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市场调查报告书
商品编码
1535684

被动和互连电子元件市场 - 按类型(被动、互连)、按应用(消费电子、汽车、医疗保健、IT 和电信、工业、航太和国防)和预测,2024 年至 2032 年

Passive and Interconnecting Electronic Components Market - By Type (Passive, Interconnecting), By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3个工作天内

价格
简介目录

由于物联网 (IoT) 和智慧型装置的激增,2024 年至 2032 年全球被动和互连电子元件市场的复合年增长率将超过 5%。根据国际数据公司 (IDC) 的报告,到 2025 年,全球连网物联网设备数量将超过 416 亿台,高于 2021 年的 309 亿台,年增长率为 8.6%。随着这些设备的普及,对确保可靠连接、能源效率和讯号完整性的先进组件的需求不断增加。被动互连电子元件支援复杂网路并增强智慧型设备的效能。物联网应用对无缝运作和效率的需求有利于产品需求。

此外,消费性电子产品的激增、汽车的进步以及电信基础设施的扩张正在推动市场成长。小型化和增强性能的推动正在导致组件设计和材料的创新。

整个被动和互连电子元件市场根据类型、应用和地区进行分组。

由于先进医疗设备和电子健康监测系统的日益集成,医疗保健领域将在预测期内大幅扩张。被动和互连电子元件对于确保诊断工具、成像设备和穿戴式健康监视器等医疗设备的准确资料传输、可靠运作和强大连接至关重要。随着医疗保健技术的进步,对支援高精度和稳定性的组件的需求不断增长,从而促进了产品的采用。

由于电子系统的复杂性不断增加以及各种应用之间对可靠连接的需求,到 2032 年,互连电子元件领域将获得显着的吸引力。随着电子产品变得越来越复杂,对确保稳定、高效的资料传输的高效能互连解决方案的需求不断增加。技术的进步需要增强讯号完整性和最小化干扰,这使得互连组件对于维持现代电子系统的性能至关重要。

由于对技术创新和先进製造的高度重视,北美被动和互连电子元件市场在 2024 年至 2032 年间将录得显着的复合年增长率。高科技产业的激增和智慧基础设施项目的扩展正在推动对可靠电子元件的需求。此外,对研发的关注,加上强大的电子製造业,也支持了这些组件的采用。该地区对技术和基础设施的策略性投资促进了对高品质电子元件的持续需求。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 消费性电子产业快速扩张
      • 对先进汽车电子产品的需求不断增长
      • 物联网 (IoT) 的兴起
      • 再生能源解决方案的普及
      • 不断发展的工业自动化
    • 产业陷阱与挑战
      • 原料成本高
      • 环境和永续发展议题
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按类型,2021-2032 年

  • 主要趋势
  • 被动的
    • 电阻器
    • 电容器
    • 电感器
    • 变形金刚
    • 其他的
  • 互连
    • 印刷电路板
    • 连接器
    • 开关和继电器
    • 其他的

第 6 章:市场估计与预测:按应用划分,2021-2032 年

  • 主要趋势
  • 消费性电子产品
  • 汽车
  • 卫生保健
  • 资讯科技与电信
  • 工业的
  • 航太与国防
  • 其他的

第 7 章:市场估计与预测:按地区,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 南非
    • 沙乌地阿拉伯
    • MEA 的其余部分

第 8 章:公司简介

  • Ametek Inc.
  • Amphenol Corporation
  • AVX Corporation
  • Fenghua (HK) Electronics Ltd.
  • Fujitsu Component Limited
  • Hirose Electric Co. Ltd
  • Hosiden Corporation
  • KEMET Corporation
  • Molex Incorporated
  • Murata Manufacturing Co., Ltd.
  • Nichicon Corporation
  • Panasonic Corporation
  • Rohm Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • Taiyo Yuden Co., Ltd.
  • TDK Corporation
  • TE Connectivity Ltd.
  • Toyo Connectors
  • TT Electronics PLC
  • United Chemi-Con
  • Vishay Intertechnology, Inc.
  • Walsin Technology Corporation
  • Yageo Corporation
简介目录
Product Code: 9848

Global Passive and Interconnecting Electronic Components Market will show over 5% CAGR from 2024 to 2032, attributable to the surge on the Internet of Things (IoT) and smart devices. According to International Data Corporation (IDC) reports, there will be over 41.6 billion connected IoT devices globally by 2025, up from 30.9 billion in 2021, indicating a robust growth rate of 8.6% annually. As these devices become prevalent, there is a heightened need for advanced components that ensure reliable connectivity, energy efficiency, and signal integrity. The passive and interconnecting electronic components support complex networks and enhance the performance of smart devices. The need for seamless operation and efficiency of IoT applications is favoring the product demand.

Moreover, the proliferation of consumer electronics, automotive advancements, and the expansion of telecommunications infrastructure are propelling market growth. The push towards miniaturization and enhanced performance is leading to innovations in component design and materials.

The overall passive and interconnecting electronic components market is grouped based on type, application, and region.

The healthcare segment will expand significantly during the forecast period, because of the increasing integration of advanced medical devices and electronic health monitoring systems. Passive & interconnecting electronic components are crucial for ensuring accurate data transmission, reliable operation, and robust connectivity in medical devices such as diagnostic tools, imaging equipment, and wearable health monitors. As healthcare technology advances, there is a growing need for components that support high precision and stability, bolstering the product adoption.

The interconnecting electronic component segment will gain notable traction through 2032, owing to the increasing complexity of electronic systems and the need for reliable connections across various applications. As electronics become more sophisticated, the demand for high-performance interconnect solutions that ensure stable and efficient data transfer rises. The advancements in technology that require enhanced signal integrity and minimized interference, make interconnecting components essential for maintaining the performance of modern electronic systems.

North America passive and interconnecting electronic components market will record a remarkable CAGR between 2024 and 2032, because of the strong emphasis on technological innovation and advanced manufacturing. The proliferation of high-tech industries and the expansion of smart infrastructure projects are driving the need for reliable electronic components. Additionally, the focus on R&D, coupled with a robust electronics manufacturing sector, supports the adoption of these components. The region's strategic investments in technology and infrastructure contribute to a sustained demand for high-quality electronic components.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data Sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Rapid expansion of the consumer electronics industry
      • 3.8.1.2 Increasing demand for advanced automotive electronics
      • 3.8.1.3 Rise of the internet of things (IoT)
      • 3.8.1.4 Proliferation of renewable energy solutions
      • 3.8.1.5 Growing industrial automation
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High raw material costs
      • 3.8.2.2 Environmental and sustainability concerns
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Billion and Units)

  • 5.1 Key trends
  • 5.2 Passive
    • 5.2.1 Resistors
    • 5.2.2 Capacitors
    • 5.2.3 Inductors
    • 5.2.4 Transformers
    • 5.2.5 Others
  • 5.3 Interconnecting
    • 5.3.1 PCB
    • 5.3.2 Connectors
    • 5.3.3 Switches & relays
    • 5.3.4 Others

Chapter 6 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion and Units)

  • 6.1 Key trends
  • 6.2 Consumer electronics
  • 6.3 Automotive
  • 6.4 Healthcare
  • 6.5 IT & telecom
  • 6.6 Industrial
  • 6.7 Aerospace & defense
  • 6.8 Others

Chapter 7 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion and Units)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 South Africa
    • 7.6.3 Saudi Arabia
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Ametek Inc.
  • 8.2 Amphenol Corporation
  • 8.3 AVX Corporation
  • 8.4 Fenghua (HK) Electronics Ltd.
  • 8.5 Fujitsu Component Limited
  • 8.6 Hirose Electric Co. Ltd
  • 8.7 Hosiden Corporation
  • 8.8 KEMET Corporation
  • 8.9 Molex Incorporated
  • 8.10 Murata Manufacturing Co., Ltd.
  • 8.11 Nichicon Corporation
  • 8.12 Panasonic Corporation
  • 8.13 Rohm Co., Ltd.
  • 8.14 Samsung Electro-Mechanics Co., Ltd.
  • 8.15 Taiyo Yuden Co., Ltd.
  • 8.16 TDK Corporation
  • 8.17 TE Connectivity Ltd.
  • 8.18 Toyo Connectors
  • 8.19 TT Electronics PLC
  • 8.20 United Chemi-Con
  • 8.21 Vishay Intertechnology, Inc.
  • 8.22 Walsin Technology Corporation
  • 8.23 Yageo Corporation