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市场调查报告书
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1465584

ALD 设备市场 - 按设备、按沉积方法、按薄膜类型、按应用和预测,2024 年 - 2032 年

ALD Equipment Market - By Equipment, By Deposition Method, By Film Type, By Application & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3个工作天内

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简介目录

由于技术进步和对高性能电子产品不断增长的需求,2024 年至 2032 年全球 ALD 设备市场规模将实现 10% 的复合年增长率。等离子增强 ALD 和先进材料等创新提高了 ALD 製程的精度和效率。与半导体製造商和研究机构等产业合作伙伴的合作进一步推动市场成长。随着对可靠和高密度电子元件的需求不断增长,ALD 设备将成为关键的解决方案,满足半导体製造不断变化的需求。

例如,2023年5月,Beneq与龙片真空工业合作,透过产业交流积极引入原子层沉积(ALD)技术,以解决量产中的复杂挑战。

ALD设备产业根据设备、沉积方法、薄膜类型、应用和区域进行分类。

到2032年,资料资料领域将显着改善。 ALD 对于生产可靠且高密度的记忆体储存至关重要,而这对于资料处理至关重要。随着资料中心在全球扩展以满足不断增长的资料储存需求,对 ALD 技术的需求将激增,推动市场成长。

到 2032 年,等离子体增强 ALD 领域的 ALD 设备市场份额将获得显着增长,这要归功于其沉积高品质、均匀薄膜的卓越能力,以及对薄膜特性的出色控制。由于电子、半导体和太阳能等行业需要精确、高效的沉积工艺,等离子体增强 ALD 脱颖而出。其增强材料性能、减少薄膜缺陷和提高整体性能的能力使其成为首选,从而推动其在 ALD 设备行业的主导地位。

在中国、韩国和日本等国家广泛的半导体製造的推动下,亚太地区 ALD 设备产业到 2032 年将呈现可观的复合年增长率。对电子产品的需求不断增长以及研发投资的增加进一步推动了这一趋势。凭藉主要参与者的强大影响力和对技术进步的关注,亚太地区将成为 ALD 设备市场扩张和创新的关键贡献者。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 对半导体装置的需求不断增长
      • 越来越多地采用奈米技术
      • 半导体设计的复杂度不断增加
      • 对材料特性的认识不断增强
      • 日益关注能源效率
    • 产业陷阱与挑战
      • 材料相容性和集成
      • 扩展挑战
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按设备分类,2018 - 2032 年

  • 主要趋势
  • 间歇式反应器
  • 单晶片反应器
  • 空间原子层沉积反应器
  • 远程等离子体 ALD 反应器

第 6 章:市场估计与预测:依沉积法,2018 - 2032

  • 主要趋势
  • 等离子体增强原子层沉积
  • 热原子层沉积
  • 太空原子层沉积
  • 功率原子层沉积
  • 其他的

第 7 章:市场估计与预测:依薄膜类型,2018 - 2032

  • 主要趋势
  • 金属膜
  • 氧化膜
  • 硫化膜
  • 氮化膜
  • 氟化膜

第 8 章:市场估计与预测:按应用划分,2018 年 - 2032 年

  • 主要趋势
  • 计算领域
  • 资料中心
  • 消费性电子产品
  • 医疗保健和生物医学
  • 汽车
  • 能源与电力

第 9 章:市场估计与预测:按地区划分,2018 年 - 2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 俄罗斯
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 沙乌地阿拉伯
    • 南非
    • MEA 的其余部分

第 10 章:公司简介

  • Aixtron SE
  • ASM International NV
  • Beneq Oyj
  • Cambridge NanoTech
  • DEPOSITION GmbH
  • EV Group (Evonik Industries AG)
  • Hitachi High-Technologies Corporation
  • Lam Research Corporation
  • Meyer Burger
  • Oxford Instruments Plc
  • Picosun Oy
  • SENTECH Instruments GmbH
  • SunChemical
  • TEL (Tokyo Electron Limited)
  • Veeco Instruments Inc.
简介目录
Product Code: 8346

Global ALD Equipment Market size will register a 10% CAGR from 2024 to 2032 due to technological advancements and the growing need for high-performance electronics. Innovations like plasma-enhanced ALD and advanced materials enhance the precision and efficiency of ALD processes. Collaborations with industry partners, including semiconductor manufacturers and research institutions, further drive market growth. As demand rises for reliable and high-density electronic components, ALD equipment will emerge as a crucial solution, catering to the evolving needs of semiconductor fabrication.

For instance, in May 2023, Beneq collaborated with Lung Pien Vacuum Industry to actively introduce Atomic Layer Deposition (ALD) technology through industry exchanges to address intricate challenges in mass production.

The ALD equipment industry is classified based on equipment, deposition method, film type, application, and region.

The data centers segment will experience a significant upturn by 2032. With the exponential growth of cloud computing and the demand for high-performance computing applications, data centers require advanced ALD technology to fabricate efficient semiconductor devices. ALD is crucial in producing reliable and high-density memory storage, which is essential for data processing. As data centers expand globally to meet escalating data storage needs, the demand for ALD technology will surge, driving the market's growth.

The ALD equipment market share from the plasma-enhanced ALD segment will amass notable gains through 2032, attributed to its superior capabilities in depositing high-quality, uniform thin films with excellent control over film properties. As industries such as electronics, semiconductors, and solar energy demand precise and efficient deposition processes, plasma-enhanced ALD stands out. Its ability to enhance material properties, reduce film defects, and improve overall performance makes it a preferred choice, driving its dominance in the ALD equipment industry.

Asia Pacific ALD equipment industry will demonstrate a substantial CAGR by 2032, fueled by extensive semiconductor manufacturing in countries like China, South Korea, and Japan. Rising demand for electronics and increasing investments in research and development further propel this trend. With a robust presence of key players and a focus on technological advancements, Asia Pacific will stand as a pivotal contributor to the ALD equipment market expansion and innovation.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definitions
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculations
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360 degree synopsis, 2018 - 2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Profit margin analysis
  • 3.3 Technology & innovation landscape
  • 3.4 Patent analysis
  • 3.5 Key news & initiatives
  • 3.6 Regulatory landscape
  • 3.7 Impact forces
    • 3.7.1 Growth drivers
      • 3.7.1.1 Increasing demand for semiconductor devices
      • 3.7.1.2 Growing adoption of nanotechnology
      • 3.7.1.3 Increasing complexity of semiconductor designs
      • 3.7.1.4 Growing awareness of material properties
      • 3.7.1.5 Increasing focus on energy efficiency
    • 3.7.2 Industry pitfalls & challenges
      • 3.7.2.1 Material compatibility and integration
      • 3.7.2.2 Scaling challenges
  • 3.8 Growth potential analysis
  • 3.9 Porter's analysis
    • 3.9.1 Supplier power
    • 3.9.2 Buyer power
    • 3.9.3 Threat of new entrants
    • 3.9.4 Threat of substitutes
    • 3.9.5 Industry rivalry
  • 3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Equipment, 2018 - 2032 (USD Million)

  • 5.1 Key trends
  • 5.2 Batch reactors
  • 5.3 Single-wafer reactors
  • 5.4 Spatial ALD reactors
  • 5.5 Remote Plasma ALD reactors

Chapter 6 Market Estimates & Forecast, By Deposition Method, 2018 - 2032 (USD Million)

  • 6.1 Key trends
  • 6.2 Plasma enhanced ALD
  • 6.3 Thermal ALD
  • 6.4 Spatial ALD
  • 6.5 Power ALD
  • 6.6 Others

Chapter 7 Market Estimates & Forecast, By Film Type, 2018 - 2032 (USD Million)

  • 7.1 Key trends
  • 7.2 Metal film
  • 7.3 Oxide film
  • 7.4 Sulfide film
  • 7.5 Nitride film
  • 7.6 Fluoride film

Chapter 8 Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

  • 8.1 Key trends
  • 8.2 Computing sector
  • 8.3 Data centers
  • 8.4 Consumer electronics
  • 8.5 Healthcare and biomedical
  • 8.6 Automotive
  • 8.7 Energy & power

Chapter 9 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 UK
    • 9.3.2 Germany
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Russia
    • 9.3.7 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 South Korea
    • 9.4.5 ANZ
    • 9.4.6 Rest of Asia Pacific
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Rest of Latin America
  • 9.6 MEA
    • 9.6.1 UAE
    • 9.6.2 Saudi Arabia
    • 9.6.3 South Africa
    • 9.6.4 Rest of MEA

Chapter 10 Company Profiles

  • 10.1 Aixtron SE
  • 10.2 ASM International NV
  • 10.3 Beneq Oyj
  • 10.4 Cambridge NanoTech
  • 10.5 DEPOSITION GmbH
  • 10.6 EV Group (Evonik Industries AG)
  • 10.7 Hitachi High-Technologies Corporation
  • 10.8 Lam Research Corporation
  • 10.9 Meyer Burger
  • 10.10 Oxford Instruments Plc
  • 10.11 Picosun Oy
  • 10.12 SENTECH Instruments GmbH
  • 10.13 SunChemical
  • 10.14 TEL (Tokyo Electron Limited)
  • 10.15 Veeco Instruments Inc.