印刷电路板 (PCB) 组装市场规模、按 PCB 类型、按组件、按技术、按焊接工艺、按数量、按组装、按垂直行业、预测 2024 - 2032 年

在电子製造全球化的推动下，2024 年至 2032 年全球印刷电路板 PCB 组装市场的复合年增长率将超过 5%。製造商越来越多地将生产转移到亚太地区等地区，以利用具有成本效益的生产中心。这一趋势是由较低的劳动力成本、支持性的监管环境以及靠近主要市场等因素所推动的。

工信部数据显示，2023年，我国电子资讯製造业固定资产投资年增9.3%，快于产业整体成长0.3个百分点。工业增加价值成长3.4%，12月份较2022年12月成长9.6%。

这种转变不仅提高了製造效率，而且有利于获得熟练的劳动力和先进技术。 PCB 组装市场受益于生产能力的扩大和供应链的简化，支持了全球各行业对电子产品不断增长的需求。

整个印刷电路板 PCB 组装市场根据 PCB 类型、元件、技术、焊接流程、数量、组装、垂直和区域进行细分。

球栅阵列细分市场在 2024 年至 2032 年期间将实现显着的复合年增长率。由于其在增强电子设备性能和可靠性方面的优势，球栅阵列 BGA 组装领域对印刷电路板 PCB 组装的需求正在显着增长。随着电子设备变得紧凑且功能强大，对能够满足这些要求而不影响功能或耐用性的 PCB 组件的需求不断增长。这一趋势是由球栅阵列技术的创新所推动的，使其成为跨行业广泛应用的首选。

到 203 年，柔性 PCB 产业将占据显着的印刷电路板 PCB 组装市场份额，因为它能够满足现代电子设备对灵活性、轻量级设计和节省空间解决方案的需求。与刚性 PCB 相比，柔性 PCB 具有可弯曲性、减轻重量和增强耐用性等优点。它们对于穿戴式科技、可折迭智慧型手机和汽车电子应用至关重要，而紧凑和适应性强的设计对于这些应用至关重要。这种趋势随着材料和製造流程的进步而不断升级，这些进步使得能够生产适合不同行业需求的高性能柔性 PCB 组件。

北美印刷电路板 PCB 组装市场的复合年增长率在 2024 年至 2032 年期间将充满希望。其中包括航空航太、国防、汽车和医疗保健等产业的强劲扩张，所有这些产业都严重依赖先进的电子产品。此外，增加研发投资促进 PCB 技术创新，扩大需求。电子产品可靠性和安全性的严格监管标准有助于采用高品质 PCB 组件。这些因素的结合使北美成为一个重要的市场，推动其持续成长并适应不断变化的行业需求。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：印刷电路板 (PCB) 组装产业洞察

• 产业生态系统分析
• 供应商矩阵
• 利润率分析
• 技术与创新格局
• 专利分析
• 重要新闻和倡议
  • 伙伴关係/协作
  • 併购
  • 投资
  • 产品发布与创新
• 监管环境
• 衝击力
  • 成长动力
    • 电子设备的需求增加
    • 物联网 (IoT) 的兴起
    • 越来越多地在汽车电子设备中使用 PCB，以实现安全性、连接性和自动化
    • 对智慧型手机、平板电脑、穿戴式装置和智慧家居设备的需求不断增长
    • 航空航太和国防工业的扩张
  • 产业陷阱与挑战
    • PCB 的复杂性不断增加
    • 品质控制和测试
• 成长潜力分析
• 波特的分析
• PESTEL分析

第 4 章：竞争格局

• 介绍
• 公司市占率
• 主要市场参与者的竞争分析
  • Benchmark Electronics, Inc
  • Eurocircuits
  • PCBWay
  • Seeed Technology Co., Ltd.
  • Tempo
  • Vexos
  • WellPCB Technology Co., Ltd.
• 竞争定位矩阵
• 战略展望矩阵

第 5 章：印刷电路板 (PCB) 组装市场估计与预测：按 PCB 类型

• 主要动向：依PCB类型
• 刚性PCB
• 柔性线路板
• 金属芯PCB

第 6 章：印刷电路板 (PCB) 组装市场估计与预测：按组件

• 主要动向：按组件
  • 积极的
    • 电阻器
    • 电容器
    • 电感器
  • 被动的
    • 积体电路（ICS）
    • 微处理器
    • 微控制器

第 7 章：印刷电路板 (PCB) 组装市场估计与预测：按技术

• 主要动力向：靠技术
• 表面贴装组装 (SMT)
• 电镀通孔技术（PTH）
• 机电组装
• 混合技术（SMT/通孔）

第 8 章：印刷电路板 (PCB) 组装市场估计与预测：依焊接工艺

• 主动向：透过焊接工艺
• 波峰焊
• 手工焊接
• 回流焊

第 9 章：印刷电路板 (PCB) 组装市场估计与预测：按数量

• 主要动向：依PCB类型
• 低（1-100 单位）
• 中型（100-10,000 单位）
• 高（超过 10,000 单位）

第 10 章：印刷电路板 (PCB) 组装市场估计与预测：依组装

• 主动向：透过装配
• 内部
• 外包/合约

第 11 章：印刷电路板 (PCB) 组装市场估计与预测：依垂直领域

• 主要动向：垂直
• 消费性电子产品
• 汽车
• 卫生保健
• 资讯科技与电信
• 工业的
• 其他的

第 12 章：印刷电路板 (PCB) 组装市场估计与预测：按地区

• 主要动向：按地区
• 北美洲
  • 我们
  • 加拿大
• 欧洲
  • 英国
  • 德国
  • 法国
  • 义大利
  • 俄罗斯
  • 欧洲其他地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 台湾
  • 泰国
  • 亚太地区其他地区
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 海湾合作委员会
  • 拉丁美洲其他地区
• MEA
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非
  • MEA 的其余部分

第 13 章：公司简介

• Alfa Electronics
• ALLPCB.com
• Altek Electronics, Inc.
• Benchmark Electronics, Inc
• Bittele Electronics Inc.
• Clarydon Electronic Services Limited
• Eurocircuits
• Jayshree Instruments Pvt. Ltd
• Miracle Electronics Devices Pvt Ltd
• PCB Assembly Express, INC
• PCB Power Market
• PCB Unlimited.
• PCBGOGO.
• PCBWay
• Podrain Electronics
• RAYMING TECHNOLOGY
• Seeed Technology Co.,Ltd.
• Tempo
• Vexos
• Visual Communications Company, LLC
• WellPCB Technology Co., Ltd.

Global Printed Circuit Board PCB Assembly Market will depict over 5% CAGR from 2024 to 2032, catapulted by the globalization of electronics manufacturing. Manufacturers are increasingly moving production to regions like Asia-Pacific to capitalize on cost-effective production hubs. This trend is driven by factors such as lower labor costs, supportive regulatory environments, and proximity to key markets.

In 2023, fixed-asset investment in China's electronic information manufacturing industry increased by 9.3% year on year, surpassing the overall industry growth by 0.3 percentage points, according to the Ministry of Industry and Information Technology. The industrial added value rose by 3.4%, with a December increase of 9.6% compared to December 2022. Mobile phone production grew by 6.9% to 1.57 billion units, including a 1.9% rise in smartphone output to 1.14 billion units.

This shift not only enhances manufacturing efficiency but also facilitates access to a skilled workforce and advanced technologies. The PCB assembly market benefits from expanded production capacities and streamlined supply chains, supporting the growing demand for electronics across various industries worldwide.

The overall printed circuit board PCB assembly market is segmented based on the type of PCB, component, technology, soldering process, volume, assembly, vertical, and region.

The ball grid array segment will register a remarkable CAGR during 2024-2032. The demand for Printed Circuit Board PCB Assembly is rising significantly within the ball grid array BGA assembly segment due to its advantages in enhancing electronic device performance and reliability. As electronic devices become compact and powerful, there is a growing demand for PCB assemblies that can accommodate these requirements without compromising on functionality or durability. This trend is propelled by innovations in ball grid array technology, making it a preferred choice for a wide range of applications across industries.

The flexible PCB sector will garner a noticeable printed circuit board PCB assembly market share by 203, owing to its ability to meet the needs of modern electronic devices that require flexibility, lightweight design, and space-saving solutions. Flexible PCBs offer advantages such as bendability, reduced weight, and enhanced durability compared to rigid PCBs. They are essential for applications in wearable technology, foldable smartphones, and automotive electronics where compact and adaptable designs are crucial. This trend is escalated by advancements in materials and manufacturing processes that enable the production of high-performance flexible PCB assemblies tailored to diverse industry demands.

The CAGR for the North America printed circuit board PCB assembly market will be promising during the 2024 to 2032 timeframe. These include a robust expansion in industries such as aerospace, defense, automotive, and healthcare, all of which heavily rely on advanced electronics. In addition, increasing investments in research and development foster innovation in PCB technologies, amplifying demand. Strict regulatory standards for electronics reliability and safety contribute to the adoption of high-quality PCB assemblies. This combination of factors positions North America as a significant market, thrusting its continued growth and adaptation to evolving industry needs.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast calculation
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Printed circuit board (PCB) assembly market 360° synopsis, 2018 - 2032
• 2.2 Business trends
• 2.3 Regional trends
• 2.4 Type of PCB trends
• 2.5 Component trends
• 2.6 Technology trends
• 2.7 Soldering process trends
• 2.8 Volume trends
• 2.9 Assembly trends
• 2.10 Vertical trends

Chapter 3 Printed Circuit Board (PCB) Assembly Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Vendor matrix
• 3.3 Profit margin analysis
• 3.4 Technology & innovation landscape
• 3.5 Patent analysis
• 3.6 Key news and initiatives
  • 3.6.1 Partnership/Collaboration
  • 3.6.2 Merger/Acquisition
  • 3.6.3 Investment
  • 3.6.4 Product launch & innovation
• 3.7 Regulatory landscape
• 3.8 Impact forces
  • 3.8.1 Growth drivers
    • 3.8.1.1 Increased demand for electronic devices
    • 3.8.1.2 Rise of the Internet of Things (IoT)
    • 3.8.1.3 Increasing use of PCBs in vehicle electronics for safety, connectivity, and automation
    • 3.8.1.4 Rising demand for smartphones, tablets, wearables, and smart home devices
    • 3.8.1.5 Expansion of the aerospace and defense industry
  • 3.8.2 Industry pitfalls & challenges
    • 3.8.2.1 Increasing complexity of PCBs
    • 3.8.2.2 Quality Control and Testing
• 3.9 Growth potential analysis
• 3.10 Porter's analysis
• 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2022

• 4.1 Introduction
• 4.2 Company market share, 2022
• 4.3 Competitive analysis of major market players, 2022
  • 4.3.1 Benchmark Electronics, Inc
  • 4.3.2 Eurocircuits
  • 4.3.3 PCBWay
  • 4.3.4 Seeed Technology Co., Ltd.
  • 4.3.5 Tempo
  • 4.3.6 Vexos
  • 4.3.7 WellPCB Technology Co., Ltd.
• 4.4 Competitive positioning matrix, 2022
• 4.5 Strategic outlook matrix, 2022

Chapter 5 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Type of PCB (USD Million)

• 5.1 Key trends, by type of PCB
• 5.2 Rigid PCB
• 5.3 Flexible PCB
• 5.4 Metal core PCB

Chapter 6 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Component (USD Million)

• 6.1 Key trends, by component
  • 6.1.1 Active
    • 6.1.1.1 Resistors
    • 6.1.1.2 Capacitors
    • 6.1.1.3 Inductors
  • 6.1.2 Passive
    • 6.1.2.1 Integrated Circuits (ICS)
    • 6.1.2.2 Microprocessors
    • 6.1.2.3 Microcontrollers

Chapter 7 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Technology (USD Million)

• 7.1 Key trends, by technology
• 7.2 Surface mount assembly (SMT)
• 7.3 Plated through-hole technology (PTH)
• 7.4 Electro-mechanical assembly
• 7.5 Mixed technology (SMT / Through hole)

Chapter 8 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Soldering Process (USD Million)

• 8.1 Key trends, by soldering process
• 8.2 Wave soldering
• 8.3 Manual soldering
• 8.4 Reflow soldering

Chapter 9 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Volume (USD Million)

• 9.1 Key trends, by type of PCB
• 9.2 Low (1-100 units)
• 9.3 Medium (100-10,000 Units)
• 9.4 High (More than 10,000 Units)

Chapter 10 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Assembly (USD Million)

• 10.1 Key trends, by assembly
• 10.2 In-House
• 10.3 Outsourced/ Contract

Chapter 11 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Vertical (USD Million)

• 11.1 Key trends, by vertical
• 11.2 Consumer electronics
• 11.3 Automotive
• 11.4 Healthcare
• 11.5 IT & telecom
• 11.6 Industrial
• 11.7 Others

Chapter 12 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Region (USD Million)

• 12.1 Key trends, by region
• 12.2 North America
  • 12.2.1 U.S.
  • 12.2.2 Canada
• 12.3 Europe
  • 12.3.1 UK
  • 12.3.2 Germany
  • 12.3.3 France
  • 12.3.4 Italy
  • 12.3.5 Russia
  • 12.3.6 Rest of Europe
• 12.4 Asia Pacific
  • 12.4.1 China
  • 12.4.2 India
  • 12.4.3 Japan
  • 12.4.4 South Korea
  • 12.4.5 Taiwan
  • 12.4.6 Thailand
  • 12.4.7 Rest of Asia Pacific
• 12.5 Latin America
  • 12.5.1 Brazil
  • 12.5.2 Mexico
  • 12.5.3 GCC
  • 12.5.4 Rest of Latin America
• 12.6 MEA
  • 12.6.1 Saudi Arabia
  • 12.6.2 UAE
  • 12.6.3 South Africa
  • 12.6.4 Rest of MEA

Chapter 13 Company Profiles

• 13.1 Alfa Electronics
• 13.2 ALLPCB.com
• 13.3 Altek Electronics, Inc.
• 13.4 Benchmark Electronics, Inc
• 13.5 Bittele Electronics Inc.
• 13.6 Clarydon Electronic Services Limited
• 13.7 Eurocircuits
• 13.8 Jayshree Instruments Pvt. Ltd
• 13.9 Miracle Electronics Devices Pvt Ltd
• 13.10 PCB Assembly Express, INC
• 13.11 PCB Power Market
• 13.12 PCB Unlimited.
• 13.13 PCBGOGO.
• 13.14 PCBWay
• 13.15 Podrain Electronics
• 13.16 RAYMING TECHNOLOGY
• 13.17 Seeed Technology Co.,Ltd.
• 13.18 Tempo
• 13.19 Vexos
• 13.20 Visual Communications Company, LLC
• 13.21 WellPCB Technology Co., Ltd.