包含数十亿个晶体管，单一晶片的设计和製造复杂程度有实际限制。极其复杂的 IC 生产起来可能很困难且昂贵。

设计和製造 IC 的过程需要对製造设施和设备进行大量投资，而这种成本可能会成为小型公司和新创公司的进入障碍。随着 IC 变得越来越强大，管理散热成为一项挑战。过热会导致性能下降和使用寿命缩短。数位 IC 擅长处理和储存二进位资料，但在类比讯号处理方面有其限制。音讯和射频 (RF) 电路等应用通常需要专用类比 IC。

The semiconductor industry constantly develops fast and efficient integrated circuits. The adoption of smartphones and other consumer electronics items has been a major driver for the growth of the market. Globalization of electronics manufacturing has expanded the reach of integrated circuits and makes them accessible in the market worldwide.

In 2020, China became world's largest and fastest growing market in the field of integrated circuit sector and has net worth of Yuan 880 billion. During its five year plan the market grows about 20% and reached up to Yuan 884.8 billion that is 4 times higher than global expansion rate. Further ongoing research and development is going and results breakouts which drives the market.

During the forecast period, with around 1/4th of the global integrated circuits market, North America is expected to show a healthy growth. More advanced and specialized integrated circuits are required due to the increasing demand for electronics from various industries. For instance, on 20 September 2023, Amitron Corporation, a prominent U.S. based manufacturer of printed circuit boards and provider of electronic manufacturing services, introduced a new industry column aimed at promoting American manufacturing technology.

Dynamics:

Rising Fab Capacities Increases the Market Demand

Higher IC production capacities are required because there is increasing demand for electronic products, including smartphones, tablets, laptops, IoT devices, automotive electronics and more. Advanced and specialized ICs are necessary for emerging technologies like 5G, AI, machine learning and the Internet of Things and there is a demand for fabs to develop ICs that can support these applications as these technologies gain acknowledgment.

According to the report by SemiFab in September 2023, fab equipment spending reached a record high of US$ 99.5 billion. in 2023, there is an expected decline of 15% year-over-year (YoY) to US$ 84 billion and this decline is attributed to softening chip demand and an elevated inventory of consumer and mobile devices. The recovery in fab equipment spending in 2024 is expected to be driven by several factors. One of the key factors is the end of the semiconductor inventory correction in 2023.

Growing Demand for Ultra-Low-Cost Flexible Integrated Circuits

The internet of Things witnessed significant growth is the rising industries and increased demand for low-cost ICs and which is integrated into various devices like sensors, wearable devices and smartphones. Ultra-low-cost flexible ICs leads to offer cost advantages which in terms for production for making them an attractive choice for manufacturing which aims to reduce expenses.

For instance, on 18 October 2021, PragmatIC Semiconductor, a leader in flexible electronics, has secured US$ 80 million in Series C funding. The investment will be used to establish a second FlexLogIC fab in the North East of England to meet the rising demand for ultra-low-cost flexible integrated circuits (FlexICs) for the Internet of Everything (IoE) and this initiative aims to strengthen UK's position as a leading designer and manufacturer of next-generation semiconductor.

Collaboration between Companies Boosts the Market

Collaboration between global governments, research institutions and semiconductor businesses encourage innovation and hastens the development of new technologies. Standards are essential to the semiconductor business because they ensure compatibility and interoperability. The creation and adoption of these standards requires collaboration. To provide comprehensive solutions for end users, semiconductor companies frequently work with software developers, device manufacturers and other ecosystem partners.

For instance, on 19 September 2023, Honda Motor Co. announced a strategic collaboration deal with Taiwan Semiconductor Manufacturing Co. The collaboration aims to boost Honda's position in the market for EVs and advance automotive semiconductor technologies. Honda will collaborate closely with TSMC, a top semiconductor foundry, to create specialized chips made just for EVs. The deal is for manufacturing the integrated circuits.

Compatibility and Overheating of the Device

ICs have a finite physical size and as electronic devices become smaller and more compact, there are constraints on how many components can be integrated onto a single chip. ICs generate heat when in operation and high-power ICs may require additional cooling mechanisms. Excessive power consumption can limit battery life in portable devices. ICs can contain billions of transistors, there is a practical limit to how complex an individual chip can be designed and manufactured. Extremely complex ICs may be difficult and expensive to produce.

The process of designing and manufacturing ICs requires significant investment in fabrication facilities and equipment and this cost can be a barrier to entry for smaller companies and startups. As ICs become more powerful, managing heat dissipation becomes a challenge. Overheating can lead to reduced performance and decreased lifespan. Digital ICs excel at processing and storing binary data, they have limitations in analog signal processing. Specialized analog ICs are often required for applications like audio and radio frequency (RF) circuits.

Segment Analysis:

The global integrated circuits market is segmented based on type, product, application, end-user and region.

Adoption of Digital IC Increases the Growth of the Market

During the forecast period 2023-2030, digital ICs are estimated to account for about 1/3rd of the global integrated circuits market. Digital ICs are integral to emerging technologies such as quantum computing, edge computing and neuromorphic computing and these technologies open new avenues for digital IC innovation and growth. Collaborating with partners in different regions or industries can help digital IC manufacturers expand their market reach. Joint ventures or partnerships can open doors to new customer segments and applications.

More compact, energy-efficient and potent digital ICs may now be produced because of continuous advances in semiconductor manufacturing methods, including lower nodes. For instance, in December 2021, Taiwan Semiconductor Manufacturing Company declared a collaboration with Sony in December 2021, with the two companies investing US$ 7 billion to develop a chip manufacturing facility in Japan. The advancements will raise Digital IC production and market growth.

Geographical Penetration:

Rising Consumption of Semiconductors in Asia-Pacific

Asia-Pacific is the fastest as well as dominant region in the global integrated circuits market covering more than 1/3rd of the market. Due to the ongoing movement of diversified electronic equipment to China, the consumption of semiconductor parts in China, South Korea and Japan is fast expanding in comparison to other nations.

Furthermore, the largest sector of China's Integrated Circuits industry, IC design, has evolved from a focus on low-margin consumer applications to include advanced communication and computing semiconductors across growth markets such as automotive, the Internet of Things (IoT), crypto mining and artificial intelligence (AI).

For example, in August 2021, SiEn (Qingdao) Integrated Circuits Co, a foundry, began production of 8-inch silicon wafers and tested a new 12-inch production line in Qingdao. Furthermore, Semiconductor Manufacturing International Corp (SMIC) announced a US$ 8.87 billion investment in the construction of a chip manufacturing plant in Shanghai in September 2021. The company's strategy has been centered on integrated circuit foundry and technology services at process nodes of 28 nanometers and above.

Competitive Landscape

The major global players in the market include: Samsung, Intel Corporation, Qualcomm Technologies, Inc., Texas Instruments, SK Hynix, NVIDIA, Avago Technologies, Micron Technology, Inc., AMI Semiconductor and Toshiba Electronic Devices & Storage Corporation.

COVID-19 Impact Analysis

The IC industry which heavily relies on global supply chains for raw materials, equipment and manufacturing. Many IC manufacturers faced challenges in sourcing materials and components, causing delays in chip manufacturing. To curb the spread of the virus, many semiconductor manufacturing facilities had to shut down or operate at reduced capacity.

The pandemic also led to increased demand for certain types of ICs. With the shift to remote work and online activities, there was a surge in demand for laptops, tablets and other devices, driving the need for ICs used in these products. As there was a decrease in demand for ICs used in industries hit hardest by the pandemic, such as automotive. As car manufacturing slowed down, the demand for automotive ICs decreased.

The pandemic disrupted the workforce, leading to labor shortages in some semiconductor manufacturing plants and this further impacted production capacity. The pandemic accelerated the digital transformation in various industries, including healthcare, e-commerce and remote work and this led to increased demand for ICs used in data centers, networking equipment and telemedicine devices.

AI Impact

AI algorithms, particularly machine learning and neural networks, are being used to optimize the design of ICs. AI can explore a vast design space to find configurations that meet specific performance and power requirements. Electronic Design Automation (EDA) tools are incorporating AI to enhance their capabilities. AI-driven EDA tools can automate many aspects of the design process, speeding up chip development.

AI is helping design ICs that are more power-efficient and this is critical for mobile devices and IoT applications where battery life is a concern. AI is used for fault detection and quality control during IC manufacturing. It can identify defects in chips more accurately and quickly than manual inspection. AI-driven testing methods can quickly validate IC designs, ensuring that they meet specifications and are free from defects.

For instance, on 21 September 2023, Intel's Innovation 2023 focused on accelerating the convergence of AI and security. Intel adapts to use AI to enhance security in various fields. Massive volumes of data may be analyzed in real-time by AI algorithms, making it possible to more quickly identify and address security issues. Intel also plans to develop specific integrated circuits which will lead to a reduction of millions of software.

Russia- Ukraine War Impact

Ukraine is home to several semiconductor and electronic component manufacturers. The war could disrupt the supply of critical components and materials needed for IC production and this includes items like rare earth minerals, which are essential for manufacturing semiconductors. The conflict may force semiconductor manufacturing plants in Ukraine to suspend operations or operate at reduced capacity due to safety concerns and infrastructure damage, this can disrupt the global supply chain.

Disruptions in the supply chain which leads to shortages of ICs and related electronic components and this can affect various industries, including consumer electronics, automotive and telecommunications, which rely heavily on ICs. Shortages and supply chain disruptions often lead to price volatility. Prices of certain ICs may increase due to high demand and limited supply affecting production costs for various products.

By Type

Digital IC
Analog IC
Mixed-Signal IC

By Product

General-Purpose IC
Application-Specific IC

By Application

Standard Computers
Cell Phones
Tablets
Set Top Box
Gaming Consoles

By End-User

Consumer Electronics
Automotive
IT & Telecommunications
Manufacturing and Automation
Others

By Region

North America
- U.S.
- Canada
- Mexico

Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe

South America
- Brazil
- Argentina
- Rest of South America

Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific

Middle East and Africa

Key Developments

In August 2023, Analog Devices completed its acquisition of Maxim Integrated Products, Inc and this acquisition strengthened ADI's position as a high-performance analog semiconductor company, with pro forma trailing twelve-month revenue of over US$ 9 billion, leading margins and significant free cash flow.
In March 2022, Micross Components, Inc. announced an exclusive partnership with Apogee Semiconductor, a leader in Radiation-Hardened-by-Design semiconductors, using the patented TalRad (Transistor-Adjusted-Layout for Radiation) process. In this partnership, Micross becomes the global supplier of die and packaged devices utilizing Apogee Semiconductor technology.
In March 2022, Toshiba expanded its lineup of stepping motor driver ICs with the release of the "TB67S549FTG," a small-package stepping motor driver IC with built-in constant-current control that doesn't require external circuit components and this driver is suitable for industrial equipment such as office automation and financial equipment and helps save space on circuit boards.

Why Purchase the Report?

To visualize the global integrated circuits market segmentation based on type, product, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of integrated circuits market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global integrated circuits market report would provide approximately 69 tables, 70 figures and 201 pages.

Target Audience 2023

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet by Type
3.2. Snippet by Product
3.3. Snippet by Application
3.4. Snippet by End-User
3.5. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Rising Fab Capacities Increases the Market Demand
  - 4.1.1.2. Growing Demand for Ultra-Low-Cost Flexible Integrated Circuits
  - 4.1.1.3. Collaboration between Companies Boosts the Market
- 4.1.2. Restraints
  - 4.1.2.1. Compatibility and Overheating of the Device
- 4.1.3. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Russia-Ukraine War Impact Analysis
5.6. DMI Opinion

6. COVID-19 Analysis

6.1. Analysis of COVID-19
- 6.1.1. Scenario Before COVID
- 6.1.2. Scenario During COVID
- 6.1.3. Scenario Post COVID
6.2. Pricing Dynamics Amid COVID-19
6.3. Demand-Supply Spectrum
6.4. Government Initiatives Related to the Market During Pandemic
6.5. Manufacturers Strategic Initiatives
6.6. Conclusion

7. By Type

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2. Market Attractiveness Index, By Type
7.2. Digital IC*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Analog IC
7.4. Mixed-Signal IC

8. By Product

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 8.1.2. Market Attractiveness Index, By Product
8.2. General-Purpose IC*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Application-Specific IC

9. By Application

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2. Market Attractiveness Index, By Application
9.2. Standard Computers*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Cell Phones
9.4. Tablets
9.5. Set Top Box
9.6. Gaming Consoles

10. By End-User

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2. Market Attractiveness Index, By End-User
10.2. Consumer Electronics*
- 10.2.1. Introduction
- 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3. Automotive
10.4. IT & Telecommunications
10.5. Manufacturing and Automation
10.6. Others

11. By Region

11.1. Introduction
- 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2. Market Attractiveness Index, By Region
11.2. North America
- 11.2.1. Introduction
- 11.2.2. Key Region-Specific Dynamics
- 11.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1. U.S.
  - 11.2.7.2. Canada
  - 11.2.7.3. Mexico
  - 11.2.7.4. Europe
- 11.2.8. Introduction
- 11.2.9. Key Region-Specific Dynamics
- 11.2.10. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.2.11. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.2.12. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.13. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.14. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.14.1. Germany
  - 11.2.14.2. UK
  - 11.2.14.3. France
  - 11.2.14.4. Italy
  - 11.2.14.5. Russia
  - 11.2.14.6. Rest of Europe
11.3. South America
- 11.3.1. Introduction
- 11.3.2. Key Region-Specific Dynamics
- 11.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1. Brazil
  - 11.3.7.2. Argentina
  - 11.3.7.3. Rest of South America
11.4. Asia-Pacific
- 11.4.1. Introduction
- 11.4.2. Key Region-Specific Dynamics
- 11.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1. China
  - 11.4.7.2. India
  - 11.4.7.3. Japan
  - 11.4.7.4. Australia
  - 11.4.7.5. Rest of Asia-Pacific
11.5. Middle East and Africa
- 11.5.1. Introduction
- 11.5.2. Key Region-Specific Dynamics
- 11.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 11.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 11.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12. Competitive Landscape

12.1. Competitive Scenario
12.2. Market Positioning/Share Analysis
12.3. Mergers and Acquisitions Analysis

13. Company Profiles

13.1. Samsung*
- 13.1.1. Company Overview
- 13.1.2. Product Portfolio and Description
- 13.1.3. Financial Overview
- 13.1.4. Key Developments
13.2. Intel Corporation
13.3. Qualcomm Technologies, Inc.
13.4. Texas Instruments
13.5. SK Hynix
13.6. NVIDIA
13.7. Avago Technologies
13.8. Micron Technology, Inc.
13.9. AMI Semiconductor
13.10. Toshiba Electronic Devices & Storage Corporation

LIST NOT EXHAUSTIVE

14. Appendix

14.1. About Us and Services
14.2. Contact Us

02-2729-4219

+886-2-2729-4219

License/价格