查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
全球模内电子 (IME) 市场（2025-2035 年）
市场调查报告书
商品编码
1628907

全球模内电子 (IME) 市场（2025-2035 年）

The Global Market for In-mold Electronics (IME) 2025-2035
出版日期: | 出版商: Future Markets, Inc. | 英文 83 Pages, 47 Tables, 10 Figures | 订单完成后即时交付

价格

模内电子（IME），也称为plastronics，是一种将传统注塑与印刷电子结合的创新技术。此製程允许将触控感测器、显示器和照明等功能电子元件在成型过程中直接嵌入到塑胶零件中。此製程使得透过单一製造步骤创建智慧表面和复杂的电子功能成为可能。 IME 技术允许将触控感测器、照明和其他电子功能嵌入到 3D 模製表面，从而简化製造流程并降低组装成本。这不仅提高了产品的性能，而且由于无需外部组件而改善了外观。

IME 的优点如下：

  • 设计弹性：IME 可以实现传统电子整合方法无法实现的复杂几何形状和设计。
  • 耐用性：电子产品受到模製塑胶的保护，使其能够抵抗磨损和环境因素的影响。
  • 成本效益：透过将多种功能整合到一个元件中，IME 能够降低组装成本并提高製造效率。

IME 技术通常涉及三个步骤：

  • 印刷电子电路：在此步骤中，使用导电墨水来形成必要的电子电路。
  • 成型：此步骤非常重要，可确保电子电路无缝地融入最终产品中。
  • 成型：最后，将成型电路封装到成型部件中，以创建耐用、功能齐全的组件，用于各种应用，包括汽车内饰、消费电子产品和医疗设备。它是一种电子元件。

IME 产品在汽车、消费性电子产品和医疗设备等节省空间和重量至关重要的行业尤其有益。除了改进产品设计之外，该技术还消除了组装单独电子元件的需要，从而提高了耐用性和性能，在单个模製部件中实现了用户友好界面和复杂电子系统。 IME 产品旨在满足对智慧连网设备日益增长的需求，使製造商能够在竞争激烈的市场中创新和差异化其产品。

本报告对快速成长的全球模内电子 (IME) 市场进行了深入分析，提供了 2025-2035 年的主要趋势、技术、材料、应用和市场预测。

目录

第 1 章执行摘要

  • 表面设计限制
  • 用途
  • IME 製造
  • 投资
  • 永续性
  • 市场展望
  • 市场预测

第 2 章简介

第 3 章 IME 製造

  • IME 元件
  • 输入法製作
  • 实施方法
  • 其他生产方法
  • 功能性薄膜附着力
  • 金属化技术
  • MID 技术
  • 多功能复合材料 增材製造

第 4 章 整合 IME 元件

  • 电容式感应技术
  • 照明
  • 触觉
  • 3D显示
  • 天线

第 5 章 IME 材料

  • 概述
  • 导电墨水
  • 介电墨水
  • 导电胶
  • 透明导电材料
  • 基材，热塑性材料

第6章 输入法市场

  • 汽车
    • 概述
    • 商业用途
    • 全球市场预测
  • 白色家电
    • 概述
    • 用途
    • 全球市场预测
  • 医疗设备
    • 概述
    • 用途
    • 全球市场预测
  • 行业
    • 概述
    • 用途
  • 穿戴式电子产品
    • 概述
    • 用途
  • 其他市场与应用

第7章 公司简介

第 8 章参考资料

In-mold electronics (IME), also sometimes known as plastronics, is an innovative technology that combines traditional injection molding with printed electronics. This process allows for the embedding of functional electronic elements, such as touch sensors, displays, and lighting, directly into plastic components during the molding process. This process allows for the creation of smart surfaces and complex electronic functionalities within a single manufacturing step. IME technology enables the embedding of touch sensors, lighting, and other electronic functionalities into 3D molded surfaces, resulting in streamlined manufacturing processes and reduced assembly costs. This not only enhances product performance but also improves aesthetics by removing the need for external components.

The advantages of IME include:

  • Design Flexibility: IME enables the creation of complex shapes and designs that are not possible with traditional electronics integration methods.
  • Durability: The electronic components are protected within the molded plastic, making them more resistant to wear and environmental factors.
  • Cost Efficiency: By integrating multiple functions into a single part, IME can reduce assembly costs and improve manufacturing efficiency.

IME technology typically involves a three-step process:

  • Printing of Electronic Circuits: This step includes the application of conductive inks to create the necessary electronic pathways.
  • Forming: The printed circuits are then formed into the desired shape, which is crucial for ensuring that the electronics fit seamlessly into the final product.
  • Molding: Finally, the formed circuits are encapsulated within a molded part, creating a durable and functional electronic component that can be used in various applications, such as automotive interiors, consumer electronics, and medical devices.

IME products are particularly beneficial in industries such as automotive, consumer electronics, and medical devices, where space and weight savings are critical. The technology not only enhances product design but also improves durability and performance by eliminating the need for separate electronic assemblies, enabling the creation of user-friendly interfaces and complex electronic systems within a single molded part. IME products are designed to meet the growing demand for smart, connected devices, enabling manufacturers to innovate and differentiate their offerings in competitive markets.

"The Global Market for In-Mold Electronics (IME) 2025-2035" provides an in-depth analysis of the rapidly growing global in-mold electronics (IME) market, examining key trends, technologies, materials, applications, and market forecasts from 2025 to 2035. The study offers detailed insights into this transformative technology that integrates electronic functionality directly into molded plastic components, revolutionizing manufacturing across multiple industries. The report provides extensive coverage of IME manufacturing processes, including detailed analysis of production methods, component integration, and material requirements. Key focus areas include surface functionalization technologies, conductive inks, transparent conductors, and substrate materials essential for successful IME implementation.

Market analysis covers major application sectors including:

  • Automotive human-machine interfaces
  • White goods and appliances
  • Medical devices
  • Industrial controls
  • Wearable electronics

The study examines critical aspects of IME technology including:

  • Manufacturing processes and requirements
  • Component integration strategies
  • Materials development and selection
  • Quality control and testing
  • Regulatory considerations
  • Sustainability aspects

Technical coverage includes detailed analysis of:

  • Conductive ink formulations
  • Transparent conductive materials
  • Substrate and thermoplastic selection
  • Integration of electronic components
  • Surface treatment technologies
  • Testing and validation methods

The report features comprehensive market data including:

  • Market size and growth projections (2025-2035)
  • Revenue forecasts by application sector
  • Regional market analysis
  • Technology adoption trends
  • Competitive landscape assessment. The report profiles leading companies across the IME value chain, including Canatu, CHASM Technologies, Covestro, Dupont, E2IP Technologies, Elantas, Embega, FORVIA Faurecia, Genes'Ink, Henkel, Kimoto, Nissha, TactoTek Oy, and more. These companies represent various segments of the IME industry including material suppliers, equipment manufacturers, technology developers, and end-product manufacturers.

Special focus is placed on emerging technologies and innovations:

  • Advanced material developments
  • Novel manufacturing processes
  • Integration strategies
  • Future technology roadmaps
  • Market opportunities and challenges

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. Design limitations on surfaces
  • 1.2. Applications
  • 1.3. IME manufacturing
  • 1.4. Investments
  • 1.5. Sustainability
  • 1.6. Market outlook
  • 1.7. Market forecasts

2. INTRODUCTION

  • 2.1. Functionality Integration
  • 2.2. 3D Electronics
  • 2.3. IME Value Chain

3. IME MANUFACTURING

  • 3.1. IME components
  • 3.2. IME production
  • 3.3. Implementation approaches
    • 3.3.1. Hybrid
    • 3.3.2. One-film vs two-film
    • 3.3.3. Implementation of multilayer circuits
    • 3.3.4. Integration of integrated circuits in IME
    • 3.3.5. Print-then-plate
    • 3.3.6. Automation
    • 3.3.7. Transfer printing technology
    • 3.3.8. Evaporated line technology
    • 3.3.9. Capacitive touch functionality
  • 3.4. Other manufacturing methods
  • 3.5. Functional film bonding
  • 3.6. Metallization Methods
  • 3.7. MID technology
    • 3.7.1. Aerosol deposition
    • 3.7.2. Laser Direct Structuring (LDS)
    • 3.7.3. Two shot molding
    • 3.7.4. 3D surfaces
    • 3.7.5. Impulse printing technology
    • 3.7.6. Pad printing
    • 3.7.7. Spray metallization
  • 3.8. Multifunctional composites
  • 3.9. Additive manufacturing

4. IME COMPONENTS INTEGRATION

  • 4.1. Capacitive sensing technology
    • 4.1.1. Overview
    • 4.1.2. Operation
  • 4.2. Lighting
  • 4.3. Haptics
  • 4.4. 3D Displays
  • 4.5. Antenna

5. MATERIALS FOR IME

  • 5.1. Overview
  • 5.2. Conductive inks
    • 5.2.1. Materials
    • 5.2.2. Stretchable inks
    • 5.2.3. Inks for IME
  • 5.3. Dielectric inks
  • 5.4. Electrically conductive adhesives
  • 5.5. Transparent conductive materials
    • 5.5.1. Overview
    • 5.5.2. Types
    • 5.5.3. Carbon nanotube (CNT) films
    • 5.5.4. Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS)
    • 5.5.5. Carbon nanobuds
    • 5.5.6. Metal mesh
  • 5.6. Substrate and thermoplastic materials

6. MARKETS FOR IME

  • 6.1. Automotive
    • 6.1.1. Overview
    • 6.1.2. Commercial applications
      • 6.1.2.1. Sensing
      • 6.1.2.2. Headlamp covers
      • 6.1.2.3. Steering Wheel
    • 6.1.3. Global market forecast
  • 6.2. White Goods
    • 6.2.1. Overview
    • 6.2.2. Applications
    • 6.2.3. Global market forecast
  • 6.3. Medical Devices
    • 6.3.1. Overview
    • 6.3.2. Applications
    • 6.3.3. Global market forecast
  • 6.4. Industrial
    • 6.4.1. Overview
    • 6.4.2. Applications
  • 6.5. Wearable Electronics
    • 6.5.1. Overview
    • 6.5.2. Applications
  • 6.6. Other Markets and Applications

7. COMPANY PROFILES

8. REFERENCES

List of Tables

  • Table 1. Surface Functionalization Technologies Comparison
  • Table 2. In-Mold Electronics Applications
  • Table 3. IME Manufacturing Requirements
  • Table 4. Competing Manufacturing Methods
  • Table 5. Smart Surface Manufacturing Methods
  • Table 6. Investment in In-Mold Electronics
  • Table 7. IME Applications and Stage of Development
  • Table 8. IME Benefits and Challenges
  • Table 9. Global Market Forecast for IME Component Area by Application, 2025-2035(m2)
  • Table 10. Global Market Forecast for IME Revenue by Application, 2025-2035 (US$ Millions)
  • Table 11. In-mold Electronics Applications and Markets
  • Table 12. Approaches to 3D Printed Electronics
  • Table 13. Manufacturing of IME Components
  • Table 14. Manufacturing Methods Comparison
  • Table 15. IME Production Equipment
  • Table 16. IC Package Requirements for IME
  • Table 17. Process Comparison
  • Table 18. Comparison of Metallization Methods
  • Table 19. MID Manufacturing Methods Comparison
  • Table 20. Applications of LDS
  • Table 21. Applications for Printing Wiring onto 3D Surfaces
  • Table 22. Processes for 3D Electronics
  • Table 23. Printed Capacitive Sensor Technologies
  • Table 24. Conventional Backlighting vs Integrated Lighting with IME
  • Table 25. Materials for IME
  • Table 26. Material Composition comparison of IME vs Conventional HMI
  • Table 27. IME Materials companies
  • Table 28. Conductive Ink Materials
  • Table 29. In-mold Conductive Inks
  • Table 30. Conductive Ink Requirements for IME
  • Table 31. Properties of Stretchable/Thermoformable Conductive Inks
  • Table 32. Types of Conductive Adhesives
  • Table 33. Transparent Conductive Materials for IME
  • Table 34. Carbon Nanotube In-mold Films
  • Table 35. PEDOT:PSS Films
  • Table 36. Substrates and Thermoplastics for IME
  • Table 37.IME in Automotive HMI
  • Table 38. Commercial Automotive In-mold Decoration
  • Table 39. Global market forecast for IME in the Automotive Market 2025-2035 (USD Millions)
  • Table 40. Applications of IME in White Goods
  • Table 41. Example IME for White Goods products
  • Table 42. Global market forecast for IME in White Goods Market 2025-2035 (USD Millions)
  • Table 43. Medical Device Applications
  • Table 44. Global market forecast for IME in Medical Devices Market 2025-2035 (USD Millions)
  • Table 45. Industrial IME Applications
  • Table 46. Wearable IME Applications
  • Table 47. Other markets and applications for IME

List of Figures

  • Figure 1. IME device
  • Figure 2. IME manufacturing process flow
  • Figure 3. Global Market Forecast for IME Component Area by Application, 2025-2035 (m2)
  • Figure 4. Global Market Forecast for IME Revenue by Application, 2025-2035 (US$ Millions)
  • Figure 5. IME Value Chain
  • Figure 6. Global market forecast for IME in the Automotive Market 2025-2035 (USD Millions)
  • Figure 7. Top panel of the remote control, made with in-mold decoration (IMD)
  • Figure 8. Global market forecast for IME in White Goods Market 2025-2035 (USD Millions)
  • Figure 9. Global market forecast for IME in Medical Devices Market 2025-2035 (USD Millions)
  • Figure 10. Origo Steering Wheel