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市场调查报告书
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1535798

半导体记忆体市场,按类型(随机存取记忆体(RAM、唯读记忆体(ROM)))、按应用(航太与国防、汽车、消费性电子、工业、医疗、电信)和预测,2024 - 2032 年

Semiconductor Memory Market, By Type (Random Access Memory (RAM, Read Only Memory (ROM))), By Application (Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical, Telecommunications) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3个工作天内

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简介目录

在该领域广泛研究和开发的推动下,2024 年至 2032 年间,全球半导体记忆体市场的复合年增长率将超过 10%。记忆体技术的进步,例如高密度 DRAM、NAND 快闪记忆体和新兴非挥发性记忆体解决方案的开发,正在推动市场向前发展。随着工业和消费性电子产品越来越需要更快、更有效率和更高容量的记忆体解决方案,研发工作的重点是提高效能、降低功耗和提高储存密度。例如,2024年3月,研究人员创造了一种新的製造技术,可以在低温下生产高品质的氧化膜和精确的图案,从而促进了非挥发性电阻式随机存取记忆体的发展。

记忆体架构和材料的创新,以及记忆体与处理单元的集成,正在满足从行动装置到资料中心和人工智慧等应用的需求。此外,3D 堆迭和神经形态运算等更先进储存技术的发展正在推动进一步成长。随着研究不断发展并解决新出现的挑战,半导体记忆体市场必将扩大,支援广泛的高科技应用和产业。

整个半导体记忆体产业根据类型、应用和地区进行分类。

根据类型,ROM 领域的半导体记忆体市场收入从 2024 年到 2032 年将实现令人称讚的复合年增长率。随着技术的进步,由于连接设备的激增以及对安全、持久性储存解决方案的需求,对可靠和大容量 ROM 的需求不断增长。 ROM 技术的创新(例如改进的快闪记忆体和 EEPROM)正在提高效能和储存密度。对 ROM 的需求增加,加上不断的进步,大大促进了半导体记忆体市场的扩张。

在应用方面,消费性电子领域将在2024年至2032年显着成长。加剧。 DRAM 和 NAND 快闪记忆体等半导体记忆体对于提高装置速度、容量和整体功能至关重要。这些记忆体类型的创新支援现代应用程式不断增长的资料需求,包括游戏、串流媒体和多任务处理。此外,物联网设备和穿戴式技术的激增进一步刺激了市场需求。随着消费性电子产品不断发展,半导体记忆体市场正在不断扩大以满足这些动态需求。

2024年至2032年,欧洲半导体记忆体市场将呈现显着的复合年增长率。设备等创新。这些领域对资料储存和处理能力的需求不断增长,推动了对先进半导体记忆体(包括 DRAM 和 NAND 快闪记忆体)的需求。此外,欧洲对研发的重视以及对半导体製造基础设施的投资进一步推动了市场成长,使该地区成为全球半导体储存领域的关键参与者。

目录

第 1 章:方法与范围

第 2 章:执行摘要

第 3 章:产业洞察

  • 产业生态系统分析
  • 供应商矩阵
  • 利润率分析
  • 技术与创新格局
  • 专利分析
  • 重要新闻和倡议
  • 监管环境
  • 衝击力
    • 成长动力
      • 资料中心和云端运算的扩展
      • 游戏和娱乐应用中不断增长的记忆体需求
      • 5G 和物联网设备的渗透率不断上升
      • 先进汽车应用对半导体记忆体的需求不断增长
      • 消费性电子产品的需求不断增加
    • 产业陷阱与挑战
      • 生产成本高
      • 环境问题
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析

第 4 章:竞争格局

  • 介绍
  • 公司市占率分析
  • 竞争定位矩阵
  • 战略展望矩阵

第 5 章:市场估计与预测:按类型,2021-2032 年

  • 主要趋势
  • 随机存取记忆体 (RAM)
    • 静态随机存取记忆体(SRAM)
    • 同步动态随机存取记忆体 (SDRAM)
    • 磁阻随机存取记忆体 (MRAM)
    • 动态随机存取记忆体 (DRAM)
  • 唯读记忆体(ROM)
    • 电可擦除可程式唯读记忆体 (EEROM)
    • 可擦除可程式唯读记忆体 (EPROM)
    • 可程式唯读记忆体 (PROM)
    • 快闪记忆体

第 6 章:市场估计与预测:按应用划分,2021-2032 年

  • 主要趋势
  • 航太与国防
  • 汽车
  • 消费性电子产品
  • 工业的
  • 医疗的
  • 电信
  • 其他的

第 7 章:市场估计与预测:按地区,2021-2032 年

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 欧洲其他地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 亚太地区其他地区
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地区
  • MEA
    • 阿联酋
    • 南非
    • 沙乌地阿拉伯
    • MEA 的其余部分

第 8 章:公司简介

  • Ever spin Technologies, Inc.
  • Fujitsu Limited
  • GlobalFoundries
  • Infineon Technologies AG
  • Integrated Silicon Solution Inc.
  • Intel Corporation
  • KIOXIA Corporation
  • Macronix International Co., Ltd
  • Microchip Technology, Inc.
  • Micron Technology, Inc.
  • Nanya Technology Corporation
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK HYNIX INC
  • Taiwan Semiconductor Manufacturing Company
  • Texas Instruments Incorporated
  • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • Western Digital Corporation
  • Winbond Electronics Corporation
简介目录
Product Code: 2548

Global Semiconductor Memory Market will witness over 10% CAGR between 2024 and 2032, driven by extensive research and development in the field. Advances in memory technology, such as the development of high-density DRAM, NAND flash, and emerging non-volatile memory solutions, are propelling the market forward. As industries and consumer electronics increasingly demand faster, more efficient, and higher-capacity memory solutions, R&D efforts are focused on enhancing performance, reducing power consumption, and increasing storage density. For instance, in March 2024, researchers created a new manufacturing technology that allowed for the production of high-quality oxide films and precise patterning at low temperatures, leading to the development of non-volatile resistive random access memory.

Innovations in memory architecture and materials, alongside the integration of memory with processing units, are meeting the needs of applications ranging from mobile devices to data centers and artificial intelligence. Additionally, the push towards more advanced memory technologies, like 3D stacking and neuromorphic computing, is driving further growth. As research continues to evolve and address emerging challenges, the semiconductor memory market is set to expand, supporting a wide range of high-tech applications and industries.

The overall Semiconductor Memory Industry is classified based on the type, application, and region.

Based on type, the semiconductor memory market revenue from the ROM segment will register a commendable CAGR from 2024 to 2032. ROM is essential for storing firmware and system software in consumer electronics, automotive systems, and industrial equipment. As technology advances, the need for reliable and high-capacity ROM is growing, driven by the proliferation of connected devices and the requirement for secure, persistent storage solutions. Innovations in ROM technology, such as improved flash memory and EEPROM, are enhancing performance and storage density. This heightened demand for ROM, coupled with ongoing advancements, is significantly contributing to the expansion of the semiconductor memory market.

In terms of application, the consumer electronics segment will witness a noteworthy growth from 2024 to 2032. As devices such as smartphones, tablets, laptops, and smart home appliances become increasingly sophisticated, the need for high-performance memory solutions intensifies. Semiconductor memories like DRAM and NAND flash are crucial for enhancing device speed, capacity, and overall functionality. Innovations in these memory types support the growing data needs of modern applications, including gaming, streaming, and multitasking. Additionally, the proliferation of IoT devices and wearable technology further fuels market demand. As consumer electronics continue to evolve, the semiconductor memory market is expanding to meet these dynamic requirements.

Europe semiconductor memory market will exhibit a notable CAGR from 2024 to 2032. European industries, including automotive, telecommunications, and consumer electronics, are driving demand for high-performance memory solutions to support innovations such as autonomous vehicles, 5G networks, and smart devices. The increasing need for data storage and processing capabilities in these sectors is boosting the demand for advanced semiconductor memory, including DRAM and NAND flash. Additionally, Europe's focus on research and development, alongside investments in semiconductor manufacturing infrastructure, further fuels market growth, positioning the region as a key player in the global semiconductor memory landscape.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Expansion of data centers and cloud computing
      • 3.8.1.2 Growing memory requirements in gaming & entertainment applications
      • 3.8.1.3 Rising penetration of 5G and IoT devices
      • 3.8.1.4 Growing demand for semiconductor memory in advanced automotive applications
      • 3.8.1.5 Increasing demand from consumer electronics products
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High production costs
      • 3.8.2.2 Environmental Concerns
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million and Units)

  • 5.1 Key trends
  • 5.2 Random access memory (RAM)
    • 5.2.1 Static random access memory (SRAM)
    • 5.2.2 Synchronous dynamic random access memory (SDRAM)
    • 5.2.3 Magneto-resistive random access memory (MRAM)
    • 5.2.4 Dynamic random access memory (DRAM)
  • 5.3 Read only memory (ROM)
    • 5.3.1 Electrically erasable programmable read only memory (EEROM)
    • 5.3.2 Erasable programmable read only memory (EPROM)
    • 5.3.3 Programmable read only memory (PROM)
    • 5.3.4 Flash memory

Chapter 6 Market Estimates & Forecast, By Application, 2021-2032 (USD Million and Units)

  • 6.1 Key trends
  • 6.2 Aerospace & defense
  • 6.3 Automotive
  • 6.4 Consumer electronics
  • 6.5 Industrial
  • 6.6 Medical
  • 6.7 Telecommunications
  • 6.8 Others

Chapter 7 Market Estimates & Forecast, By Region, 2021-2032 (USD Million and Units)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 South Africa
    • 7.6.3 Saudi Arabia
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Ever spin Technologies, Inc.
  • 8.2 Fujitsu Limited
  • 8.3 GlobalFoundries
  • 8.4 Infineon Technologies AG
  • 8.5 Integrated Silicon Solution Inc.
  • 8.6 Intel Corporation
  • 8.7 KIOXIA Corporation
  • 8.8 Macronix International Co., Ltd
  • 8.9 Microchip Technology, Inc.
  • 8.10 Micron Technology, Inc.
  • 8.11 Nanya Technology Corporation
  • 8.12 NXP Semiconductors N.V.
  • 8.13 Renesas Electronics Corporation
  • 8.14 Samsung Electronics Co., Ltd.
  • 8.15 SK HYNIX INC
  • 8.16 Taiwan Semiconductor Manufacturing Company
  • 8.17 Texas Instruments Incorporated
  • 8.18 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • 8.19 Western Digital Corporation
  • 8.20 Winbond Electronics Corporation