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全球微积体电路市场 - 2023-2030

Global Micro Integrated Circuits Market - 2023-2030

出版日期: 2023年10月11日 | 出版商:

DataM Intelligence | 英文 203 Pages | 商品交期: 最快1-2个工作天内

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简介目录

概述：

全球微积体电路市场2022年达到789亿美元，预计2030年将达到876亿美元，2023-2030年预测期间复合年增长率为6.5%。

微型 IC 设计得更小、更紧凑，同时整合了日益复杂的功能。随着技术的发展，製造商将更多的电晶体和组件整合到单一晶片上，从而提高了电子设备的性能。智慧型手机、平板电脑、穿戴式科技和智慧家电等消费性电子产品的普及推动了对微型 IC 的需求。

例如，2023 年8 月7 日，位于阿尔伯克基的桑迪亚国家实验室开发了一种新型硅集成微型雷射器，在各个领域提供了有前景的应用，并且当该微型雷射器与其他微型光学元件结合使用时，使其成为一种新型的硅整合微型雷射。对于自动驾驶汽车、资料中心、生化感测器和国防技术都很有价值。

预计到2022年，北美将占据全球约1/4的市场。领先的半导体企业和学术机构都在北美。 IC 设计、製造技术和材料的不断改进推动了更多专利和有效微型 IC 的创造。智慧型手机、平板电脑、游戏机和智慧家居设备等消费性电子产品的需求量大。所有这些产品都必须具有微型 IC，它们的不断发展会刺激成长。

动态：

5G 网路需求不断成长

微型 IC 的特点是尺寸小、设计紧凑。由于 5G 基础设施需要由小型基地台和天线组成的密集网络，因此包括 IC 在内的组件的小型化对于适应这些紧凑的安装至关重要。 5G 网路需要更高的电源效率，以确保小型基地台和设备能够有效运作。微型 IC 旨在最大限度地降低功耗并维持高效能应用。

例如，2023 年 2 月 23 日，AMD 将策略重点放在 5G 技术和电信领域投资，旨在扩大其在资料中心和网路市场的影响力。该公司认识到这些领域对高效能运算和连接的需求不断增长。随着 5G 网路的不断发展，通讯服务供应商正在寻求对其平台进行现代化改造，并利用 5G 服务带来的机会。

不断增加的协作和伙伴关係增加了需求

合作通常涉及结合专业知识和资源来开发尖端的微型 IC。合作伙伴关係可以获得互补的技术和知识，促进创新。协作努力可以分担开发成本，减轻各个公司的财务负担，从而鼓励更广泛的微型积体电路研究和开发。合作伙伴关係可以帮助公司进入新市场或扩大在现有市场的影响力。进入合作伙伴的分销管道和客户群可以加速市场渗透。

例如，2023 年 6 月 24 日，印美科技合作涵盖微晶片、太空和人工智慧等各个关键领域。这种伙伴关係的重要性显而易见，因为它在联合声明中占据优先地位，强调其重要性高于国防、太空、地缘政治、贸易和经济等其他方面。为了发展晶片设计和製造能力，莫迪总理签署了半导体供应链谅解备忘录。

技术进步

随着技术的发展，製造更小、更紧凑的积体电路变得更加容易，从而能够创造出更强大、更节能的小工具。更高处理能力的 IC 是透过微架构和製造技术的改进来生产的，这对于人工智慧、资料分析和复杂计算等应用至关重要。随着 IC 变得更加节能，行动装置电池的使用寿命更长，各种应用所需的电量也更少。

例如，2023 年 6 月 24 日，美光科技宣布其目标是在印度古吉拉特邦建造一个新的组装和测试设施中心。因为该中心旨在满足国内和国际市场的需求。美光还计划扩大其全球製造部门，为全球的基础客户提供服务，这项策略将满足整个市场的记忆体储存需求。

过热和渠道攻击阻碍了市场的成长

虽然小型化是一个优势，但它也带来了挑战。随着 IC 变得越来越小且更容易出现製造错误，紧凑区域中产生的热量可能越来越难以消散。为了有效散发高性能 IC 产生的热量并防止过热，经常需要散热器和风扇等额外部件。先进 IC 的製造过程非常复杂且昂贵，涉及众多错综复杂的步骤，这种复杂性可能会导致生产延迟和成本增加。

IC 可能容易受到难以侦测和缓解的硬体级攻击，包括旁道攻击和硬体木马。积体电路的製造涉及危险化学品和材料的使用，导致环境问题。自然灾害或地缘政治问题等全球事件可能会扰乱积体电路的供应链，导致短缺和价格上涨。

Micro ICs are designed to be smaller and more compact while integrating increasingly complex functionality. As developments in technology manufacturers incorporate more transistors and components onto a single chip which leads to improved performance of electronic devices. The need for micro ICs is driven by the rise in popularity of consumer electronics including smartphones, tablets, wearable technology and smart appliances.

For instance, on 7 August 2023, Sandia National Laboratories, based in Albuquerque, developed a novel silicon-integrated micro-laser that offers promising applications in various fields and this micro-laser when combined with other micro-scale optical devices, which makes it valuable for self-driving cars, data centers, biochemical sensors and defense technologies.

North America is expected to hold about 1/4th of the global market in 2022. Leading semiconductor businesses and academic institutions are all discovered in North America. The creation of more patent and effective micro ICs is driven by ongoing improvements in IC design, fabrication techniques and materials. Consumer electronics, such as smartphones, tablets, gaming consoles and smart home devices are in high demand. All of these products must have micro ICs and their ongoing evolution stimulates growth.

Dynamics:

Rising Demand for 5G Networks

Micro ICs are characterized by their small size and compact design. As 5G infrastructure requires a dense network of small cells and antennas, the miniaturization of components including ICs, is essential to fit within these compact installations. 5G networks demand higher power efficiency to ensure that small cells and devices can operate effectively. Micro ICs are designed to minimize power consumption and for maintaining high-performance applications.

For instance, on 23 February 2023, AMD's strategic focus on 5G technology and investments in the telecommunications sector are aimed at expanding its presence in the data center and networking markets. The company recognizes the increasing demand for high-performance computing and connectivity in these sectors. As 5G networks continue to evolve, communication service providers are seeking to modernize their platforms and leverage the opportunities presented by 5G services.

Rising Collaboration and Partnerships Increase Demand

Collaborations often involve combining expertise and resources to develop cutting-edge micro ICs. Partnerships allow access to complementary technologies and knowledge, fostering innovation Collaborative efforts enable the sharing of development costs, reducing the financial burden on individual companies and this encourages more extensive research and development in micro ICs. Partnerships can help companies enter new markets or expand their presence in existing ones. Access to a partner's distribution channels and customer base can accelerate market penetration.

For instance, on 24 June 2023, India-US tech partnership encompasses various crucial areas such as micro-chips, space and AI. The significance of this partnership is evident as it takes precedence in the joint statement, highlighting its importance above other aspects like defense, space, geopolitics, trade and the economy. For the development in the design of chips and fabrication capabilities Prime Minister Narender Modi signed MoU for the supply chain of the semiconductors.

Advancement in Technology

As there is development in technology, it becomes easier to make smaller and compact integrated circuits, which enables the creation of more potent, energy-saving gadgets. Higher processing power ICs are produced via improvements in microarchitecture and manufacturing techniques, which is essential for applications like artificial intelligence, data analytics and sophisticated computations. As ICs become more energy-efficient, mobile device batteries last longer and varied applications need less power.

For instance, on 24 June 2023, Micron Technology announced its objectives to construct a new assembly and test facility center in Gujarat, India. As this center aims to handle both domestic and international market demands. Micron also aims to expand its global manufacturing units to serve there base customers worldwide and this strategy leads to meet with memory storage across the market.

Overheating and Channel Attacks Hinder the Growth of the Market

While miniaturization is an advantage, it also poses challenges. The heat generated in a compact area may be increasingly difficult to dissipate as ICs get smaller and more prone to manufacturing errors. In order to effectively disperse the heat that high-performance ICs produce and prevent overheating extra parts like heat sinks and fans are frequently needed. The manufacturing process for advanced ICs is highly complex and expensive involving numerous intricate steps and this complexity can result in production delays and increased costs.

ICs may be susceptible to difficult-to-detect and-mitigate hardware-level attacks including side-channel attacks and hardware Trojans. The manufacturing of ICs involves the use of hazardous chemicals and materials, contributing to environmental concerns. Global events, such as natural disasters or geopolitical issues, can disrupt the supply chain for ICs, leading to shortages and increased prices.

Segment Analysis:

The global micro integrated circuits market is segmented based on type, application, end-user and region.

Growing Innovative Solutions in Analog Integrated Circuits

In 2022, analog ICs are expected to be the dominant segment in the global market covering around 1/3rd of the market. The ongoing trend of miniaturization enables the development of smaller, more power-efficient and higher-performance analog ICs and this appeals to various industries where space constraints are a concern. The proliferation of smartphones, wearable devices, IoT gadgets and other portable electronics drives the demand for analog.

For instance, on 7 June 2023, X-FAB Silicon Foundries SE, a leading analog/mixed-signal and MEMS foundry group, announced ambitious revenue and margin targets to achieve by 2026. By setting the objective of generating US$ 1.5 billion in sales by 2026, X-FAB demonstrates both its ambitious growth aspirations and dedication to growing its market share.

For different usage of microintegrated circuit, which include automotive, industrial, consumer electronics, medical devices and more, X-FAB specializes in producing silicon wafers. The company is known for its high-quality standards and innovative solutions in analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems.

Geographical Penetration:

Development in the Semiconductor Industries in Asia-Pacific

In 2022, Asia-Pacific is expected to be the dominant region in the global micro integrated circuits market covering more than 1/3rd of the market. Asia-Pacific countires, i.e., China, South Korea, Japan and Taiwan, have made the way in technological developments in the semiconductor industry, including the creation of advanced micro ICs for use various industries. The demand for micro ICs utilized in the fabrication of these gadgets has increased as a result of these countries having significant consumer electronics manufacturing hubs.

According to latest official data by ETV Bharat in 2023, there is increment in import of semiconductor in recent years. The value of the nation's imports of monolithic integrated circuits or microchips climbed from INR 37,354 crore in FY 2020-21 to more than 60,000 crore the next year and more than 82,000 crore in FY 2022-23. At the same time micro-chips rise from INR 14,484 to INR 31,000 crores.

Competitive Landscape

The major global players in the market include: Samsung, Qualcomm Technologies, Intel Corporation, Texas Instruments, Toshiba, NVIDIA Corporation, SK Hynix, Micron Technology, Fujitsu and Avago Technologies.

COVID-19 Impact Analysis:

The pandemic disrupted global supply chains, causing shortages of critical components and materials needed for IC manufacturing and this led to delays in production and increased costs. Many semiconductor manufacturing facilities temporarily shut down or reduced production capacity to comply with lockdowns and social distancing measures, this affected the supply of ICs, especially in industries with high demand, such as consumer electronics and healthcare.

The pandemic drove increased demand for certain ICs. For example, the shift to remote work and online activities led to higher demand for laptops, tablets and networking equipment, which rely on microchips. The pandemic disrupted the workforce in semiconductor manufacturing. Some employees fell ill, while others faced restrictions on travel and work and this impacted the ability to maintain and operate manufacturing facilities.

Research and development activities related to new microchip technologies and processes were delayed due to the pandemic. Collaborative research and innovation efforts also faced challenges. The pandemic accelerated the adoption of remote work and collaboration tools within the semiconductor industry. Engineers and designers needed to collaborate virtually on IC design, which presented both challenges and opportunities.

AI Impact

AI algorithms assist in the design and optimization of ICs and also, they can analyze vast datasets and simulations to identify the most efficient circuit layouts, helping engineers create ICs that are smaller, faster and more power-efficient. AI-driven design tools can automate the process of creating IC layouts and these tools can generate and evaluate thousands of design options in a fraction of the time it would take a human designer, leading to faster development cycles.

AI can enhance the testing and quality control of ICs. Machine learning algorithms can identify defects in manufactured ICs by analyzing patterns in test data, improving yield rates and reducing waste. AI-powered predictive maintenance can be used to monitor the health of semiconductor manufacturing equipment. By analyzing sensor data, AI can predict when equipment is likely to fail, reducing downtime and improving production efficiency.

Russia- Ukraine War Impact

Ukraine is hub for manufacture of several semiconductors and suppliers of electronic components. The war and its associated disruptions, including transportation and logistics challenges, can lead to disruptions in the semiconductor supply chain. The conflict between Russia and Ukraine has led to increased geopolitical tensions may result in shortages of critical components and materials needed for IC manufacturing.

Any disruptions in the supply chain can affect the global pricing and availability of ICs. If certain manufacturers or suppliers in the region are unable to operate or export their products, it may lead to price fluctuations and limited availability of specific ICs. Given the geopolitical uncertainties in the region, semiconductor companies may consider diversifying their manufacturing locations to reduce risk and this could lead to a shift in production away from Ukraine and Russia to other countries, potentially impacting the local economies.

By Type

Analog IC
Digital IC
Mixed Single IC

By Application

Cloud Computing
Enterprise
Edge Computing
Others

By End-User

Data Centers
Consumers Electronics
IT
Others

By Region

North America
- U.S.
- Canada
- Mexico

Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe

South America
- Brazil
- Argentina
- Rest of South America

Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific

Middle East and Africa

Key Developments

In September 2023, Rebellions Inc., a South Korean artificial intelligence chip design startup, partnered with IBM to collaborate on generative AI technology development. As part of this partnership, Rebellions will conduct testing of its AI chip, ATOM, using IBM's systems at its data center in Albany, New York, to verify the chip's quality and performance at the server level.
In August 2022, Toshiba Electronic Devices & Storage Corporation introduced a new stepping motor driver IC, the "TB67S549FTG," designed for industrial equipment such as office automation and financial equipment. The IC is compact and features built-in constant-current control without the need for external components, helping save space on circuit boards.
In March 2023, Power Integrations, a Silicon Valley-based supplier of high-performance electronic components for high-voltage power-conversion systems, unveiled a new 900-volt gallium-nitride (GaN) extension to its InnoSwitch3™ family of flyback switcher ICs and these ICs, incorporating PowiGaN technology, provide up to 100 watts with over 93 percent efficiency, eliminating the need for heat sinks and simplifying designs for space-constrained applications.

Why Purchase the Report?

To visualize the global micro integrated circuits market segmentation based on type, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of micro integrated circuits market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global micro integrated circuits market report would provide approximately 61 tables, 59 figures and 203 pages.

Target Audience 2023

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1. Methodology and Scope

1.1. Research Methodology
1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

3.1. Snippet by Type
3.2. Snippet by Application
3.3. Snippet by End-User
3.4. Snippet by Region

4. Dynamics

4.1. Impacting Factors
- 4.1.1. Drivers
  - 4.1.1.1. Rising Demand for 5G Networks
  - 4.1.1.2. Rising Collaboration and Partnerships Increase Demand
  - 4.1.1.3. Advancement in Technology
- 4.1.2. Restraints
  - 4.1.2.1. Overheating and Channel Attacks Hinder the Growth of the Market
- 4.1.3. Impact Analysis

5. Industry Analysis

5.1. Porter's Five Force Analysis
5.2. Supply Chain Analysis
5.3. Pricing Analysis
5.4. Regulatory Analysis
5.5. Russia-Ukraine War Impact Analysis
5.6. DMI Opinion

6. COVID-19 Analysis

6.1. Analysis of COVID-19
- 6.1.1. Scenario Before COVID
- 6.1.2. Scenario During COVID
- 6.1.3. Scenario Post COVID
6.2. Pricing Dynamics Amid COVID-19
6.3. Demand-Supply Spectrum
6.4. Government Initiatives Related to the Market During Pandemic
6.5. Manufacturers Strategic Initiatives
6.6. Conclusion

7. By Type

7.1. Introduction
- 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2. Market Attractiveness Index, By Type
7.2. Analog IC*
- 7.2.1. Introduction
- 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3. Digital IC
7.4. Mixed Single IC

8. By Application

8.1. Introduction
- 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 8.1.2. Market Attractiveness Index, By Application
8.2. Cloud Computing*
- 8.2.1. Introduction
- 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3. Enterprise
8.4. Edge Computing
8.5. Others

9. By End-User

9.1. Introduction
- 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2. Market Attractiveness Index, By End-User
9.2. Data Centers*
- 9.2.1. Introduction
- 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3. Consumers Electronics
9.4. IT
9.5. Others

10. By Region

10.1. Introduction
- 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2. Market Attractiveness Index, By Region
10.2. North America
- 10.2.1. Introduction
- 10.2.2. Key Region-Specific Dynamics
- 10.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1. U.S.
  - 10.2.6.2. Canada
  - 10.2.6.3. Mexico
10.3. Europe
- 10.3.1. Introduction
- 10.3.2. Key Region-Specific Dynamics
- 10.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1. Germany
  - 10.3.6.2. UK
  - 10.3.6.3. France
  - 10.3.6.4. Italy
  - 10.3.6.5. Russia
  - 10.3.6.6. Rest of Europe
10.4. South America
- 10.4.1. Introduction
- 10.4.2. Key Region-Specific Dynamics
- 10.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1. Brazil
  - 10.4.6.2. Argentina
  - 10.4.6.3. Rest of South America
10.5. Asia-Pacific
- 10.5.1. Introduction
- 10.5.2. Key Region-Specific Dynamics
- 10.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1. China
  - 10.5.6.2. India
  - 10.5.6.3. Japan
  - 10.5.6.4. Australia
  - 10.5.6.5. Rest of Asia-Pacific
10.6. Middle East and Africa
- 10.6.1. Introduction
- 10.6.2. Key Region-Specific Dynamics
- 10.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11. Competitive Landscape

11.1. Competitive Scenario
11.2. Market Positioning/Share Analysis
11.3. Mergers and Acquisitions Analysis

12. Company Profiles

12.1. Samsung*
- 12.1.1. Company Overview
- 12.1.2. Product Portfolio and Description
- 12.1.3. Financial Overview
- 12.1.4. Key Developments
12.2. Qualcomm Technologies
12.3. Intel Corporation
12.4. Texas Instruments
12.5. Toshiba
12.6. NVIDIA Corporation
12.7. SK Hynix
12.8. Micron Technology
12.9. Fujitsu
12.10. Avago Technologies

LIST NOT EXHAUSTIVE

13. Appendix

13.1. About Us and Services
13.2. Contact Us

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