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全球光子 IC 市场 - 2024-2031

Global Photonic IC Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 206 Pages | 商品交期: 约2个工作天内

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简介目录

概述

全球光子IC市场在2023年达到32亿美元，预计2031年将达到317亿美元，2024-2031年预测期间复合年增长率为33.2%。

推动光子积体电路市场的主要因素之一是对资料传输和高速通讯系统的需求不断增长。光子积体电路对于资料中心、5G 网路、电信和高效能运算等应用至关重要，因为它们能够利用光讯号快速发送资料。由于资料密集型应用程式的成长，对增加频宽容量的需求始终存在。光子积体电路（IC）提供的高频宽能力使得透过光网路有效传输大量资料成为可能。

主要关键参与者不断推出的产品有助于推动预测期内的市场成长。例如，2021年9月28日，Freedom Photonics在市场上推出了2.5瓦衍射极限1550 nm半导体雷射和放大器。首批商用产品是 1550 nm 半导体雷射和半导体光放大器，可实现 2.5 W 连续波光功率、>25% E/O 效率和接近衍射极限的光束质量

由于光子 IC 公司之间的合作日益密切，北美成为市场的主导地区。例如，Synopsys, Inc. 和瞻博网路将于 2022 年 4 月 4 日成立一家新公司，为业界提供开放式硅光子平台，以满足电信、资料通讯、LiDAR、人工智慧、医疗保健、高效能运算和光计算。新公司能够以最低的功耗实现高性能光子积体电路的新整合水准。

动力学

对高速数据通讯和互联网连接的需求不断增长

由于网路流量的增加，资料中心营运商正在为其基础设施建立更多空间，以满足社交网路、云端运算、串流视讯、电子商务和线上服务等数位应用不断增长的需求。硅光子技术实现的高速光学互连、交换器和收发器可实现资料中心建筑物内部和之间的有效资料传输，满足当代资料中心的可扩展性和效能需求。希望可扩展、按需存取电脑资源、储存和应用程式的企业组织和个人正在推动云端运算服务使用的持续成长。

根据即时资料分析收集的信息，超过60%的网站流量来自行动装置。 92.3% 的网路使用者透过行动装置存取网路。目前全球有43.2亿个行动上网用户。非洲行动装置上网流量占比最大，约占69.13%。到 2025 年，全球 5G 连线数将超过 10 亿。

5G网路和物联网应用的兴起

5G网路需要高速资料和高效率的传输能力，以支援连接设备和物联网应用产生的大量资料。光子 IC 能够使用光讯号高速传输资料，在频宽方面具有优势。对高速资料传输的需求推动了 5G 基础设施和光互连中对 PIC 的需求。 5G 网路承诺超低延迟和即时通讯功能，这对于自动驾驶汽车、扩增实境和远距医疗等应用至关重要。

光子 IC 在减少 5G 网路延迟、增强讯号处理和优化资料路由方面发挥着至关重要的作用，从而实现依赖即时资料处理和回应的无缝连接和高效能应用。根据GSM协会给出的资料，到2025年5G网路将覆盖全球约1/3的人口。 5G为全球带来13.1兆美元的经济产出。到 2023 年，约 59% 的人口使用 5G 网络，亚太地区约 42% 的人口使用 5G 网路。

通用製造和製程技术缺乏标准化

如果没有标准化的製造和製程技术，不同 PIC 之间的互通性就变得具有挑战性。缺乏互通性阻碍了灵活性、可扩展性和相容性，从而限制了来自不同供应商或製造商的 PIC 无缝整合到更大的光学系统或网路中。缺乏标准化可能会导致设计复杂性，因为企业必须创建独特的方法或修改现有方法，以解决组件规格、製造方法、材料和介面的差异。设计复杂性增加了开发时间、费用和风险，从而增加了企业快速有效地将基于 PIC 的产品推向市场的难度。

客製化製造和製程技术通常会导致 PIC 的开发成本更高。公司需要投资适合其特定製造方法的专用设备、专业知识、设计工具、测试程序和品质控制措施。较高的成本可能会阻止小公司或新创公司进入 PIC 市场或扩大业务规模。标准化的缺乏限制了供应商或製造设施的可用性，无法满足特定要求或生产具有所需性能特征的 PIC。有限的供应商生态系统减少了市场竞争、选择和创新，可能导致价格上涨、交货时间延长和供应链脆弱性。

One major factor driving the photonic integrated circuit market is the increasing need for data transport and high-speed communication systems. Photonic integrated circuits are crucial for applications such as data centers, 5G networks, telecommunications and high-performance computing because they enable data to be sent at fast rates utilizing optical signals. The need for increasing bandwidth capacity is constant due to the growth of data-intensive applications. High bandwidth capabilities provided by photonic integrated circuits (ICs) make it possible to transmit massive amounts of data across optical networks effectively.

Growing product launches by major key players help to boost market growth over the forecast period. For instance, on September 28, 2021, Freedom Photonics launched 2.5-watt diffraction-limited 1550 nm Semiconductor Lasers and Amplifiers in the market. The first commercial offerings are 1550 nm semiconductor lasers and semiconductor optical amplifiers, which achieve 2.5 W continuous wave optical power with >25% E/O efficiency and nearly diffraction-limited beam quality

North America is a dominating region in the market due to the growing collaboration between the companies for photonic IC. For instance, on April 04, 2022, Synopsys, Inc. and Juniper Networks are going to open a new company that will provide the industry with an open silicon photonics platform to address the growing photonic requirements in applications such as telecom, datacom, LiDAR, AI, healthcare, HPC and optical computing. The new company can enable a new level of integration with the lowest power consumption for high-performance Photonic Integrated Circuits.

Dynamics

Increasing Demand for High-Speed Data Communication and Internet Connectivity

Due to a rise in internet traffic, data center operators are building more space for their infrastructure to meet the growing need for digital applications such as social networking, cloud computing, streaming video, e-commerce and online services. High-speed optical interconnects, switches and transceivers made possible by silicon photonics technology enable effective data transfer both inside and between data center buildings, meeting the scalability and performance demands of contemporary data centers. Businesses organizations and individuals wishing scalable, on-demand access to computer resources, storage and applications are driving the continued growth in the usage of cloud computing services.

According to information gathered through live data analysis, over 60% of website traffic comes from mobile devices. 92.3% of internet users receive their internet via a mobile device. There are currently 4.32 billion mobile internet users globally. The proportion of internet traffic via mobile devices is greatest in Africa which accounted for around 69.13%. There are around over 1 billion 5G connections globally by 2025. The increase in the adoption of the internet helps to boost the market growth of photonics IC.

Rise of 5G Networks and IoT Applications

5G networks require high-speed data and efficient transmission capabilities to support massive amounts of data generated by connected devices and IoT applications. Photonic ICs enable the transmission of data at high speeds using optical signals, offering advantages in terms of bandwidth. The requirement for high-speed data transmission drives the demand for PICs in 5G infrastructure and optical interconnects. 5G networks promise ultra-low latency and real-time communication capabilities essential for applications like autonomous vehicles, augmented reality and telemedicine.

Photonic ICs play a vital role in reducing latency, enhancing signal processing and optimizing data routing in 5G networks, enabling seamless connectivity and high-performance applications that rely on real-time data processing and response. According to the data given by GSM Association, by 2025 5G networks will cover around 1/3rd of the global population. 5G introduced 13.1 Trillion dollars of global economic output. In 2023 around 59% of the population is using 5G network and in Asia-Pacific around 42% of the population adopted 5G network.

Lack of Standardization in the Common Fabrication and Process Techniques

Without standardized fabrication and process techniques, interoperability between different PICs becomes challenging. Flexibility, scalability and compatibility are hindered by this lack of interoperability, which restricts the seamless integration of PICs from various providers or manufacturers into larger optical systems or networks. Lack of standardization can cause design complexity since businesses have to create distinctive approaches or modify existing ones to account for differences in component specifications, fabrication methods, materials and interfaces. Design complexity makes it more difficult for businesses to quickly and efficiently launch PIC-based products onto the market by raising development time, expenses and risks.

Customized fabrication and process techniques often result in higher development costs for PICs. Companies need to invest in specialized equipment, expertise, design tools, testing procedures and quality control measures tailored to their specific fabrication methods. The higher costs can deter smaller companies or startups from entering the PIC market or scaling their operations. The lack of standardization limits the availability of suppliers or fabrication facilities capable of meeting specific requirements or producing PICs with desired performance characteristics. The limited supplier ecosystem reduces market competition, choice and innovation, potentially leading to higher prices, longer lead times and supply chain vulnerabilities.

Segment Analysis

The global photonic ic market is segmented based on component, raw material, integration, application, end-user and region.

Growing Adoption of Interposer Approach Type Photonic ICs

Based on the Application, the Photonic IC market is segmented into optical communications, sensing, optical signal processing and biophotonics.

The biophotonics application segment accounted the largest share of the market due to the growing emergence of nanotechnology in biophotonics. Due to the government's efforts to advance the biophotonics sector, US is a significant market for the business. Additionally, the biophotonics business in US has been pushed by the development of nanotechnology. The Jenoptik Light and Optics Biophotonics business received many new development orders in North America in November 2020. The initial challenge is to create a camera system for medical equipment that will be utilized in a robotic surgical instrument.

The major players in the market launched new products in the market which helps to boost regional market growth. For instance, in March 2021, Zeiss expanded its presence in North America by launching a new research & development, sales and customer service center in U.S. with an investment of US$ 180 Billion. The new site will incorporate the X-ray microscopy business along with the ZEISS Microscopy Customer Center to provide support for opportunities in materials research, life sciences and industrial applications.

Geographical Penetration

North America is Dominating the Photonic IC Market

A robust ecosystem of universities and research centers is present in North America, propelling technical innovation in integrated circuits and photonics. Entrepreneurship are highly valued in the region and this has led to breakthroughs in manufacturing processes and system integration. North America receives the benefits of broad industry-academia-government agency-research group collaboration and partnerships. Working together makes it easier to share expertise, transfer technology and conduct joint research initiatives aimed at creating cutting-edge PIC solutions for a range of sectors, including data centers, telecommunications, healthcare, aerospace, defense and the automotive sector.

Growing major key players' focus on the photonic IC helps to boost regional market growth over the forecast period. For instance, on October 16, 2022, Enosemi completed a commercial agreement with Luminous Computing to license and sell the silicon photonics design IP originally developed at Luminous, a key technology for AI supercomputing applications. The management team of Enosemi is experienced in silicon photonics, analog mixed signals, lasers, packaging, control and system hardware.

Competitive Landscape

The major global players in the market include Intel Corporation, Cisco Systems, Inc., Infinera Corporation, Polariton Technologies AG, teem photonics, Lumentum Holdings Inc., Luxtera, Inc., LIGENTEC SA, Acacia Communications, Inc., Kaiam Corporation and TCG Crest.

COVID-19 Impact Analysis

Global supply networks in the semiconductor sector were impacted by the pandemic. Production and shipping of PICs and related components were delayed as a result of reduced capacity and logistical difficulties. Disruptions in the supply chain impacted the supply of raw materials, manufacturing testing and packaging, which in turn hampered the availability of PICs in the market and the overall efficiency of the supply chain.

Shifts in the economy and lockdowns brought on by the epidemic prompted changes in the market need for PICs. PIC-based solutions were in higher demand in some industries such as data centers and healthcare to facilitate remote work and healthcare technology. In contrast, demand in other industries such as consumer electronics-was lower as a result of slower manufacturing and lower consumer expenditure. The need for high-speed data transmission and communication infrastructure broadened during the pandemic due to developments in telemedicine, distant work and digital collaboration. PICs played an important role in supporting these applications by enabling high-speed optical communication, signal processing, data routing and network connectivity, driving market growth in telecommunication and data center segments.

Russia-Ukraine War Impact Analysis

The semiconductor industry is one of the globally supply chains impacted by the war between Russia and Ukraine. via companies such as EpiLas GmbH, which in the semiconductor supply chain produces epitaxial wafers for optoelectronic devices. Any interruptions in the transportation of essential components or materials from Ukraine might have an impact on PIC production and availability, potentially leading to delays or shortages in the market. A rise in demand for data center infrastructure, particularly optical communication systems based on PICs occurs as corporations and organizations emphasize data protection and continuity in unpredictable geopolitical times.

Major key players in the semiconductor industry reassess their manufacturing strategies in response to geopolitical risks. The led to a diversification of manufacturing locations, increased investment in domestic and efforts to secure alternative suppliers for critical components used in PICs. Geopolitical tensions contribute to market volatility, impacting the pricing of PICs. Uncertainty in material costs and trade tariffs leads to fluctuations in component prices, affecting the profitability of companies involved in the PIC market.

By Component

Optical Laser
Modulator
Detector
Transceivers
Attenuators
Others

By Raw Material

Lithium Niobate
Indium Phosphide
Silica-on-Silicon
Gallium Arsenide
Silicon
Quantum Dots
Silicon-on-Insulator
Others

By Integration

Hybrid
Monolithic
Module

By Application

Optical Communications
Sensing
Optical Signal Processing
Bio Photonics

By End-User

Telecommunications
Biomedical
Data Centres
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On December 14, 2022, OpenLight launched First 800G DR8 Photonic Integrated Circuit Design for the Advance Global Datacenter Interconnect Industry. The new design provides consumers with an easy-to-use, validated approach to jump-start their transceiver production design.
On October 02, 2023, DustPhotonics launched Industry-First Merchant 800G Silicon Photonics Chip in the market for Hyperscale Data Centers and AI Applications. The new solution is suitable for DR8 and DR8+ applications which offers 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s.
On October 20, 2023, the Indian Institute of Technology Madras collaborated with the Ministry of Electronics & Information Technology for the launch of the Centre of Excellence for Silicon Photonics. Silicon photonic technology is suitable for various applications such as quantum computation, quantum key distribution and artificial intelligence.

Why Purchase the Report?

To visualize the global photonic IC market segmentation based on component, raw material, integration, application, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of photonic IC market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global photonic IC market report would provide approximately 78 tables, 82 figures and 206 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Component
3.2.Snippet by Raw Material
3.3.Snippet by Integration
3.4.Snippet by Application
3.5.Snippet by End-User
3.6.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Increasing Demand for High-Speed Data Communication and Internet Connectivity
  - 4.1.1.2.Rise of 5G Networks and IoT Applications
- 4.1.2.Restraints
  - 4.1.2.1.Lack of Standardization in the Common Fabrication and Process Techniques
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Component

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 7.1.2.Market Attractiveness Index, By Component
7.2.Optical Laser*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Modulator
7.4.Detector
7.5.Transceivers
7.6.Attenuators
7.7.Others

8.By Raw Material

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 8.1.2.Market Attractiveness Index, By Raw Material
8.2.Lithium Niobate*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Indium Phosphide
8.4.Silica-on-Silicon
8.5.Gallium Arsenide
8.6.Silicon
8.7.Quantum Dots
8.8.Silicon-on-Insulator
8.9.Others

9.By Integration

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 9.1.2.Market Attractiveness Index, By Integration
9.2.Hybrid*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Monolithic
9.4.Module

10.By Application

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.1.2.Market Attractiveness Index, By Application
10.2.Optical Communications*
- 10.2.1.Introduction
- 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
10.3.Sensing
10.4.Optical Signal Processing
10.5.BioPhotonics

11.By End-User

11.1.Introduction
- 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 11.1.2.Market Attractiveness Index, By End-User
11.2.Telecommunications*
- 11.2.1.Introduction
- 11.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
11.3.Biomedical
11.4.Data Centres
11.5.Others

12.By Region

12.1.Introduction
- 12.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 12.1.2.Market Attractiveness Index, By Region
12.2.North America
- 12.2.1.Introduction
- 12.2.2.Key Region-Specific Dynamics
- 12.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.2.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.2.8.1.U.S.
  - 12.2.8.2.Canada
  - 12.2.8.3.Mexico
12.3.Europe
- 12.3.1.Introduction
- 12.3.2.Key Region-Specific Dynamics
- 12.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.3.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.3.8.1.Germany
  - 12.3.8.2.UK
  - 12.3.8.3.France
  - 12.3.8.4.Italy
  - 12.3.8.5.Spain
  - 12.3.8.6.Rest of Europe
12.4.South America
- 12.4.1.Introduction
- 12.4.2.Key Region-Specific Dynamics
- 12.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.4.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.4.8.1.Brazil
  - 12.4.8.2.Argentina
  - 12.4.8.3.Rest of South America
12.5.Asia-Pacific
- 12.5.1.Introduction
- 12.5.2.Key Region-Specific Dynamics
- 12.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 12.5.8.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 12.5.8.1.China
  - 12.5.8.2.India
  - 12.5.8.3.Japan
  - 12.5.8.4.Australia
  - 12.5.8.5.Rest of Asia-Pacific
12.6.Middle East and Africa
- 12.6.1.Introduction
- 12.6.2.Key Region-Specific Dynamics
- 12.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Component
- 12.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Raw Material
- 12.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Integration
- 12.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 12.6.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

13.Competitive Landscape

13.1.Competitive Scenario
13.2.Market Positioning/Share Analysis
13.3.Mergers and Acquisitions Analysis

14.Company Profiles

14.1.Intel Corporation*
- 14.1.1.Company Overview
- 14.1.2.Product Portfolio and Description
- 14.1.3.Financial Overview
- 14.1.4.Key Developments
14.2.Cisco Systems, Inc.
14.3.Infinera Corporation
14.4.Polariton Technologies AG
14.5.Teemphotonics
14.6.Lumentum Holdings Inc.
14.7.Luxtera, Inc.
14.8.LIGENTEC SA
14.9.Acacia Communications, Inc.
14.10.Kaiam Corporation

LIST NOT EXHAUSTIVE

15.Appendix

15.1.About Us and Services
15.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/价格

全球光子 IC 市场 - 2024-2031

Global Photonic IC Market - 2024-2031

目录

第 1 章：方法与范围

第 2 章：定义与概述

第 3 章：执行摘要

第 4 章：动力学

第 5 章：产业分析

第 6 章：COVID-19 分析

第 7 章：按组件

第 8 章：依原料分类

第 9 章：透过整合

第 10 章：按申请

第 11 章：最终用户

第 12 章：按地区

第13章：竞争格局

第 14 章：公司简介

第 15 章：附录