全球MicroLED显示器市场：COG、COB和MIP

Global MicroLED Display Market Report: COG, COB & MIP

出版日期: 2025年09月26日 | 出版商:

Futuresource Consulting Ltd. | 英文 108 Pages | 商品交期: 请询问到货日

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简介目录

真正的MicroLED技术，即在TFT背板上大规模印刷小于100微米的晶片，是一项颠覆性技术，代表着策略转型。未来十年，商用显示器和消费电视市场规模预计将累计达634亿美元。

自Futuresource上次发布报告以来，受多种因素驱动，市场预测成长了27%。光是过去两年，技术和製造能力就取得了显着进步，生态系赋能者数量翻了一番，生态系集群数量更是增加了两倍。

本报告概述了真正的MicroLED技术的持续影响，预测到2026年，市场复合年增长率将达到101%。报告也探讨了这一成长的时间表以及相关的市场格局。

市场趋势

真正的MicroLED，广义定义为在TFT背板上大规模印刷的小于100微米的晶片，是一项颠覆性技术，标誌着一个重要的战略转折点。

未来五年，由于卓越的视觉性能和更低的总体拥有成本（TCO），DVLED行业预计将经历从封装式（SMD、IMD、MiP）显示器到非封装式（CoB、COG）显示器的重大技术转变。到2029年，非封装式显示器将在像素间距小于1.6毫米的市场占据主导地位，而封装式显示器将在像素间距大于1.7毫米的市场继续占据主导地位。

CoG显示器正吸引着大型、实力雄厚的LCD面板製造商的浓厚兴趣，他们愿意利用自身的製造专长和现有晶圆厂，并大力投资研发，专注于玻璃背板技术。迄今为止，试播製作非常有限，但随着专业视听（Pro AV）的日益普及，预计未来几年试播製作将迅速增加。

报告方法和范围
摘要整理
技术趋势
SMD/IMD、MiniLED 和 MicroLED 的发展趋势
显示技术对比
专业视听领域的共存
製造工艺
製造业概述
元件
质量传输
模组化
系统设计
MicroLED 障碍概述
挑战：技术
晶片组
单片 MicroLED 与量子点组合
背板、驱动 IC
製造/生态系统挑战
半导体
质量传输
生态系丛集更新
市场影响
市场概览
价值链参与者的角色
差异化机会：专业视听产品
差异化机会：消费性电子产品

简介目录

True MicroLED, now broadly defined as smaller than 100-micron chiplets mass transferred onto a TFT backplane, is a disruptive technology driving a major strategic inflection point. It is forecasted to reach a cumulative $63.4bn (USD) market opportunity for commercial displays and consumer televisions over the next decade.

Since Futuresource's last report, the market outlook has increased by 27% due to a mix of factors. In the last two years alone, technology and manufacturing capabilities have advanced significantly, alongside the doubling of identified ecosystem enablers and the tripling of definable ecosystem clusters.

The updated report outlines the continued impact of True MicroLED, and provides a market forecast of 101% CAGR through 2026. The report explores the timeline of this growth and the accompanying marketplace conditions.

Market Trends:

True MicroLED, now broadly defined as smaller than 100-micron chiplets mass transferred onto a TFT backplane, is a disruptive technology driving a major strategic inflection point.

Over the next five years, a significant technology transition will occur shifting the DVLED industry to unpackaged variants (CoB and COG) from packaged alternatives (SMD, IMD and MiP) due to superior visual per visual performance and lower Total Cost of Ownership (TCO). By 2029, unpackaged variants will be predominant at pixel pitches 1.6mm and below while packaged versions will remain dominate at 1.7mm and above.

CoG is garnering significant interest from large and powerful LCD panel manufacturers who are motivated to leverage their manufacturing expertise and existing fabs with significant investment in R&D to focus on a glass backplane, which has great potential to drive manufacturing costs down to spur widespread adoption. To date, pilot production is very limited but expected to ramp over the next few years, driven by Pro AV adoption.

Areas Explored:

Market sizing and market forecasting
Pro AV tiled video walls and All-In-One (AIO) as well as Consumer Electronics (CE) television markets and applications
While MicroLED technology will likely apply to monitors, laptops, tablets, smartphones, watches, embedded displays, automotive, augmented reality (AR), virtual reality (VR) among other markets and applications, these technologies are outside of the scope of this analysis.

Did you know?

Futuresource has been regularly tracking, researching and consulting on the LED market since 2013, as part of its professional display technology portfolio.

Any enterprise operating within the LED display market and adjacent industries will benefit from this report, particularly: