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全球低温共烧陶瓷 (LTCC) 和高温共烧陶瓷 (HTCC) 市场 - 2024-2031

Global Low Temperature Co-Fired Ceramics (LTCC) And High Temperature Co-fired Ceramic (HTCC) Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 193 Pages | 商品交期: 约2个工作天内

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简介目录

概述

2023年全球低温共烧陶瓷（LTCC）和高温共烧陶瓷（HTCC）市场规模达28亿美元，预计到2031年将达到37亿美元，预测期间复合年增长率为3.4% 2024 年至2031 年期间。

各行业对创新电子产品的需求不断增长，是推动 LTCC 和 HTCC 市场的主要因素之一。随着技术的发展，具有优异可靠性、热稳定性和小型化特性的电子元件变得越来越必要。 LTCC 和 HTCC 材料能够生产小型且极其高效的电子元件（包括电容器、电感器、电阻器和感测器），从而满足这些需求。

5G 连接、物联网 (IoT)、人工智慧 (AI) 和无人驾驶汽车等先进技术的快速发展和采用推动了对 LTCC 和 HTCC 材料的需求。利用 LTCC 和 HTCC 技术可以帮助实现这些技术对电气元件的要求，提高效能、提高整合度和增强可靠性。

亚太地区是全球低温共烧陶瓷（LTCC）和高温共烧陶瓷（HTCC）市场的成长地区之一，占了超过1/3的市场。全球一些产业对微型电子设备的需求正在成长，包括消费性电子、汽车、医疗保健和电信。这正在推动低温共烧陶瓷和高温共烧陶瓷市场的成长。

动力学

对更轻电子设备的需求不断增加

各行业对小型电子设备的需求不断增长，刺激了 LTCC 和 HTCC 市场的发展。随着技术发展推动更小、更强大的电子元件的诞生，LTCC 和 HTCC 材料在尺寸缩小、整合和性能方面具有明显的优势。

此外，这些陶瓷还可以製造出小型且极其高效的电子零件，例如感测器、电感器和电容器元件，这些元件对于穿戴式装置、智慧型手机、穿戴式科技、物联网、汽车电子和医疗设备中的使用至关重要。由于客户对高效能、轻量化和可携式电子设备的需求不断增加，市场正在不断发展，这反过来又推动了 LTCC 和 HTCC 技术的采用。

电信基础设施的快速发展

全球电信基础设施的快速成长，特别是随着5G网路的引入以及对高速资料传输的需求不断增长，是推动LTCC和HTCC市场的另一个重要因素。在生产滤波器、收发器和天线等电信设备中的射频和微波零件时，需要使用 LTCC 和 HTCC 材料。

例如，2023 年，塞拉尼斯在加州圣地牙哥举行的 IMS 2023 上推出了 Micromax LF 系列导电油墨和 GreenTape LF95C 低温共烧陶瓷 (LTCC) 材料系统。 LF95C 是着名 GreenTape 951 系统的无铅版本，专为高频、高可靠性应用（包括 5G 通讯）而客製化。 LF95C 专为高达 40 GHz 的电信应用而设计，为电路设计人员和製造商提供了针对磁带和相容导体的创新解决方案。

初始投资成本高

建立生产设施和取得专用机械来製造这些陶瓷材料需要大量的前期支出，这是 LTCC 和 HTCC 市场的主要障碍。共烧陶瓷是一个需要专门设备、无尘室空间和训练有素的劳动力的过程，所有这些都可能导致大量的前期费用。

初始投资费用可能会成为中小企业或新市场进入者的进入壁垒，限制他们成功参与市场的能力。尤其是在竞争激烈的市场环境下，创新和增强陶瓷材料的研发 (R&D) 所需的持续支出进一步加剧了财务负担。

原料取得有限

陶瓷製造所需的专用原料供应有限是影响 LTCC 和 HTCC 市场的另一个障碍。由于地缘政治紧张局势、贸易限製或环境法规等因素影响采矿和开采活动，LTCC 和HTCC 配方中使用的某些重要成分（例如高纯度陶瓷、导电材料和介电材料）可能面临供应限製或可用性波动。

此外，价格波动和供应中断等供应链风险可能由过度依赖少数关键原物料供应商的企业承担。寻找和审查替代原材料以减少这些危害的难度可能会进一步增加生产成本和交货时间，这将损害 LTCC 和 HTCC 产品的市场竞争力。

The growing demand for innovative electronic gadgets across a range of sectors is one of the main factors propelling the LTCC and HTCC markets. Electronic components with excellent dependability, thermal stability and downsizing characteristics are becoming more and more necessary as technology develops. By making it possible to produce small and incredibly effective electronic components including capacitors, inductors, resistors and sensors, LTCC and HTCC materials offer answers to these demands.

The demand for LTCC and HTCC materials is being driven by the quick development and uptake of advanced technologies including 5G connectivity, the Internet of Things (IoT), artificial intelligence (AI) and driverless cars. Utilizing LTCC and HTCC technologies can help accomplish the increased performance, greater integration and enhanced dependability that these technologies demand from their electrical components.

Asia-Pacific is among the growing regions in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market covering more than 1/3rd of the market. Global demand for miniaturized electronic devices is growing across some industries, including consumer electronics, automotive, healthcare and telecommunications. The is driving growth in the markets for low-temperature co-fired ceramics and high-temperature co-fired ceramics.

Dynamics

Increasing Demand for Lighter Electronic Devices

The market for LTCC and HTCC is being stimulated by the growing need for smaller electronic devices in a variety of sectors. LTCC and HTCC materials provide distinct benefits in terms of downsizing, integration and performance as technological developments propel the creation of smaller and more potent electronic components.

Additionally, these ceramics make it possible to create small, incredibly effective electronic parts like sensors, inductors and capacitors components that are crucial for use in wearables, smartphones, wearable technology, the Internet of Things, automotive electronics and medical equipment. The market is developing because of the increasing customer desire for high-performance, lightweight and portable electronic devices, which in turn drives the adoption of LTCC and HTCC technologies.

Rapid Infrastructure Development in Telecommunications

The fast growth of the global telecommunications infrastructure, especially with the introduction of 5G networks and the rising need for high-speed data transmission, is another important factor driving the LTCC and HTCC markets. When it comes to producing the RF and microwave parts that go into telecom devices like filters, transceivers and antennas, LTCC and HTCC materials are necessary.

For instance, in 2023, Celanese introduced its Micromax LF Series Conductive Inks and the GreenTape LF95C Low-Temperature Co-fired Ceramic (LTCC) materials system at IMS 2023 in San Diego, California. LF95C, a lead-free version of the renowned GreenTape 951 system, is tailored for high-frequency, high-reliability applications, including 5G communications. Designed for telecom applications up to 40 GHz, LF95C offers circuit designers and manufacturers an innovative solution for tapes and compatible conductors.

High Initial Investment Costs

The substantial upfront expenditures involved in establishing production facilities and obtaining specialized machinery to create these ceramic materials represent a major barrier for the LTCC and HTCC markets. Co-firing ceramics is a procedure that calls for specialized equipment, clean room spaces and trained labor all of which can lead to significant upfront expenses.

The initial investment expenses might operate as a barrier to entry for small and medium-sized firms (SMEs) or new market entrants, restricting their capacity to successfully participate in the market. To further compound the financial burden, especially in a highly competitive market scenario, is the ongoing expenditure required in research and development (R&D) to innovate and enhance ceramic materials.

Limited Accessibility to Raw Materials

The restricted supply of specialized raw materials needed for ceramic manufacture is another barrier impacting the LTCC and HTCC markets. Due to factors like geopolitical tensions, trade restrictions or environmental regulations impacting mining and extraction activities, certain essential components used in LTCC and HTCC formulations, such as high-purity ceramics, conductive materials and dielectric materials, may face supply constraints or fluctuations in availability.

Additionally, supply chain risks, such as price volatility and supply interruptions, can be borne by firms that rely too heavily on a small number of suppliers for key raw materials. The difficulty of finding and vetting substitute raw materials to reduce these hazards might further raise production costs and lead times, which will hurt LTCC and HTCC goods' ability to compete in the market.

Segment Analysis

The global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market is segmented based on process, material, application, end-user and region.

Rising Demand for LTCC and HRCC in Electronics Industry

The Electronics segment is among the growing regions in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market covering more than 1/3rd of the market. The global market for low-temperature co-fired ceramics (LTCC) and high-temperature co-fired ceramics (HTCC) is expanding primarily due to the rise of the electronics sector.

The demand for materials with high reliability, thermal stability and miniaturization capabilities all attributes of LTCC and HTCC technologies is growing as electronic devices get smaller and more advanced. The ceramics are widely used in the production of many electronic components, including sensors, inductors, resistors and capacitors. The components are crucial parts of wearable technology, wearable computers, tablets, smartphones and other consumer and business electronics.

Geographical Penetration

Growing Demand for Electronics Industry in Asia-Pacific

Asia-Pacific has been a dominant force in the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market. Asia-Pacific is a major growth driver for the global market for low-temperature co-fired and high-temperature co-fired ceramics because it is a hub for electronics manufacturing. Major consumer electronics, telecommunications equipment and automotive electronics producers include China, Japan, South Korea and Taiwan.

The use of LTCC and HTCC materials, which have benefits including high reliability, outstanding thermal stability and integration capabilities, is fueled by the growing need in these sectors for high-performance electronic devices and downsized electronic components. Rapid infrastructural development and advances in technology are occurring throughout Asia-Pacific, especially in aircraft, automobiles and telecommunications industries.

Additionally, advanced electrical components and packaging solutions are needed for the rollout of 5G networks, the growth of satellite communication networks and the creation of driverless cars. LTCC and HTCC technologies excel in these areas. The need for LTCC and HTCC materials is anticipated to soar as these sectors develop more, therefore driving market expansion in the region.

Moreover, the growth of the LTCC and HTCC markets in Asia-Pacific is facilitated by government programs and expenditures in research and development (R&D) to support local manufacturing capacities and technical innovation. Strong R&D ecosystems backed by educational institutions, governmental organizations and business alliances are present in nations like China, Japan and South Korea, creating a favorable atmosphere for the creation and marketing of cutting-edge ceramic materials and electronic components.

COVID-19 Impact Analysis

The global market for high-temperature co-fired (HTCC) and low-temperature co-fired (LTCC) ceramics has been impacted by the COVID-19 epidemic in some ways. At first, the epidemic caused extensive supply chain delays since industrial plants had to close temporarily to comply with lockdown procedures and protect employees. The manufacture and delivery of LTCC and HTCC materials and components were delayed as a result of this interruption, making it difficult to satisfy demand and complete obligations.

In addition, the economic recession brought on by the pandemic changed consumer spending habits and investment choices, which resulted in a decline in demand for goods and services in some industries, including healthcare, telecommunications, automotive, aerospace and the automotive industry all of which are important users of LTCC and HTCC components.

Because of the decreased orders and income streams, producers of LTCC and HTCC materials had to modify their operating plans and production capabilities to cope with the shifting market conditions. The pandemic also brought attention to how important it is to have technology like telecom infrastructure for remote work and medical equipment for remote monitoring and diagnostics that are made possible by LTCC and HTCC materials.

Russia-Ukraine War Impact Analysis

The conflict between Russia and Ukraine has substantially impacted many businesses, including the globally market for high- and low-temperature co-fired ceramics (HTCC and LTCC). The supply chain is disrupted as one direct effect, especially for components and raw materials that are obtained from the area. Due to their respective importance as manufacturers of several minerals and metals required in ceramic manufacturing, Russia and Ukraine may experience shortages and price variations in the LTCC and HTCC markets if there are any delays in their production and transportation.

In addition, geopolitical tensions have affected investor confidence and company choices by bringing uncertainty and volatility to the world's markets. Planning and forecasting may be difficult for businesses in the LTCC and HTCC supply chains as conditions change and geopolitical threats linger. The LTCC and HTCC markets' growth trajectory may be impacted soon by delays in project execution, expansion plans and investment choices brought on by this uncertainty.

Furthermore, worries about the war's wider economic effects, such as possible interruptions to the oil supply and inflationary pressures, have grown. For LTCC and HTCC producers, increased manufacturing costs might result in higher final consumer pricing due to inflation and rising energy expenses. To further complicate international company operations, geopolitical conflicts may also lead to changes in trade legislation and practices.

By Process

High-Temperature Co-fired Ceramic (HTCC)
Low-Temperature Co-fired Ceramic (LTCC)

By Material

Glass-Ceramic
Ceramic

By Application

MEMS Sensor Package
RF SiP/FEM Substrate
Frequency Device Package
Medical Equipment
Industrial Equipment
LED Chip Carrier
Others

By End-User

Automotive
Telecommunications
Aerospace and Defense
Medical
Electronics
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On June 12, 2023, Celanese introduced its Micromax LF Series Conductive Inks and the GreenTape LF95C Low-Temperature Co-fired Ceramic (LTCC) materials system at IMS 2023 in San Diego, California. LF95C, a lead-free version of the renowned GreenTape 951 system, is tailored for high-frequency, high-reliability applications, including 5G communications. Designed for telecom applications up to 40 GHz, LF95C offers circuit designers and manufacturers an innovative solution for tapes and compatible conductors.

Competitive Landscape

The major global players in the market include KYOCERA Corporation, Murata Manufacturing Co., Ltd, DowDuPont Inc., Heraeus Holding, KOA Corporation, Yokowo co., ltd., Micro Systems Technologies, Soar Technology Co., Ltd., NEOTech and TDK Corporation.

Why Purchase the Report?

To visualize the global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market segmentation based on process, material, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of low-temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Process mapping available as Excel consisting of key process of all the major players.

The global low temperature co-fired ceramics (LTCC) and high temperature co-fired ceramic (HTCC) market report would provide approximately 70 tables, 67 figures and 193 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Process
3.2.Snippet by Material
3.3.Snippet by Application
3.4.Snippet by End-User
3.5.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Increasing Demand for Lighter Electronic Devices
  - 4.1.1.2.Rapid Infrastructure Development in Telecommunications
- 4.1.2.Restraints
  - 4.1.2.1.High Initial Investment Costs
  - 4.1.2.2.Limited Accessibility to Raw Materials
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID
- 6.1.1.Scenario Before COVID
- 6.1.2.Scenario During COVID
- 6.1.3.Scenario Post COVID
6.2.Pricing Dynamics Amid COVID
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Process

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 7.1.2.Market Attractiveness Index, By Process
7.2.High-Temperature Co-Fired Ceramic (HTCC)*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Low-Temperature Co-Fired Ceramic (LTCC)

8.By Material

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 8.1.2.Market Attractiveness Index, By Material
8.2.Glass-Ceramic*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Ceramic

9.By Application

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2.Market Attractiveness Index, By Application
9.2.MEMS Sensor Package*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.RF SiP/FEM Substrate
9.4.Frequency Device Package
9.5.Medical Equipment
9.6.Industrial Equipment
9.7.LED Chip Carrier
9.8.Others

10.By End-User

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.1.2.Market Attractiveness Index, By End-User
10.2.Automotive*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Telecommunications
10.4.Aerospace and Defense
10.5.Medical
10.6.Electronics
10.7.Others

11.By Region

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 11.1.2.Market Attractiveness Index, By Region
11.2.North America
- 11.2.1.Introduction
- 11.2.2.Key Region-Specific Dynamics
- 11.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.2.7.1.U.S.
  - 11.2.7.2.Canada
  - 11.2.7.3.Mexico
11.3.Europe
- 11.3.1.Introduction
- 11.3.2.Key Region-Specific Dynamics
- 11.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.3.7.1.Germany
  - 11.3.7.2.UK
  - 11.3.7.3.France
  - 11.3.7.4.Russia
  - 11.3.7.5.Spain
  - 11.3.7.6.Rest of Europe
11.4.South America
- 11.4.1.Introduction
- 11.4.2.Key Region-Specific Dynamics
- 11.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.4.7.1.Brazil
  - 11.4.7.2.Argentina
  - 11.4.7.3.Rest of South America
11.5.Asia-Pacific
- 11.5.1.Introduction
- 11.5.2.Key Region-Specific Dynamics
- 11.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 11.5.7.1.China
  - 11.5.7.2.India
  - 11.5.7.3.Japan
  - 11.5.7.4.Australia
  - 11.5.7.5.Rest of Asia-Pacific
11.6.Middle East and Africa
- 11.6.1.Introduction
- 11.6.2.Key Region-Specific Dynamics
- 11.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 11.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
- 11.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 11.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12.Competitive Landscape

12.1.Competitive Scenario
12.2.Market Positioning/Share Analysis
12.3.Mergers and Acquisitions Analysis

13.Company Profiles

13.1.KYOCERA Corporation*
- 13.1.1.Company Overview
- 13.1.2.Process Portfolio and Description
- 13.1.3.Financial Overview
- 13.1.4.Key Developments
13.2.Murata Manufacturing Co., Ltd
13.3.DowDuPont Inc.
13.4.Heraeus Holding
13.5.KOA Corporation
13.6.Yokowo co., ltd.
13.7.Micro Systems Technologies
13.8.Soar Technology Co., Ltd.
13.9.NEOTech
13.10.TDK Corporation

LIST NOT EXHAUSTIVE

14.Appendix

14.1.About Us and Services
14.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/价格

全球低温共烧陶瓷 (LTCC) 和高温共烧陶瓷 (HTCC) 市场 - 2024-2031

Global Low Temperature Co-Fired Ceramics (LTCC) And High Temperature Co-fired Ceramic (HTCC) Market - 2024-2031

目录

第 1 章：方法与范围

第 2 章：定义与概述

第 3 章：执行摘要

第 4 章：动力学

第 5 章：产业分析

第 6 章：COVID-19 分析

第 7 章：按流程

第 8 章：按材料

第 9 章：按申请

第 10 章：最终用户

第 11 章：按地区

第 12 章：竞争格局

第 13 章：公司简介

第 14 章：附录