查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
全球MicroLED显示器市场（2026-2036）
市场调查报告书
商品编码
1863596

全球MicroLED显示器市场（2026-2036）

The Global MicroLED Displays Market 2026-2036
出版日期: | 出版商: Future Markets, Inc. | 英文 574 Pages, 104 Tables, 120 Figures | 订单完成后即时交付

价格

2025年，全球MicroLED显示器市场正处于关键转折点。经过近二十年的技术发展，它正从长期研发阶段过渡到早期商业化阶段。儘管苹果在2024年取消了其MicroLED智慧手錶项目，导致ams-Osram位于马来西亚居林22号工厂关闭，但产业发展势头正在稳步恢復，各方对机会和阻碍因素都有清醒的认识，并抱着务实的预期。

MicroLED生态系统由120多家公司组成，涵盖了从外延晶圆生长到最终系统整合的整个价值链。在地域分布方面，台湾（占35%的产能，拥有最垂直整合的生态系统）、中国大陆（40%，主要得益于政府大力支持的扩张）、韩国（15%，专注于高端应用）以及美国/欧洲（10%，推动新型架构和AR/VR应用的创新）。市场上存在两条截然不同的技术路径：基于大尺寸TFT（薄膜电晶体）的传输技术将应用于电视、汽车和数位看板等大尺寸显示器；而基于硅的LED（LEDoS）微型显示器将应用于增强现实（AR）头显，需要超过2000 PPI的超高像素密度。

经过漫长的概念验证阶段，2025年将标誌着大规模生产的开始，届时三座大型晶圆厂－台湾的ENNOSTAR、中国扬州的HC SemiTek和中国厦门/湖北的三安光电－将开始投产。这些是业内首批专用的大批量生产设施，标誌着该技术从实验室演示过渡到商业可行性。尤其值得关注的是台湾友达光电（AUO）的成就。该公司已成功实现4.5G量产，为Garmin的fenix 8 Pro MicroLED智慧手錶（首款真正意义上的商用MicroLED可穿戴设备）以及索尼-本田电动车的外部显示器提供产品。业内人士将友达光电的这条生产线描述为 "成败在此一举" 的时刻，指出成功将证明MicroLED的製造经济效益，并刺激更广泛的产能投资；而失败则可能在未来几年内限制MicroLED的应用范围，使其仅限于小众领域。

目前，大萤幕显示器是MicroLED技术最成熟的商业领域，三星和LG等厂商推出了尺寸从89吋到300吋以上的高阶MicroLED电视，售价在10万美元到30万美元之间。这些模组化显示器采用基于雷射的大容量传输技术，展现了MicroLED在亮度（超过1000尼特）、对比度（超过100000:1）和使用寿命方面的优势。然而，成本结构仍然是大众市场渗透的一大障碍，晶片成本占组件成本的 40-50%，而目前 15 x 30 至 20 x 40 微米的晶片尺寸无法达到实现消费者可承受范围所需的 10 微米以下尺寸。

汽车应用展现出强劲的近期潜力，尤其是在抬头显示器 (HUD) 领域。 HUD 对亮度（扣除光学损耗后 >15,000 尼特）和安全关键可靠性的要求使其能够承受较高的价格。 2025 年的分析将正在开发的 HUD 分为三类：全景 HUD（15-20 度视场角）、AR-HUD（将导航资讯迭加在实际道路上）和紧凑型平面 HUD（面向中檔车辆，系统成本为 400-600 美元）。鑑于汽车产业认证週期为三至五年，预计MicroLED的实际应用将在2027年至2030年间实现。

本报告探讨了全球MicroLED显示器市场，并对MicroLED生态系统在各种应用领域面临的关​​键技术挑战、生产规模化和市场接受度进行了可靠的分析。

目录

第一章 摘要整理

  • Mini LED市场
  • Micro LED市场
  • 全球显示器市场
  • Micro LED的优势
  • Micro LED微显示器的积层製造
  • Micro LED的应用
  • 市场与技术挑战
  • 近期行业发展
  • Micro LED技术趋势（2024-2025）
  • 缺乏标准化和技术融合（2025）
  • 全球Micro LED出货量预测（2036-2036）
  • 成本演进路线图
  • 竞争格局
  • 技术趋势
  • Micro LED 效率和显示功耗（2025）
  • 製造基础建设现况及发展趋势
  • 应用现况及商业化现况（2025）
  • Micro LED 生态系统

第二章 技术介绍

  • 什么是 Micro LED？
  • MiniLED (mLED) 与 MicroLED (MicroLED) 的比较

第三章：製造

  • MicroLED 製造设施
  • 製造成熟度谱
  • 供应链格局（2025 年）
  • 装置开发动态
  • 外延和晶片加工
  • 晶片製造
  • 晶片尺寸演变
  • MicroLED 性能
  • 转移、组装和整合技术
  • 大规模转移（2025 年）：技术融合与持续挑战
  • 良率管理、测试与修復
  • 製造成本演进与经济可行性路径
  • 製造准备评估与瓶颈分析（2025 年）

第四章：缺陷

管理
  • 概述
  • 缺陷类型
  • 冗余技术
  • 修復

第五章：颜色转换

  • 技术比较
  • 全彩转换
  • 紫外线LED
  • 彩色滤光片
  • 堆迭式RGB微型LED
  • 三面板微型LED投影仪
  • 磷光颜色转换
  • 量子点颜色转换
  • 量子阱
  • 提升影像质量

第六章：光管理

  • 概述
  • 光捕获方法
  • 微反射光学阵列
  • 用于工程化定向发射轮廓的积层製造（AM）

章节7：背板和驱动

  • 概述
  • 技术与材料

第 8 章 MicroLED 市场

  • 消费性电子显示器
  • 生技与医疗
  • 汽车
  • 虚拟实境 (VR)、扩增实境 (AR) 和混合实境 (MR)
  • 透明显示器
  • 镜面显示器
  • 资料中心光互连

第 9 章：公司简介（89 家公司简介）

第 10 章：报告目标与目的

第 11 章：参考文献

The global microLED display market stands at a pivotal juncture in 2025, transitioning from prolonged research and development into early-stage commercialization after nearly two decades of technological refinement. Following Apple's high-profile cancellation of its microLED smartwatch project in 2024-which led to the dismantling of ams-Osram's dedicated Kulim 2 fab in Malaysia-the industry momentum is cautiously rebuilding with more realistic expectations and a clearer understanding of both opportunities and constraints.

The microLED ecosystem comprises approximately 120+ active companies spanning the complete value chain from epitaxial wafer growth through final system integration. Geographic concentration centers on Taiwan (35% of capacity) with the most vertically integrated ecosystem, China (40%) pursuing aggressive government-backed expansion, South Korea (15%) focusing on premium applications, and US/Europe (10%) driving innovation in novel architectures and AR/VR applications. The market exhibits two distinct technology trajectories: mass-transferred TFT-based large displays for television, automotive, and signage applications; and LED-on-Silicon (LEDoS) microdisplays targeting augmented reality headsets requiring extreme pixel densities exceeding 2,000 PPI.

After an extended proof-of-concept phase, 2025 marks the first meaningful production with three major high-volume fabs ramping operations: ENNOSTAR in Taiwan, HC SemiTek in Yangzhou, China, and Sanan Optoelectronics in Xiamen/Hubei. These represent the industry's first dedicated high-volume manufacturing facilities, signaling transition from laboratory demonstrations to commercial viability. Critically, AU Optronics' Gen 4.5 mass transfer line in Taiwan has achieved commercial production, delivering the Garmin fenix 8 Pro MicroLED smartwatch-the first true commercial microLED wearable-and Sony-Honda's electric vehicle exterior display. Industry observers describe AUO's production line as a "make-or-break moment": success could validate manufacturing economics and trigger broader capacity investments; failure could relegate microLED to niche applications for years.

Large format displays currently represent the most mature commercial segment, with Samsung and LG selling premium microLED televisions ranging from 89 to 300+ inches at price points between $100,000 and $300,000. These modular displays leverage laser-based mass transfer technology and demonstrate microLED's superiority in brightness (>1,000 nits), contrast (>100,000:1), and lifetime. However, cost structures remain prohibitive for mass-market penetration, with die costs comprising 40-50% of bill-of-materials and current 15x30 to 20x40 micrometer chip sizes preventing the sub-10 micrometer dimensions required for consumer affordability.

Automotive applications show strong near-term potential, particularly for head-up displays where brightness requirements (>15,000 nits after optical losses) and safety-critical reliability justify premium pricing. The 2025 analysis identifies three HUD categories under development: panoramic HUDs (15-20-degree field of view), AR-HUDs enabling navigation overlay on actual roadways, and compact in-plane HUDs targeting mid-range vehicles at $400-600 system cost. Automotive qualification cycles extend 3-5 years, positioning 2027-2030 as the realistic adoption window.

Augmented reality represents microLED's most compelling long-term opportunity but faces fundamental physics challenges. Brightness emerges as the primary constraint: AR glasses require 50,000-100,000 nits at the microdisplay to deliver adequate visibility after 85% optical losses through projection systems and waveguides. While microLED alone achieves necessary brightness levels, efficiency at submicron emitter sizes remains insufficient, particularly for red wavelengths achieving only 1-3% external quantum efficiency versus the 5-8% required. Recent industry activity demonstrates commitment despite challenges: Mojo Vision raised $75 million (Series B-prime, led by Vanedge Capital) for its innovative 300mm GaN-on-silicon platform combining quantum dot color conversion, while GoerTek invested $100 million to acquire UK-based Plessey Semiconductors through subsidiary Haylo, securing access to Plessey's ultra-high-resolution AR microdisplay technology and recent Meta collaboration producing 6,000,000-nit red microLED displays.

Critical challenges constraining market expansion include: red LED efficiency degradation at small sizes (especially below 3 micrometer); mass transfer yields requiring >99.99% for consumer economics versus current 99.5-99.8%; absence of industry standardization multiplying non-recurring engineering costs; and CMOS backplane development costs ($5-20 million NRE) creating barriers for startups. The industry faces a fundamental conundrum: volume production capability is required to validate commercial legitimacy and drive cost reduction, yet premature investment risks equipment obsolescence as technologies continue evolving.

Supply chains are crystallizing with most leading display makers now controlling or aligned with microLED chip manufacturers. Startup funding increased 10-15% in 2025 versus 2024, though remaining below the 2023 peak, while fab investments proceed cautiously. Industry consensus suggests if current production lines demonstrate technical and economic success, additional capacity will emerge post-2027; conversely, if yields, costs, and manufacturability cannot improve substantially, AR/VR may remain the sole high-volume application alongside specialty B2B displays. The global market trajectory depends critically on the next 18-24 months as first-generation commercial products either validate or challenge the decade-long development investment.

"The Global MicroLED Market 2026-2036" delivers authoritative analysis of the microLED ecosystem as it navigates critical technical challenges, manufacturing scale-up, and market adoption across diverse applications from premium televisions and automotive displays to augmented reality headsets and emerging data center optical interconnects.

The analysis encompasses the complete value chain from epitaxial wafer growth and chip fabrication through mass transfer equipment, backplane integration, display assembly, and system-level products. Application-specific analysis provides technical requirements, cost structures, adoption timelines, and market forecasts for consumer electronics (TVs, smartphones, wearables, laptops), automotive (HUD systems including panoramic, AR-HUD, and in-plane variants), AR/VR/MR (addressing the fundamental brightness constraint for near-eye displays), biomedical devices, transparent displays, and the potentially transformative optical interconnects for AI data centers. Each segment includes SWOT analysis, competitive dynamics, product developer profiles, and realistic commercialization pathways accounting for technical maturity and economic viability.

Manufacturing analysis details epitaxy and chip processing, competing mass transfer technologies (laser-based dominating large displays, stamp-based leading high-PPI panels, fluidic self-assembly facing uncertain prospects), backplane options (TFT for large format, CMOS for microdisplays), yield management and repair strategies, and color conversion approaches (RGB side-by-side versus quantum dot conversion). The report documents why multi-step transfer with chip-on-carrier has become the industry standard, analyzes equipment vendor dynamics as many pause microLED development awaiting customer commitments, and projects cost evolution roadmaps showing pathways to consumer price points.

Market forecasts project unit volumes and revenues by application through 2036, accounting for the bifurcation between mass-market consumer applications (conditional on solving cost and efficiency challenges) and high-value specialty segments (automotive HUDs, AR microdisplays, medical, B2B) where premium pricing justifies current economics.

Technical deep-dives examine die architecture evolution toward target sizes (submicron for AR, 10micrometer mid-term for large displays, 5micrometer long-term aspiration), external quantum efficiency status for blue/green/red emitters, system-level optimization recognizing backplane-LED co-dependencies, driving schemes (PWM versus PAM, TFT versus CMOS), light management, defect management strategies, and the critical search for viable red LED technology at small scales. The report synthesizes equipment landscape assessments, geographic manufacturing capacity analysis, and technology maturity matrices providing actionable intelligence for technology developers, equipment suppliers, display manufacturers, consumer electronics brands, automotive OEMs, investors, and strategic planning teams navigating this complex, high-stakes market.

Report Contents include:

  • MiniLED and MicroLED market status and differentiation
  • Global display market context (OLED, quantum dots, technology assessment)
  • MicroLED benefits and value propositions
  • Application landscape overview
  • Market and technology challenges (die cost, system efficiency, mass transfer, yield management, standardization, application-specific barriers)
  • Recent industry developments (2024-2025 transition, Apple cancellation impact, first commercial products, fab ramp-ups, investment patterns)
  • Standardization deficit analysis and technology convergence status
  • Global shipment forecasts to 2036 (units and revenues by market segment)
  • Cost evolution roadmap and competitiveness timelines
  • Competitive landscape assessment
  • Technology trends and progress status
  • Technology Introduction
    • MicroLED definition, architecture, and operating principles
    • MiniLED versus MicroLED comparison
    • Display configurations and system architectures
    • Development history and commercialization timeline
    • Production technologies and integration approaches
    • Mass transfer technologies overview
    • Comparison to LCD, OLED, and quantum dot displays
    • MicroLED specifications, advantages, and limitations
    • Transparency, borderless, and flexibility capabilities
    • Tiled display architectures
    • Cost structures and die size relationships
  • Manufacturing
    • Manufacturing maturity spectrum and readiness assessment
    • 2025 supply chain status (vertical integration, technology platforms, fab ramp-ups)
    • Equipment development dynamics and vendor ecosystem
    • Epitaxy and chip processing (materials, substrates, MOCVD, uniformity, RGB designs)
    • Die size evolution and 2025 reality
    • MicroLED performance characteristics (EQE, stability, size dependency, surface recombination)
    • Transfer, assembly, and integration technologies (monolithic, heterogeneous wafers, GaN-on-silicon)
    • Mass transfer methods detailed analysis (elastomer stamp, laser-enabled, electrostatic, fluidic self-assembly, pick-and-place)
    • Mass transfer in 2025: technology convergence and persistent challenges
    • Chip-on-carrier (CoC) as industry standard
    • Transfer technology segmentation by application
    • Equipment investment challenges and risks
    • Yield management, testing, and repair strategies and equipment
    • Manufacturing cost evolution and economic viability pathways
    • Cost structure analysis for representative applications
    • Die cost, transfer, testing, and total module cost reduction roadmaps
    • Manufacturing readiness assessment and bottleneck analysis
    • Process maturity matrix
    • Geographic manufacturing landscape
  • Defect Management
    • Overview and critical importance
    • Defect types and sources
    • Redundancy techniques and architectures
    • Repair technologies (laser micro-trimming, replacement strategies)
  • Color Conversion Technologies
    • Technology comparison and selection criteria
    • Full color conversion approaches
    • UV LED pumping
    • Color filters
    • Stacked RGB microLEDs
    • Three-panel projectors
    • Phosphor color conversion (materials, thermal stability, challenges)
    • Quantum dot color conversion (operation modes, cadmium vs. cadmium-free, perovskite QDs, graphene QDs)
    • QD display types and pixel patterning techniques
    • Quantum wells
    • Image quality optimization
  • Light Management
    • Overview and importance for efficiency
    • Light capture methods and optical design
    • Micro-catadioptric optical arrays
    • Additive manufacturing for engineered emission profiles
  • Backplanes and Driving
    • Overview of backplane technologies
    • TFT materials and OLED pixel driving heritage
    • Passive versus active matrix addressing
    • Pulse width modulation (PWM) and driving schemes
    • Voltage considerations for microLEDs
    • RGB driving schemes
    • LTPS backplane integration
  • Markets for MicroLEDs
    • Consumer Electronic Displays:
      • Market map and ecosystem players
      • Market adoption roadmap and timeline
      • Large flat panel displays and TVs (Samsung, LG products; 2025 manufacturing advances)
      • Smartwatches and wearables (first commercial products, industry inflection point)
      • Smartphones (OLED cost gap analysis)
      • Laptops, monitors, and tablets (IT/productivity applications)
      • Foldable and stretchable displays (global market, applications, product developers)
      • SWOT analysis
    • Biotech and Medical:
      • Global medical display market
      • Applications (implantable devices, lab-on-chip, endoscopy, surgical displays, phototherapy, biosensing, brain-machine interfaces)
      • Product developers
      • SWOT analysis
    • Automotive:
      • Global automotive display market
      • Applications (cabin displays, head-up displays with detailed HUD categories analysis, exterior signaling and lighting)
      • Current HUD limitations and alternative technology comparison
      • HUD application categories (panoramic, AR-HUD, in-plane)
      • Product developers
      • SWOT analysis
    • Virtual Reality (VR), Augmented Reality (AR), and Mixed Reality (MR):
      • Global VR/AR/MR market
      • Brightness as main constraint for near-eye displays (critical 2025 analysis)
      • Applications (AR/VR smart glasses and HMDs, microLED contact lenses)
      • Products developers
      • SWOT analysis
    • Transparent Displays:
      • Global transparent display market
      • Applications (smart windows, display glass overlays)
      • Market forecasts and technology adoption (2025)
      • Product developers
      • SWOT analysis
    • Mirror Displays:
      • Technology concept and construction
      • Applications (automotive mirrors, smart home, retail, security)
    • Optical Interconnects for Data Centers:
      • Market context and opportunity for AI/HPC
      • Technical requirements for optical interconnects
      • MicroLED integration with silicon photonics
      • Market potential and forecast
      • Key technical challenges
      • Competitive landscape
  • Company Profiles: Detailed profiles including company background, technology approach, product portfolio, partnerships, manufacturing capabilities, and strategic positioning. Companies profiled include Aledia, ALLOS Semiconductors GmbH, Apple, AUO, Avicena, BOE Technology Group Co. Ltd., C Seed, CEA-Leti, Cellid Inc., ChipFoundation, eLux Inc., Enkris, Ennostar, EpiPix Ltd., Epileds Technologies, Focally, Foxconn Electronics, Fronics, HannStar Display Corp., HC SemiTek Corporation, Ingantec, Innolux Corporation, Innovation Semiconductor, Innovision, Jade Bird Display (JBD), Japan Display Inc. (JDI), Konka Group, Kopin Corporation, Kubos Semiconductors, LG Display Co. Ltd. and more......

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. The MiniLED market
  • 1.2. The MicroLED market
  • 1.3. The global display market
    • 1.3.1. OLEDs
    • 1.3.2. Quantum dots
    • 1.3.3. Display technologies assessment
  • 1.4. Benefits of MicroLEDs
  • 1.5. Additive manufacturing for microLED micro-displays
  • 1.6. MicroLEDs applications
  • 1.7. Market and technology challenges
    • 1.7.1. MicroLED Die Cost, Performance and Manufacturing Infrastructure
    • 1.7.2. System-Level Efficiency and Backplane-LED Co-Optimization
    • 1.7.3. Mass Transfer Equipment and Technologies
    • 1.7.4. Yield Management Strategies and Equipment
    • 1.7.5. Standardization Deficit
    • 1.7.6. Application-Specific Challenges
  • 1.8. Recent Industry developments
    • 1.8.1. MicroLED Industry Developments 2025
    • 1.8.2. CES 2025 MicroLED products and prototypes
    • 1.8.3. The Watershed Year: 2024-2025 Transition
    • 1.8.4. Apple's Project Cancellation and Immediate Aftermath (2024)
    • 1.8.5. 2025: The Beginning of Commercial Reality
      • 1.8.5.1. First Commercial Products Enter Production
      • 1.8.5.2. AUO's G4.5 Production Line
      • 1.8.5.3. High-Volume MicroLED-Dedicated Chip Fabs Begin Ramping (2025)
    • 1.8.6. Future Fab Investment Outlook
      • 1.8.6.1. Investment Dynamics and the Industry Conundrum
    • 1.8.7. Current Investment Patterns (2025)
      • 1.8.7.1. Risk-Based Investment Hierarchy
      • 1.8.7.2. Equipment Manufacturer Behaviour
    • 1.8.8. Industry Maturity and Realistic Expectations
  • 1.9. MicroLED Technology Trends 2024-2025
    • 1.9.1. Red LED Breakthrough Wave
    • 1.9.2. Mass Production Inflection Point
    • 1.9.3. Quantum Dot Colour Conversion Dominance
    • 1.9.4. Stacked RGB Architecture Emergence
    • 1.9.5. Mass Transfer Technology Maturation
    • 1.9.6. AR/VR Microdisplay Dominance
    • 1.9.7. Automotive Display Expansion
    • 1.9.8. Strategic Consolidation & Partnerships
    • 1.9.9. Apple Watch Cancellation Impact
    • 1.9.10. Flexible & Transparent Display Innovations
    • 1.9.11. MicroIC & Novel Backplane Architectures
    • 1.9.12. Inspection & Yield Management Focus
    • 1.9.13. Wavelength-Specific Innovations
    • 1.9.14. Large-Format Display Scale-Up
    • 1.9.15. Alternative Materials & Novel Structures
      • 1.9.15.1. Perovskite Quantum Dot LEDs (PQDs)
      • 1.9.15.2. Colloidal Quantum Dots (CQDs)
      • 1.9.15.3. Nanowire and Nanorod LEDs
      • 1.9.15.4. Organic LEDs (OLEDs) - Microsized
      • 1.9.15.5. Electroluminescent Quantum Dots (EL-QDs)
      • 1.9.15.6. Monolithic Integration Architectures
      • 1.9.15.7. Carbon Nanotube and 2D Material Approaches
  • 1.10. Standardization Deficit and Technology Convergence (2025)
    • 1.10.1. The Persistent Standardization Problem
    • 1.10.2. Areas Lacking Standardization
      • 1.10.2.1. Process Flow Architecture
      • 1.10.2.2. When and Where to Perform Metrology, Testing, and Repair
      • 1.10.2.3. Equipment Interfaces and Automation
      • 1.10.2.4. LED Specifications and Binning
      • 1.10.2.5. Colour Conversion and Full-Colour Architectures
    • 1.10.3. The Costs of Non-Standardization
      • 1.10.3.1. Multiplying Engineering Samples and NRE Costs
    • 1.10.4. Stranded Asset Risk for Early Movers
    • 1.10.5. Some Convergence Is Occurring
      • 1.10.5.1. Multi-Step Transfer with Intermediate Carriers Now Dominant
    • 1.10.6. Transfer Technology Segmentation by Application
    • 1.10.7. LED Chip Manufacturing Approaching Maturity
    • 1.10.8. Why Standardization Remains Elusive
      • 1.10.8.1. The Path Forward: Collaborative Standardization Efforts Needed
  • 1.11. Global shipment forecasts for MicroLEDs to 2036
    • 1.11.1. Units by Market
    • 1.11.2. Revenue by Market (Million USD)
  • 1.12. Cost evolution roadmap
  • 1.13. Competitive Landscape
  • 1.14. Technology Trends
    • 1.14.1. Progress on All Fronts, But More Is Needed
    • 1.14.2. MicroLED Die Architecture and Size (2025 Status)
      • 1.14.2.1. The Die Size Dilemma: Economic Reality vs. Technical Requirements
      • 1.14.2.2. Die Cost as BOM Driver
      • 1.14.2.3. Current Size Reality (2025)
      • 1.14.2.4. Target Roadmap: The Size Reduction Challenge
        • 1.14.2.4.1. Consumer Applications Requirement: less than 10 micrometer
        • 1.14.2.4.2. Mid-Term Goal for Large Displays: 10 micrometer
        • 1.14.2.4.3. Long-Term Aspirational Goal: ~5 micrometer
      • 1.14.2.5. AR/LEDoS Target: Submicron Emitter Sizes
      • 1.14.2.6. Why the Gap Persists: Technical Barriers to Size Reduction
  • 1.15. MicroLED Efficiency and Display Power Consumption (2025 Status)
    • 1.15.1. System-Level Efficiency: Beyond Individual LED Performance
    • 1.15.2. 2025 Industry Realization: Backplane and LED Co-Optimization Is Essential
      • 1.15.2.1. Backplane Limitations Constraining LED Performance
    • 1.15.3. LED Design Choices Affecting Backplane Requirements
    • 1.15.4. High-Voltage LEDs and MicroLEDs: An Emerging Approach
      • 1.15.4.1. Concept and Benefits
    • 1.15.5. MicroLED EQE: 2025 Overview
      • 1.15.5.1. Blue and Green LED Status
      • 1.15.5.2. Red LED Challenge: The Persistent Problem
      • 1.15.5.3. The Search for the Best Red Technology
      • 1.15.5.4. Improving Internal Quantum Efficiency (IQE)
        • 1.15.5.4.1. IQE Improvement Strategies in 2025
  • 1.16. Manufacturing Infrastructure Status and Evolution
    • 1.16.1. The Equipment Maturity Spectrum
      • 1.16.1.1. Front-End (Epitaxy and Chip Manufacturing): Relatively Mature
      • 1.16.1.2. Why Front-End is Less Risky
      • 1.16.1.3. Mid-Stream (Mass Transfer and Assembly): High Uncertainty
      • 1.16.1.4. Competing Transfer Approaches (2025 Status)
      • 1.16.1.5. The Equipment Vendor Dilemma
      • 1.16.1.6. Backplane and Module Assembly: Moderate Maturity
  • 1.17. Application Status and Commercial Reality (2025)
    • 1.17.1. Overview: From Prototypes to Products
    • 1.17.2. The Application Hierarchy
    • 1.17.3. Smartwatches: The First Consumer Beachhead
      • 1.17.3.1. Garmin fenix 8 Pro MicroLED
      • 1.17.3.2. Advantages for MicroLED in Smartwatches
      • 1.17.3.3. Challenges Specific to Smartwatches
    • 1.17.4. Automotive: Entering Premium EV Market
      • 1.17.4.1. Why Automotive External Displays Are Interesting Entry Point
      • 1.17.4.2. Automotive HUD Applications
      • 1.17.4.3. Automotive Display Technology Comparison
      • 1.17.4.4. Automotive Forecast
    • 1.17.5. Consumer TV Panels
      • 1.17.5.1. The TV Paradox: Perfect Application, Wrong Economics
      • 1.17.5.2. Critical Cost Components Analysis
      • 1.17.5.3. 2025 Price Benchmark: LCD, OLED, Laser TV, and MicroLED
      • 1.17.5.4. Technology Mapping for Large Displays
      • 1.17.5.5. Strategic Implications
      • 1.17.5.6. TV Price Bands and New Technology Adoption Dynamics
      • 1.17.5.7. Risk Factors
    • 1.17.6. Augmented Reality and Virtual Reality Applications
      • 1.17.6.1. The AR Brightness Challenge
      • 1.17.6.2. LED-on-Silicon (LEDoS): The Optimal Architecture for AR
      • 1.17.6.3. Advantages for AR Applications
      • 1.17.6.4. Disadvantages/Challenges
      • 1.17.6.5. Microdisplay Engines Comparison
      • 1.17.6.6. Full-Colour Microdisplays: The Remaining Challenge
      • 1.17.6.7. Companies Leading LEDoS Development
      • 1.17.6.8. Strategic Ecosystem Developments
  • 1.18. MicroLED Ecosystem

2. TECHNOLOGY INTRODUCTION

  • 2.1. What are MicroLEDs?
  • 2.2. MiniLED (mLED) vs MicroLED (micro-LED)
    • 2.2.1. Display configurations
    • 2.2.2. Development
      • 2.2.2.1. Sony
    • 2.2.3. Types
    • 2.2.4. Production
      • 2.2.4.1. Integration
      • 2.2.4.2. Transfer technologies
    • 2.2.5. Comparison to LCD, OLED AND QD
    • 2.2.6. MicroLED display specifications
    • 2.2.7. Commercially available MicroLED products and specifications
    • 2.2.8. Advantages
      • 2.2.8.1. Transparency
      • 2.2.8.2. Borderless
      • 2.2.8.3. Flexibility
    • 2.2.9. Tiled microLED displays
    • 2.2.10. Costs
      • 2.2.10.1. Relationship between microLED cost and die size

3. MANUFACTURING

  • 3.1. MicroLED Manufacturing Facilities
    • 3.1.1. Geographic Distribution Summary
  • 3.2. Manufacturing Maturity Spectrum
  • 3.3. 2025 Supply Chain Status
    • 3.3.1. Vertical Integration and Strategic Alignment
    • 3.3.2. Diverging Technology Platforms
    • 3.3.3. Shared Fundamental Challenges
    • 3.3.4. First High-Volume Fabs Ramping in 2025
    • 3.3.5. Osram Exits Following Apple Cancellation
  • 3.4. Equipment Development Dynamics
    • 3.4.1. Equipment Vendor Dilemma
    • 3.4.2. Current Equipment Development Status (2025)
    • 3.4.3. Impact on Industry
    • 3.4.4. Future Outlook
  • 3.5. Epitaxy and Chip Processing
    • 3.5.1. Materials
    • 3.5.2. Substrates
      • 3.5.2.1. Green gap
    • 3.5.3. Wafer patterning
    • 3.5.4. Metal organic chemical vapor deposition (MOCVD)
    • 3.5.5. Epitaxial growth requirement
    • 3.5.6. Molecular beam epitaxy (MBE)
    • 3.5.7. Uniformity
    • 3.5.8. Manufacturing Infrastructure Reality
      • 3.5.8.1. Scale-Up to High-Volume Production
      • 3.5.8.2. Uniformity Requirements for Small Die
      • 3.5.8.3. Red LED Material Challenges Persist
      • 3.5.8.4. Wafer Size Economics
      • 3.5.8.5. Substrate Technology Evolution
  • 3.6. Chip manufacturing
    • 3.6.1. RGB microLED designs
    • 3.6.2. Epi-film transfer
  • 3.7. Die Size Evolution
    • 3.7.1. Production Reality vs. Research Demonstrations
    • 3.7.2. Why Smaller Die Are Essential Yet Elusive
    • 3.7.3. Technical Challenges Creating Size Floor
    • 3.7.4. Realistic Die Size Roadmap
  • 3.8. MicroLED Performances
    • 3.8.1. Relationship between external quantum efficiency (EQE) and current density
    • 3.8.2. Stability and thermal management
    • 3.8.3. Size dependency
    • 3.8.4. Surface recombination of carriers
    • 3.8.5. Developing efficient high-performance RGB microLEDs
  • 3.9. Transfer, Assembly and Integration Technologies
    • 3.9.1. Monolithic integration
      • 3.9.1.1. Overview
      • 3.9.1.2. Companies
    • 3.9.2. Heterogeneous Wafers
      • 3.9.2.1. Array integration
      • 3.9.2.2. Wafer bonding
      • 3.9.2.3. Hybridization integration
      • 3.9.2.4. Companies
    • 3.9.3. Monolithic microLED arrays
    • 3.9.4. GaN on Silicon
      • 3.9.4.1. Overview
      • 3.9.4.2. Types
        • 3.9.4.2.1. GaN on sapphire
      • 3.9.4.3. Challenges
      • 3.9.4.4. Companies
    • 3.9.5. Mass transfer
      • 3.9.5.1. Chiplet Mass Transfer
      • 3.9.5.2. Elastomer Stamp Transfer (Fine pick and place)
        • 3.9.5.2.1. Overview
        • 3.9.5.2.2. Controlling kinetic adhesion forces
        • 3.9.5.2.3. Pixel pitch
        • 3.9.5.2.4. Micro-transfer printing
        • 3.9.5.2.5. Capillary-assisted transfer printing
        • 3.9.5.2.6. Electrostatic array
        • 3.9.5.2.7. Companies
      • 3.9.5.3. Roll-to-Roll or Roll-to-Panel Imprinting
      • 3.9.5.4. Laser enabled transfer
        • 3.9.5.4.1. Overview
          • 3.9.5.4.1.1. Selective transfer by selective bonding-debonding
        • 3.9.5.4.2. Companies
      • 3.9.5.5. Electrostatic Transfer
      • 3.9.5.6. Micro-transfer
        • 3.9.5.6.1. Overview
        • 3.9.5.6.2. Micro-Pick-and-Place Transfer
        • 3.9.5.6.3. Photo-Polymer Mass Transfer
        • 3.9.5.6.4. Companies
      • 3.9.5.7. Micro vacuum-based transfer
      • 3.9.5.8. Adhesive Stamp
      • 3.9.5.9. Self-Assembly
        • 3.9.5.9.1. Overview
        • 3.9.5.9.2. Fluidically Self-Assembled (FSA) technology
        • 3.9.5.9.3. Magnetically-assisted assembly
        • 3.9.5.9.4. Photoelectrochemically driven fluidic-assembly
        • 3.9.5.9.5. Electrophoretic fluidic-assembly
        • 3.9.5.9.6. Surface energy fluidic-assembly
        • 3.9.5.9.7. Shape-based self-assembly
        • 3.9.5.9.8. Companies
      • 3.9.5.10. All-In-One Transfer
        • 3.9.5.10.1. Overview
        • 3.9.5.10.2. Heterogeneous Wafers in All-in-One Integration
          • 3.9.5.10.2.1. Optoelectronic Array Integration
          • 3.9.5.10.2.2. Wafer Bonding Process and Hybridization
        • 3.9.5.10.3. Companies
    • 3.9.6. Nanowires
      • 3.9.6.1. Overview
        • 3.9.6.1.1. Nanowire Growth on Silicon
        • 3.9.6.1.2. Native EL RGB nanowires
        • 3.9.6.1.3. 3D Integration
    • 3.9.7. Bonding and interconnection
      • 3.9.7.1. Overview
      • 3.9.7.2. Types of bonding
      • 3.9.7.3. Microtube Interconnections
  • 3.10. Mass Transfer in 2025: Technology Convergence and Persistent Challenges
    • 3.10.1. Multi-Step Transfer with CoC as Industry Standard
      • 3.10.1.1. The CoC Process Architecture
      • 3.10.1.2. Why CoC Dominates Despite Adding Complexity
      • 3.10.1.3. Cost Analysis for 100" 4K TV Display
      • 3.10.1.4. Implementation Challenges
    • 3.10.2. Transfer Technology Segmentation by Application
      • 3.10.2.1. Laser-Based Transfer: Dominant for Large Displays
      • 3.10.2.2. Why Laser Dominates Large Displays
      • 3.10.2.3. Limitations
    • 3.10.3. Stamp-Based Transfer: Leading for High-PPI Small/Medium Displays
      • 3.10.3.1. Why Stamps Lead High-PPI Applications
      • 3.10.3.2. Limitations
      • 3.10.3.3. 2025 Status
    • 3.10.4. Fluidic Self-Assembly (FSA): Status Uncertain
    • 3.10.5. Pick-and-Place: Niche Role Only
    • 3.10.6. Equipment Investment Challenges and Risks
  • 3.11. Yield Management, Testing, and Repair
    • 3.11.1. Overview: Why Yield Management Is Make-or-Break
    • 3.11.2. Testing Strategies and Technologies
    • 3.11.3. Advanced Testing Technologies (2025)
    • 3.11.4. Repair Technologies and Strategies
    • 3.11.5. Repair Equipment and Vendors (2025)
  • 3.12. Manufacturing Cost Evolution and Economic Viability Pathways
    • 3.12.1. Current Cost Structure Reality (2025)
      • 3.12.1.1. Cost Structure Analysis: Representative Applications (2025)
    • 3.12.2. Die Cost Reduction Pathways
      • 3.12.2.1. Lever 1: Wafer Cost Reduction
      • 3.12.2.2. Lever 2: Die Per Wafer (Geometric Efficiency)
      • 3.12.2.3. Lever 3: Yield Improvement
      • 3.12.2.4. Combined Die Cost Reduction Potential
    • 3.12.3. Transfer and Assembly Cost Reduction
      • 3.12.3.1. Cost Reduction Mechanisms
    • 3.12.4. Testing and Repair Cost Evolution
    • 3.12.5. Total Display Module Cost Evolution Roadmap
  • 3.13. Manufacturing Readiness Assessment and Bottleneck Analysis (2025)
    • 3.13.1. Process Maturity Matrix
    • 3.13.2. Equipment Landscape and Vendor Ecosystem (2025)
      • 3.13.2.1. Front-End Equipment (Mature Ecosystem)
      • 3.13.2.2. Mid-Stream Equipment (Evolving, Moderate Maturity)
      • 3.13.2.3. Back-End Equipment (Leveraging FPD Maturity)
      • 3.13.2.4. Critical Equipment Gaps and Needs
    • 3.13.3. Geographic Manufacturing Landscape

4. DEFECT MANAGEMENT

  • 4.1. Overview
  • 4.2. Defect types
  • 4.3. Redundancy techniques
  • 4.4. Repair
    • 4.4.1. Techniques
    • 4.4.2. Laser micro trimming

5. COLOUR CONVERSION

  • 5.1. Comparison of technologies
  • 5.2. Full colour conversion
  • 5.3. UV LED
  • 5.4. Colour filters
  • 5.5. Stacked RGB MicroLEDs
    • 5.5.1. Companies
  • 5.6. Three panel microLED projectors
  • 5.7. Phosphor Colour Conversion
    • 5.7.1. Overview
      • 5.7.1.1. Red-emitting phosphor materials
      • 5.7.1.2. Thermal stability
      • 5.7.1.3. Narrow-band green phosphors
      • 5.7.1.4. High performance organic phosphors
    • 5.7.2. Challenges
    • 5.7.3. Companies
  • 5.8. Quantum dots colour conversion
    • 5.8.1. Mode of operation
    • 5.8.2. Cadmium QDs
    • 5.8.3. Cadmium-free QDs
    • 5.8.4. Perovskite quantum dots
    • 5.8.5. Graphene quantum dots
    • 5.8.6. Phosphors and quantum dots
    • 5.8.7. Quantum dots in microLED displays
      • 5.8.7.1. Technology overview
      • 5.8.7.2. QD-based display types
      • 5.8.7.3. Quantum dot colour conversion (QDCC) technology for microLEDs
      • 5.8.7.4. Efficiency drop and red shift in quantum dot emission for displays
      • 5.8.7.5. High blue absorptive quantum dot materials for display
      • 5.8.7.6. QD display pixel patterning techniques
        • 5.8.7.6.1. Inkjet printing
        • 5.8.7.6.2. Photoresists
        • 5.8.7.6.3. Aerosol Jet Printing
    • 5.8.8. Challenges
    • 5.8.9. Companies
  • 5.9. Quantum wells
  • 5.10. Improving image quality

6. LIGHT MANAGEMENT

  • 6.1. Overview
  • 6.2. Light capture methods
  • 6.3. Micro-catadioptric optical array
  • 6.4. Additive manufacturing (AM) for engineered directional emission profiles

7. BACKPLANES AND DRIVING

  • 7.1. Overview
  • 7.2. Technologies and materials
    • 7.2.1. TFT materials
    • 7.2.2. OLED Pixel Driving
    • 7.2.3. TFT Backplane
    • 7.2.4. Passive and active matrix addressing
      • 7.2.4.1. Passive Matrix Addressing
      • 7.2.4.2. Passive Driving Structure
      • 7.2.4.3. Active Matrix Addressing
      • 7.2.4.4. Pulse width modulation (PWM)
      • 7.2.4.5. Driving voltage considerations for microLEDs
    • 7.2.5. RGB Driving Schemes for MicroLED Displays
    • 7.2.6. Active Matrix MicroLED Displays with LTPS Backplanes

8. MARKETS FOR MICROLEDS

  • 8.1. CONSUMER ELECTRONIC DISPLAYS
    • 8.1.1. Overview
    • 8.1.2. Large flat panel displays and TVs
      • 8.1.2.1. Samsung
      • 8.1.2.2. LG
    • 8.1.3. Technology and Manufacturing Advances (2025 Update)
      • 8.1.3.1. Large Module Manufacturing Breakthrough
    • 8.1.4. Smartwatches and Wearables
      • 8.1.4.1. Industry Inflection Point: First Commercial Products (2025)
    • 8.1.5. Smartphones
      • 8.1.5.1. Economic Reality: The OLED Cost Gap (2025)
    • 8.1.6. Laptops, monitors and tablets
    • 8.1.7. Foldable and stretchable displays
      • 8.1.7.1. The global foldable display market
      • 8.1.7.2. Applications
        • 8.1.7.2.1. Foldable TVs
        • 8.1.7.2.2. Stretchable 12" microLED touch displays
        • 8.1.7.2.3. Product developers
    • 8.1.8. SWOT analysis
  • 8.2. BIOTECH AND MEDICAL
    • 8.2.1. The global medical display market
    • 8.2.2. Applications
      • 8.2.2.1. Implantable Devices
      • 8.2.2.2. Lab-on-a-Chip
      • 8.2.2.3. Endoscopy
      • 8.2.2.4. Surgical Displays
      • 8.2.2.5. Phototherapy
      • 8.2.2.6. Biosensing
      • 8.2.2.7. Brain Machine Interfaces
    • 8.2.3. Product developers
    • 8.2.4. SWOT analysis
  • 8.3. AUTOMOTIVE
    • 8.3.1. Global automotive displays market
    • 8.3.2. Applications
      • 8.3.2.1. Cabin Displays
      • 8.3.2.2. Head-up displays (HUD)
        • 8.3.2.2.1. Current HUD Limitations (Technical Detail)
        • 8.3.2.2.2. Alternative Technologies - Limitations
        • 8.3.2.2.3. HUD Application Categories
      • 8.3.2.3. Exterior Signaling and Lighting
    • 8.3.3. Product developers
    • 8.3.4. SWOT analysis
  • 8.4. VIRTUAL REALITY (VR), AUGMENTED REALITY (AR) AND MIXED REALITY (MR)
    • 8.4.1. Global market for virtual reality (VR), augmented reality (AR), and mixed reality (MR)
    • 8.4.2. Brightness - The Main Constraint of Near-Eye Displays for AR (2025 Critical Analysis)
      • 8.4.2.1. Why Brightness is Critical for AR
      • 8.4.2.2. MicroLED - The Technical Solution
    • 8.4.3. Applications
      • 8.4.3.1. AR/VR Smart glasses and head-mounted displays (HMDs)
      • 8.4.3.2. MicroLED contact lenses
    • 8.4.4. Products developers
    • 8.4.5. SWOT analysis
  • 8.5. TRANSPARENT DISPLAYS
    • 8.5.1. Global transparent displays market
    • 8.5.2. Applications
      • 8.5.2.1. Smart Windows
      • 8.5.2.2. Display Glass Overlays
    • 8.5.3. Market Forecasts and Technology Adoption (2025)
    • 8.5.4. Product developers
    • 8.5.5. SWOT analysis
  • 8.6. MIRROR DISPLAYS
    • 8.6.1. Technology Concept
    • 8.6.2. Applications
  • 8.7. OPTICAL INTERCONNECTS FOR DATA CENTERS
    • 8.7.1. Market Context and Opportunity
    • 8.7.2. Technical Requirements for Optical Interconnects
    • 8.7.3. MicroLED Integration with Silicon Photonics
    • 8.7.4. Market Potential and Forecast
    • 8.7.5. Key Technical Challenges
    • 8.7.6. Competitive Landscape
      • 8.7.6.1. Alternative Technologies

9. COMPANY PROFILES(89 company profiles)

10. REPORT AIMS AND OBJECTIVES

11. REFERENCES

List of Tables

  • Table 1. Summary of display technologies
  • Table 2. Advantages of AM microLED micro-displays
  • Table 3. MicroLED applications
  • Table 4. Market and technology challenges for microLEDs
  • Table 5. MicroLED Industry Developments 2025
  • Table 6. CES 2025 MicroLED products and prototypes
  • Table 7. Global MicroLED Display Market (Thousands of Units) 2024-2036, by Market
  • Table 8. Global MicroLED Display Market Revenue (Million USD) 2024-2036, by Market
  • Table 9. 100" Class 4K MicroLED TV Cost Breakdown (2025 Current State):
  • Table 10. 130" Class 8K MicroLED TV Cost Breakdown (2025 Current State)
  • Table 11. 65" Display Technology Price Comparison (2025 Consumer Pricing)
  • Table 12. 85-100" Display Technology Price Comparison (2025 Consumer Pricing):
  • Table 13. 120-150" Display Technology Price Comparison (2025):
  • Table 14. Comparison of microdisplay technologies for AR applications
  • Table 15. MicroLED Value Chain Ecosystem
  • Table 16. LED size definitions
  • Table 17. Comparison between miniLED and microLED
  • Table 18. Comparison to conventional LEDs
  • Table 19. Types of MicroLED
  • Table 20. Summary of monolithic integration, monolithic hybrid integration (flip-chip/wafer bonding), and mass transfer technologies
  • Table 21. Summary of different mass transfer technologies
  • Table 22. MicroLED Comparison to LCD, OLED and QD
  • Table 23. Schematic comparison to LCD and OLED
  • Table 24. Commercially available MicroLED products and specifications
  • Table 25. Comparison of MicroLED with other display technologies
  • Table 26. MicroLED-based display advantages and disadvantages
  • Table 27. Companies Developing Transparent MicroLED Displays
  • Table 28. MicroLED Manufacturing Facilities (2025)
  • Table 29. Additional Facilities (Capacity Expansion/Future)
  • Table 30. Materials for commercial LED chips
  • Table 31. Bandgap vs lattice constant for common III-V semiconductors used in LEDs
  • Table 32. Advantages and disadvantages of MOCVD
  • Table 33. Typical RGB microLED designs
  • Table 34. Size dependence of key parameters in microLEDs
  • Table 35. Transfer, assembly and integration technologies
  • Table 36. Companies utilizing monolithic integration for MicroLEDs
  • Table 37. Advantages and disadvantages of heterogeneous wafers
  • Table 38. Key players in heterogeneous wafers
  • Table 39. Fabricating monolithic micro-displays
  • Table 40. GaN-on-Si applications
  • Table 41. Different epitaxial growth methods for GaN-on-Silicon
  • Table 42. Comparison of GaN growth on sapphire vs silicon substrates
  • Table 43. Cost comparison of sapphire versus silicon substrates for GaN epitaxy
  • Table 44. Challenges of GaN-on-Silicon epitaxy and mitigation strategies
  • Table 45. Companies utilizing GaN microLEDs on silicon
  • Table 46. Mass transfer methods, by company
  • Table 47. Comparison of various mass transfer technologies
  • Table 48. Factors affecting transfer yield for microLED mass assembly
  • Table 49. Advantages and disadvantages of Elastomeric stamp for microLED mass transfer
  • Table 50. Companies utilizing elastomeric stamp transfer
  • Table 51. Laser beam requirement
  • Table 52. Companies utilizing laser-enabled transfer technology
  • Table 53. Companies developing micro-transfer printing technologies
  • Table 54. Types of self-assembly technologies
  • Table 55. Companies utilizing self-assembly
  • Table 56. Advantages and disadvantages of all-in-one CMOS driving technique
  • Table 57. Companies utilizing All-in-one transfer
  • Table 58. Comparison between 2D and 3D microLEDs
  • Table 59. Classification of key microLED bonding and interconnection techniques
  • Table 60. Types of bonding
  • Table 61. Application 1: 100" 4K TV Display Module
  • Table 62. Premium Smartwatch Display (1.3", ~1M pixels)
  • Table 63. Application 3: AR Microdisplay (0.5", LEDoS)
  • Table 64. 100" 4K TV Display Module Cost Projection
  • Table 65. Strategies for full colour realization
  • Table 66. Comparison of colour conversion technologies for microLED displays
  • Table 67. Companies developing stacked RGB microLEDs
  • Table 68. Phosphor materials used for LED colour conversion
  • Table 69. Requirements for phosphors in LEDs
  • Table 70. Standard and emerging red-emitting phosphors
  • Table 71. Challenges with phosphor colour conversion
  • Table 72. Companies developing phosphors for MicroLEDs
  • Table 73. Comparative properties of conventional QDs and Perovskite QDs
  • Table 74. Properties of perovskite QLEDs comparative to OLED and QLED
  • Table 75. Perovskite-based QD producers
  • Table 76. Comparison between carbon quantum dots and graphene quantum dots
  • Table 77. Comparison of graphene QDs and semiconductor QDs
  • Table 78. Graphene quantum dots producers
  • Table 79. QDs vs phosphors
  • Table 80. QD-based display types
  • Table 81. Quantum dot (QD) patterning techniques
  • Table 82. Pros and cons of ink-jet printing for manufacturing displays
  • Table 83. Challenges with QD colour conversion
  • Table 84. Companies utilizing quantum dots in MicroLEDs
  • Table 85. Methods to capture light output
  • Table 86. Backplane and driving options for MicroLED displays
  • Table 87. Comparison between PM and AM addressing
  • Table 88. PAM vs PWM
  • Table 89. . Driving vs. EQE
  • Table 90. Comparison of LED TV technologies
  • Table 91. LG mini QNED range
  • Table 92. MicroLED Smartwatches and Wearables by Company
  • Table 93. MicroLED Smartphones by Company
  • Table 94. MicroLED Laptops, Monitors, and Tablets by Company
  • Table 95.MicroLED Flexible and Stretchable Displays by Company
  • Table 96. Flexible, stretchable and foldable MicroLED products
  • Table 97. Medical display MicroLED products
  • Table 98. Automotive display & backlight architectures
  • Table 99. Applications of MicroLED in automotive
  • Table 100. Automotive display MicroLED products
  • Table 101. Comparison of AR Display Light Engines
  • Table 102. MicroLED based smart glass products
  • Table 103. MicroLED transparent displays
  • Table 104. Companies developing MicroLED transparent displays

List of Figures

  • Figure 1. Blue GaN MicroLED arrays with 3um pixel pitch use polychromatic quantum dot integration to achieve full colour AR displays
  • Figure 2: QLED TV from Samsung
  • Figure 3. QD display products
  • Figure 4. The progress of display technology, from LCD to MicroLED
  • Figure 5. Head-up displays (HUD)
  • Figure 6. Public advertising displays
  • Figure 7. Wearable biomedical devices
  • Figure 8. Pico-projectors
  • Figure 9. Global MicroLED Display Market (Thousands of Units) 2024-2036, by Market
  • Figure 10. MicroLED Cost Evolution Roadmap
  • Figure 11. MicroLED display panel structure
  • Figure 12. Display system configurations
  • Figure 13. MicroLED schematic
  • Figure 14. Pixels per inch roadmap of micro--LED displays from 2007 to 2019
  • Figure 15. Mass transfer for micro-LED chips
  • Figure 16. Schematic diagram of mass transfer technologies
  • Figure 17. Lextar 10.6 inch transparent MicroLED display
  • Figure 18. Transition to borderless design
  • Figure 19. Process for LED Manufacturing
  • Figure 20. Main application scenarios of microLED display and their characteristic display area and pixel density
  • Figure 21. Conventional process used to fabricate microLED microdisplay devices
  • Figure 22. Process flow of Silicon Display of Sharp
  • Figure 23. JDB monolithic hybrid integration microLED chip fabrication process
  • Figure 24. Monolithic microLED array
  • Figure 25. Schematics of a elastomer stamping, b electrostatic/electromagnetic transfer, c laser-assisted transfer and d fluid self-assembly
  • Figure 26. Transfer process flow
  • Figure 27. XCeleprint Automated micro-transfer printing machinery
  • Figure 28. Schematics of Roll-based mass transfer
  • Figure 29. Schematic of laser-induced forward transfer technology
  • Figure 30. Schematic of fluid self-assembly technology
  • Figure 31. Fabrication of microLED chip array
  • Figure 32. Schematic of colour conversion technology
  • Figure 33. Process flow of a full-colour micro display
  • Figure 34. GE inkjet-printed red phosphors
  • Figure 35. Toray's organic colour conversion film
  • Figure 36. Quantum dot schematic
  • Figure 37. Quantum dot size and colour
  • Figure 38. (a) Emission colour and wavelength of QDs corresponding to their sizes (b) InP QDs; (c) InP/ZnSe/ZnS core-shell QDs
  • Figure 39. A pQLED device structure
  • Figure 40. Perovskite quantum dots under UV light
  • Figure 41. Market adoption roadmap for microLED displays
  • Figure 42. Samsung Wall display system
  • Figure 43. Samsung Neo QLED 8K
  • Figure 44. MAGNIT MicroLED TV
  • Figure 45. MicroLED wearable display prototype
  • Figure 46. APHAEA Watch
  • Figure 47. AUO's 13.5-inch transparent RGB microLED display
  • Figure 48. AU Optonics Flexible MicroLED Display
  • Figure 49. Schematic of the TALT technique for wafer-level MicroLED transferring
  • Figure 50. 55" flexible AM panel
  • Figure 51. Foldable 4K C SEED M1
  • Figure 52. Stretchable 12" microLED touch displays
  • Figure 53. SWOT analysis: MicroLEDs in consumer electronics displays
  • Figure 54. MicroLEDs for medical applications
  • Figure 55. SWOT analysis: MicroLEDs in biotech and medical
  • Figure 56. 2023 Cadillac Lyriq EV incorporating miniLED display
  • Figure 57. MicroLED automotive display
  • Figure 58. Issues in current commercial automotive HUD
  • Figure 59. Rear lamp utilizing flexible MicroLEDs
  • Figure 60. SWOT analysis: MicroLEDs in automotive
  • Figure 61. Lenovo AI Glasses V1
  • Figure 62. LAWK ONE
  • Figure 63. JioGlass
  • Figure 64. Mojo Vision smart contact lens with an embedded MicroLED display
  • Figure 65. Cellid AR glasses, Exploded version
  • Figure 66. Air Glass
  • Figure 67. Panasonic MeganeX
  • Figure 68. Thunderbird Smart Glasses Pioneer Edition
  • Figure 69. RayNeo X2
  • Figure 70. RayNeo X3
  • Figure 71. Tecno AI Glasses Pro
  • Figure 72. tooz technologies smart glasses
  • Figure 73. Vuzix MicroLED micro display Smart Glasses
  • Figure 74. Leopard demo glasses by WaveOptics
  • Figure 75. SWOT analysis: MicroLEDs in virtual reality (VR), augmented reality (AR), and mixed reality (MR)
  • Figure 76. (a) Front of the AUO 17.3-inch dual-sided transparent microLED display and the (b) back of the display, with both on simultaneously
  • Figure 77. Different transparent displays and transmittance limitations
  • Figure 78. 7.56" high transparency & frameless MicroLED display
  • Figure 79. 17.3-inch transparent microLED AI display in a Taiwan Ferry
  • Figure 80. SWOT analysis: MicroLEDs in transparent displays
  • Figure 81. WireLED in 12" Silicon Wafer
  • Figure 82. Typical GaN-on-Si LED structure
  • Figure 83. 300 mm GaN-on-silicon epiwafer
  • Figure 84. MicroLED chiplet architecture
  • Figure 85. Concept Apple Vr Ar Mixed Reality Headset
  • Figure 86. AUO 42-inch transparent microLED display
  • Figure 87. SeeThrmicro- Transparent MicroLED Display
  • Figure 88. Image obtained on a blue active-matrix WVGA (wide video graphics array) micro display
  • Figure 89. Fabrication of the 10-micrometer pixel pitch LED array on sapphire
  • Figure 90. A 200-mm wafer with CMOS active matrices for GaN 873 x 500-pixel micro display at 10-micrometer pitch
  • Figure 91. IntelliPix(TM) design for 0.26" 1080p MicroLED display
  • Figure 92. C Seed 165-inch M1 MicroLED TV
  • Figure 93. N1 folding MicroLED TV
  • Figure 94. C Seed outdoor TV
  • Figure 95. Focally Universe AR glasses
  • Figure 96. HKC's display
  • Figure 97. Hongshi Intelligence full-colour microLED microdisplay
  • Figure 98. Jade Bird Display micro displays
  • Figure 99. JBD's 0.13-inch panel
  • Figure 100. Prototype MicroLED display
  • Figure 101. APHAEA MicroLED watch
  • Figure 102. KONKA 59" tiled microLED TV prototype screen
  • Figure 103. 12" 100 PPI full-colour stretchable microLED display
  • Figure 104. LGD stretchable microLED display
  • Figure 105. LG Magnit flight simulator concept model
  • Figure 106. Schematic of Micro Nitride chip architecture
  • Figure 107. 48 x 36 Passive Matrix MicroLED display
  • Figure 108. MicroLED micro display based on a native red InGaN LED
  • Figure 109. The Wall
  • Figure 110. Samsung Neo QLED 8K
  • Figure 111. NPQD(TM) Technology for MicroLEDs
  • Figure 112. Wicop technology
  • Figure 113. A micro-display with a stacked-RGB pixel array, where each pixel is an RGB-emitting stacked MicroLED device (left). The micro-display showing a video of fireworks at night, demonstrating the full-colour capability (right). N.B. Areas around the display/
  • Figure 114. TCL CSOT 219-inch panorama modular microLED display
  • Figure 115. Photo-polymer mass transfer process
  • Figure 116. 7.56" Transparent Display
  • Figure 117. 7.56" Flexible MicroLED
  • Figure 118. Visionox's 88-inch microLED modular display
  • Figure 119. Vuzix uLED display engine
  • Figure 120. Z100 smart glasses