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全球故障分析市场 - 2024-2031

Global Failure Analysis Market - 2024-2031

出版日期: 2024年04月03日 | 出版商:

DataM Intelligence | 英文 280 Pages | 商品交期: 最快1-2个工作天内

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简介目录

概述

全球故障分析市场在 2023 年达到 51 亿美元，预计到 2031 年将达到 95 亿美元，在 2024-2031 年预测期间复合CAGR为 8.2%。

产品故障的可能性随着产品复杂性（包括小型化和复杂设计）的增加而增加。这种复杂性影响着工业、汽车、航空航太、电子和医疗保健领域。为了确定故障的根本原因并确保这些复杂结构的可靠性和功能性，故障分析至关重要。行业协会和监管机构执行高品质和安全标准，以确保产品的合规性、安全性和可靠性。透过定位材料、零件和系统中的缺陷和故障模式，故障分析对于满足这些要求至关重要。汽车、航空航太、医疗器材和製药业的严格限制增加了对故障分析服务和解决方案的需求。

为了满足消费者对故障分析解决方案日益增长的需求，市场上的一些主要参与者正在全球扩展业务。例如，2023 年 9 月 1 日，电子製造服务供应商 NEOTech 扩建了位于墨西哥的故障分析实验室，为客户提供更高水准的产品品质保证。 NEOTech 承诺投资尖端设备，使其能够提供一流的服务。由于对品质的执着，NEOTech 的客户可以保证其产品保持竞争优势。

由于在预测期内该地区主要参与者不断推出技术先进的故障分析产品，亚太地区成为市场的主导地区。例如，2021 年 8 月 8 日，Joel Ltd. 推出了半透镜版本 (i)/(is)，最适合观察肖特基场发射电子显微镜 JSM-IT800 的半导体装置。

透过将电子束与物镜下方形成的强大磁场透镜合併，半透镜可产生极高的解析度。此外，该设备有效地收集从样品中释放的低能二次电子，并使用上部透镜内检测器（UID）来检测电子。因此，它可以以高解析度查看和分析倾斜和横截面样本，这对于半导体装置故障调查是必要的。

动力学

严格的监管标准

监管机构对製造商和供应商提出强制性合规要求，包括美国食品药物管理局(FDA)、欧洲药品管理局(EMA)、美国联邦航空管理局(FAA)、国际标准化组织(ISO) 和多个行业特定监管机构机构。为了确保法规遵循，这些标准通常涉及严格的品质控制方法、产品测试程序和故障分析程序。为了实现并维持合规性，建议企业投资故障分析服务和解决方案。

例如，中央药品标准控制组织（CDSCO）是印度负责监督各种医疗器材的监管组织。每一种想要在印度传播或推广的医疗器材都必须先获得CDSCO的授权才能获准上市。 CDSCO 遵守有关医疗器材产业的所有适用法律、法规和规章。每年有数千人申请註册。因此，如今法规变得越来越严格，以确保只销售有益于人民的产品。 CDSCO 发布的需要註册的非通报医疗器材清单中的医疗保健产品之一是显微镜。

分析和成像技术的进步

透射电子显微镜和扫描电子显微镜等显微镜技术的发展提高了品质。分析师可以透过更高解析度的成像来确定故障过程和根本原因，以查看材料和组件中的微小特征和缺陷。使用通常提供材料的 2D 影像的传统成像技术时，解释复杂的 3D 结构更具挑战性。透过先进的成像方法（例如电脑断层扫描和共焦显微镜等）可以对材料和组件进行三维成像。透过暴露底层结构和空间连接，三维视觉化提高了故障分析的准确性。

研究人员可以透过使用现场测试和分析方法来了解现实环境中的材料行为和失效机制。原位 TEM 和原位光谱等方法可以动态监测不同环境暴露下的样品，例如热循环、机械应力、腐蚀等。研究人员利用原位分析创建故障分析预测模型，提供有关故障过程演变的深刻资讯。

拥有及维护成本高

通常需要大量的初始资金支出来购买复杂的故障分析工具，例如透射电子显微镜 (TEM)、聚焦离子束 (FIB) 系统和扫描电子显微镜 (SEM)。对于许多组织来说，尤其是规模较小的组织或资源较少的研究机构，可能很难维持购买此类技术所需的初始成本。

故障分析设备经常需要超出最初购买的持续维护和维修成本。此费用包括定期维护以确保最佳效率的费用以及更换或维修老化零件的费用。在设备的整个生命週期中，这些维护费用会不断增加并提高整体拥有成本。使用和维护复杂的故障分析设备经常需要特定领域的专业知识。为了确保设备正常运作和维护，组织需要进行培训计画投资或招募称职的员工。缺乏具有故障分析方法经验的合格工程师或技术人员可能会进一步增加劳动成本并提高总拥有成本。

The likelihood of product failures rises with product complexity, including miniaturization and complicated designs. The complexity affects the industrial, automotive, aerospace, electronics and healthcare sectors. To determine the root cause of failures and ensure the dependability and functionality of these complex structures, failure analysis is crucial. High quality and safety standards are enforced by industry associations and regulatory agencies to guarantee product conformity, safety and dependability. By locating shortcomings weaknesses and failure modes in materials, components and systems, failure analysis is essential to fulfilling these requirements. Strict restrictions in the automobile, aerospace, medical device and pharmaceutical industries have increased demand for failure analysis services and solutions.

To fulfill consumers increased demand for failure analysis solutions some of the major key players in the market are expanding their business globally. For instance, on September 01, 2023, NEOTech, an electronic manufacturing service provider expanded its failure analysis laboratory in Mexico to provide customers with enhanced levels of product quality assurance. NEOTech has shown its commitment to investing in cutting-edge equipment, enabling it to provide best-in-class services. Customers of NEOTech are guaranteed to maintain their products' competitive edge because of this dedication to quality.

Asia-Pacific is the dominating region in the market due to the growing technologically advanced failure analysis product launches by major key players in the region over the forecast period. For instance, on August 08, 2021, Joel Ltd. launched semi-in-lens versions (i)/(is) which are optimal for the observation of semiconductor devices of the Schottky Field Emission Electron Microscope JSM-IT800.

By merging electron beams with the powerful magnetic field lens that forms below the objective lens, a semi-in-lens produces extremely high resolution. Additionally, the device effectively gathers the low-energy secondary electrons released from a sample and uses the upper in-lens detector (UID) to detect the electrons. As a result, it makes it possible to see and analyze inclined and cross-sectional specimens at high resolution, which is necessary for semiconductor device failure investigation.

Dynamics

Stringent Regulatory Standards

Mandatory compliance requirements are imposed on manufacturers and suppliers by regulatory bodies, including the Food and Drug Administration (FDA), European Medicines Agency (EMA), Federal Aviation Administration (FAA), International Organization for Standardization (ISO) and several industry-specific regulatory agencies. To guarantee regulatory compliance, these criteria frequently involve strict quality control methods, product testing procedures and failure analysis procedures. To achieve and sustain compliance, businesses are advised to invest in failure analysis services and solutions.

For instance, the Central Drug Standard Control Organization or CDSCO, is the regulatory organization in India that oversees various medical devices. Every medical device that wants to be propagated or promoted in India must first receive authorization from the CDSCO before being allowed to be marketed. The CDSCO conforms with all applicable laws, rules and regulations about the medical device industry. Thousands of people apply for registration each year. Due to this, regulations are becoming more strict these days to guarantee that only products that benefit people are sold. One of the healthcare products on the CDSCO-released list of non-notified medical devices that require registration is a microscope.

Technological Advancements in Analytical and Imaging

Technological developments in microscopy like transmission electron microscopy and scanning electron microscopy, have improved quality. Analysts can determine failure processes and root causes via higher-resolution imaging to see minute features and imperfections in materials and components. Interpreting complex 3-D structures is more challenging when using conventional imaging techniques, which usually offer 2-D images of materials. Three-dimensional imaging of materials and components is made possible by advanced imaging methods such as computed tomography and confocal microscopy, among others. By exposing underlying structures and spatial connections, three-dimensional visualization improves the accuracy of failure analysis.

Researchers can see material behavior and failure mechanisms in real-world settings by using in-situ testing and analysis methods. Methods like in-situ TEM and in-situ spectroscopy allow the dynamic monitoring of samples under different environmental exposures such as heat cycling, mechanical stress, corrosion and others. Researchers create prediction models for failure analysis with the use of in-situ analysis, which offers insightful information about the evolution of failure processes.

High Ownership and Maintenance Cost

It typically requires a substantial initial expenditure of funds to purchase sophisticated failure analysis tools like transmission electron microscopes (TEMs), focused ion beam (FIB) systems and scanning electron microscopes (SEMs). It may be difficult for many organizations, especially smaller ones or research facilities with smaller resources, to uphold the initial cost required for purchasing such technology.

Failure analysis equipment frequently requires continuing maintenance and servicing costs beyond the initial purchase. The covers the expenses of doing regular maintenance to ensure optimal efficiency as well as the price of replacing or repairing aging components. Throughout the equipment's life, these maintenance expenses can add up and raise the overall cost of ownership. Expertise in particular fields is frequently needed to use and maintain sophisticated failure analysis equipment. To guarantee that the equipment is operated and maintained properly organizations would need to make training program investments or recruit competent staff. The lack of qualified engineers or technicians with experience in failure analysis methods might raise labor expenses further and raise the total cost of ownership.

Segment Analysis

The global failure analysis market is segmented based on technology, equipment, test, end-user and region.

Growing Adoption of Failure Analysis Software Globally

Based on the Technology, the failure analysis market is segmented into Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), Energy-dispersive X-ray spectroscopy (EDS), X-ray Photoelectron Spectroscopy (XPS) and Others. With the use of SEM's high-resolution imaging capabilities, analysts study sample surfaces with resolution down to the nanoscale. The is ideal for identifying the fundamental causes of various materials and component failures as it allows the examination of microstructures and failure locations. SEM has a broad depth of focus in comparison to other microscopy techniques, which enables it to examine materials with uneven or rough surfaces. Due to this, SEM is very useful for analyzing complex structures and identifying small imperfections that could lead to failures.

Through the use of this skill, analysts may determine the chemical makeup of materials and locate impurities or contaminants that cause failures. Several substances, including biological specimens and ceramics, metals and semiconductors, were analyzed employing scanning electron microscopy. Over the projection period, the leading important players' increasing number of product launches contribute to the growth of the market. For instance, on January 29, 2021, Emory University, launched Energy-Dispersive Spectroscopy for elemental analysis. Particular substances and their relative percentages in different sections of a sample can be determined by combining the current scanning electron microscope (SEM) with an EDS system. EDS makes use of the idea that each element's related atomic structure produces a unique peak profile on an X-ray spectrum.

Geographical Penetration

Asia-Pacific is Dominating the Failure Analysis Market

Asia-Pacific is a significant center for manufacturing across several industries, such as consumer products, automobiles and aerospace. Because of the robust manufacturing sector in the region, which requires product quality and conformance to industry standards, failure analysis services are in high demand. Leading semiconductor producers, suppliers of electronic components and technological companies that promote technical innovation and breakthroughs in failure analysis methods and instruments are based in Asia-Pacific. The region's importance in the globally failure analysis market is attributed to its proficiency in electronics and semiconductor production.

The demand for failure analysis services has increased in response to the rapid industrialization and economic expansion of countries like China, Japan, South Korea and Taiwan, which has helped in the creation and manufacturing of cutting-edge goods and technology. Failure analysis is becoming increasingly necessary as the region's businesses modernize and use sophisticated production techniques to identify and mitigate risks.

Competitive Landscape.

The major global players in the market include Keysight Technologies, Anritsu Corporation, TUV SUD, NEC Corporation, L3Harris Technologies, Inc., Smiths Interconnect, Intertech Group Plc., TEC Materials Testing, McDowell Owens Engineering Inc., Panacea Engineers and Metallurgical Engineering Services, Inc.

COVID-19 Impact Analysis

The pandemic produced delays in the delivery of components, tools and supplies needed for failure analysis procedures by upsetting globally supply networks. Travel restrictions and interruptions to business operations led to shortages and logistical problems that impacted the velocity of failure analysis services. The pandemic's impact on consumer spending and financial instability contributed to a reduction in demand for products and services in several industries, including electronics, automotive and aerospace.

Money and resources were diverted from failure analysis programs, especially in areas of the economy that were directly grasped by pandemic response activities. For failure analysis service providers and their clients, the shift to remote labor presented difficulties, especially in sectors where on-site inspections and practical testing are crucial. The use of remote work arrangements has resulted in obstacles to cooperation, communication and physical inspection capabilities, ultimately causing delays and inefficiencies in failure analysis processes.

Russia-Ukraine War Impact Analysis

Significant suppliers of raw materials, parts and technology to a variety of industries, including electronics, semiconductor manufacturing, aerospace and defense, contain Russia and Ukraine. Any disruption in the conflict's supply chain might result in shortages of vital supplies or parts, which would interfere with production plans and cause failure analysis studies to be postponed. The conflict's unpredictability might cause price volatility in the world's commodities markets, which include those for energy resources, metals and minerals. Price fluctuations affect the supplies and equipment required for failure analysis procedures, which result in increased operational costs for market participants.

Global trade relations and regulatory environments are impacted by geopolitical tensions emerging from the conflict. The transfer of products, technology and services across borders is impacted by increased sanctions, trade restrictions or export controls placed on Russia or Ukraine. The restricts access to essential assets or hamper cross-border cooperation in the failure analysis industry. Industries that are directly affected by the conflict, such as electronics, aircraft and defense, could put more money and resources into supply chain vulnerabilities or risk mitigation. The causes changes in the market for failure analysis services, with a greater emphasis on locating and resolving possible weaknesses in vital infrastructure and supply networks.

By Technology

Scanning Electron Microscopy (SEM)
Transmission Electron Microscopy (TEM)
Focused Ion Beam (FIB)
Energy-dispersive X-ray spectroscopy (EDS)
X-ray Photoelectron Spectroscopy (XPS)
Others

By Equipment

Electron Microscopes
Optical Microscopes
X-ray Machines
Ion Beam Machines
Spectroscopy Equipment
Thermal Analyzers
Others

By Test

Material Testing
Non-Destructive Testing (NDT)
Chemical Analysis
Physical Testing
Electrical Testing
Mechanical Testing
Others

By End-User

Semiconductor & Electronics
Automotive
Aerospace & Defense
Medical Devices
Material Science
Oil & Gas
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On November 08, 2022, TESCAN, launched New TENSOR Scanning Transmission Electron Microscope in the market. TENSOR is designed to meet the demands of semiconductor R&D and failure analysis (FA) engineers, materials scientists and crystallographers, as well as anybody interested in multimodal nano-characterization applications (morphological, chemical and structural).
On June 06, 2023, LambdaTest launched an AI-powered Test Failure Analysis feature in its smart test orchestration platform HyperExecute. With just one click, digital organizations will be able to expedite their troubleshooting and repair process for test case failures due to this revolutionary new feature.
On May 12, 2020, Sauce Labs launched a new machine learning-based analytics solution to improve test quality. Failure Analysis allows developers, testers and QA managers to quickly tackle the most common issues and promote rapid test quality improvement by providing information on how frequently a certain type of failure occurs across a test suite.

Why Purchase the Report?

To visualize the global failure analysis market segmentation based on technology, equipment, test, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of failure analysis market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global failure analysis market report would provide approximately 73 tables, 78 figures and 280 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Technology
3.2.Snippet by Equipment
3.3.Snippet by Test
3.4.Snippet by End-User
3.5.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Stringent Regulatory Standards
  - 4.1.1.2.Technological Advancements in Analytical and Imaging
- 4.1.2.Restraints
  - 4.1.2.1.High Ownership and Maintenance Cost
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID
- 6.1.2.Scenario During COVID
- 6.1.3.Scenario Post COVID
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Technology

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 7.1.2.Market Attractiveness Index, By Technology
7.2.Scanning Electron Microscopy (SEM)*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Transmission Electron Microscopy (TEM)
7.4.Focused Ion Beam (FIB)
7.5.Energy-dispersive X-ray spectroscopy (EDS)
7.6.X-ray Photoelectron Spectroscopy (XPS)
7.7.Others

8.By Equipment

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 8.1.2.Market Attractiveness Index, By Equipment
8.2.Electron Microscopes*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Optical Microscopes
8.4.X-ray Machines
8.5.Ion Beam Machines
8.6.Spectroscopy Equipment
8.7.Thermal Analyzers
8.8.Others

9.By Test

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 9.1.2.Market Attractiveness Index, By Test
9.2.Material Testing*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Non-Destructive Testing (NDT)
9.4.Chemical Analysis
9.5.Physical Testing
9.6.Electrical Testing
9.7.Mechanical Testing
9.8.Others

10.By End-User

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2.Market Attractiveness Index, By End-User
10.2.Semiconductor & Electronics*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Automotive
10.4.Aerospace & Defense
10.5.Medical Devices
10.6.Material Science
10.7.Oil & Gas
10.8.Others

11.By Region

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2.Market Attractiveness Index, By Region
11.2.North America
- 11.2.1.Introduction
- 11.2.2.Key Region-Specific Dynamics
- 11.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1.U.S.
  - 11.2.7.2.Canada
  - 11.2.7.3.Mexico
11.3.Europe
- 11.3.1.Introduction
- 11.3.2.Key Region-Specific Dynamics
- 11.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1.Germany
  - 11.3.7.2.UK
  - 11.3.7.3.France
  - 11.3.7.4.Italy
  - 11.3.7.5.Spain
  - 11.3.7.6.Rest of Europe
11.4.South America
- 11.4.1.Introduction
- 11.4.2.Key Region-Specific Dynamics
- 11.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1.Brazil
  - 11.4.7.2.Argentina
  - 11.4.7.3.Rest of South America
11.5.Asia-Pacific
- 11.5.1.Introduction
- 11.5.2.Key Region-Specific Dynamics
- 11.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.5.7.1.China
  - 11.5.7.2.India
  - 11.5.7.3.Japan
  - 11.5.7.4.Australia
  - 11.5.7.5.Rest of Asia-Pacific
11.6.Middle East and Africa
- 11.6.1.Introduction
- 11.6.2.Key Region-Specific Dynamics
- 11.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 11.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
- 11.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
- 11.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12.Competitive Landscape

12.1.Competitive Scenario
12.2.Market Positioning/Share Analysis
12.3.Mergers and Acquisitions Analysis

13.Company Profiles

13.1.Keysight Technologies*
- 13.1.1.Company Overview
- 13.1.2.Product Portfolio and Description
- 13.1.3.Financial Overview
- 13.1.4.Key Developments
13.2.Anritsu Corporation
13.3.TUV SUD
13.4.NEC Corporation
13.5.L3Harris Technologies, Inc.
13.6.Smith's Interconnect
13.7.Intertech Group Plc.
13.8.TEC Materials Testing
13.9.McDowell Owens Engineering Inc.
13.10.Panacea Engineers
13.11.Metallurgical Engineering Services, Inc.